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訊憶科技股份有限公司

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AMB Technology Co., Ltd., founded in Taiwan in Jun 2007. AMB Technology's mission is to create innovative Wafer Level Chip Scale Packaging (CSP) concepts, methods and products for manufacturing, licensing and distribution.

AMB has developed innovative Redistribution Layer Technology which with unmatched benefits for Flash Memory, DRAM Modules and other applications; and enables revolutionary TSV Technology which creates multiple benefits to the product, such likes smaller form factor, better package electrical performance, flexibility to Multi-Chip Packages or die stacking; all those benefits can be achieved under low process cost and high efficiency, various package requirements can be met for now and future.

AMB's management policies are Integrity, Innovation and Services, our teams are continuously providing innovative technologies and keep improving our manufacture ability, we are entrusted to provide reliable solution to the industrial.

Milestone
. 2007 Jun AMB Technology founded
. 2008 Nov TSV/RDL technology applied multiple country patent
. 2008 Sep ISO 9001 certification
. 2009 Dec ISO 14001/OHSAS 18001 certification
. 2010 Mar Smart Card Module Ramp-up
. 2011 Jan Lift-Off process set up and start BIZ

主要商品與服務

1.智能卡模組
2.付費晶片貼卡
3.LED照明模組
4.觸碰面板模組
5.金凸塊產品

福利制度

◆ 獎金/禮品類
1.三節獎金/禮品
◆ 請 / 休假制度
1.特休/年假
2.陪產假
3.家庭照顧假
4.女性同仁生理假
5.女性同仁育嬰假
◆ 其他
1.員工停車位
2.健康檢查
3.免費供餐
◆ 補助類
1.結婚禮金
2.生育津貼
3.環境津貼

經營理念

未填寫

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