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Welcome to Evatec- The Thin Film Powerhouse
Welcome to the “Internet of Things” ( IoT), an emerging world of amazing connectivity between man and machine. From 5G mobile network solutions and the new generation of intelligent HB LED based lighting in our automobiles to Gesture Recognition technology and EMI shielding for our smart phones, our thin film deposition systems enable manufacture of the worlds highest performance optical, optoelectronic and semiconductor devices. Our Advanced Process Control ( APC) technologies enables new level of thin film performance and production yield.
Following the acquisition of Oerlikon Systems in February 2015 we offer complete process solutions in our core markets of Advanced Packaging, Power Devices, MEMS, Optoelectronics, Wireless Technologies and Photonics. Read more about process technologies, and our range of deposition platforms to see how we use our know how across optical , optoelectronics and semiconductor markets to enhance throughput and drive down cost of ownership. “In-situ” capabilities including optical pyrometry, plasma emission monitoring, film stress , electrical property and broadband optical monitoring deliver optimum film performance and production yields for next generation devices.

主要商品與服務

We deliver thin film process solutions in our core markets using competences in evaporation, sputter, PECVD and etch technologies.
1. ADVANCED PACKAGING
Our UBM and RDL processes in Flip Chip, Wafer Level Packaging (WLP) and Fan- in/out Technologies running on CLUSTERLINE® 300 II and HEXAGON platforms deliver outstanding cost of ownership. Panel processing solutions on our new PNL Platform for FOPLP and advanced PCB manufacturing deliver high yield production solutions for substrate sizes up to 550x550mm, whilst SOLARIS is the perfect platform for wafer level EMI shielding processes.
2. PHOTONICS
From AR coatings to Multibandpass filters, DBRs and TCOs, Evatec solutions using evaporation or sputter on BAK, MSP, CLUSTERLINE® RAD and SOLARIS platforms deliver precision layers for high performance optical interference coatings. Core competences in Advanced Process Control technologies using Broadband Optical Monitoring deliver new levels of quality and yield.
3. MEMS
Know how in deposition processes for piezoelectric materials, aligned magnetics and dielectrics on a wide range of Evatec platforms according to your production needs enable technologies like Thin Film Heads, on chip inductors, sensors and actuators . Evatec's Advanced Process Control technologies enable new levels of yield in advanced manufacturing approaches including Wafer Level Optics and Microfluidics.
4. OPTOELECTRONICS
Evatec delivers “damage free” thin film processes for LED technologies including GaN on Sapphire, GaN on Si and GaN on GaN . Ask us about high throughput deposition of current spreading layers like ITO, metal contacts and high performance reflectors (DBRs) on platforms like CLUSTERLINE® RAD for the new micro LED technologies too.
5. POWER DEVICES
Our proven portfolio of Front and Backside metallisation and precision “lift off” processes enable Bipolar, MOSFET, IGBT and Wide Band Gap (WBG) technologies. Capabilities including thin wafer processing, in situ stress control and in situ ohmic anneal deliver enhanced yields and reduced process times.
6. WIRELESS COMMUNICATION
Evatec’s comprehensive portfolio of deposition processes for metals, contacts and electrodes, piezoelectric materials and dielectrics enable device technologies including HBT on GaAs, HEMT Technology on GaN, IR devices and RF Filters ( SAW & BAW)

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