求職服務專線
台北 02-2912-6104 轉 2
   02-7703-3104 轉 2
意見回饋
廠商求才專線
台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

Senior or Staff Engineer – SIP (System in Packaging) Packaging (3001152)

  • 全職

Qualcomm Packaging group is responsible for developing and enabling new packaging technologies for high volume manufacturing. The packaging team is seeking an experienced professional who has worked with various packaging technologies Flipchip, Wirebond, CSP, WLP, PoP, etc. SIP and/or experience in automotive industry will be a plus.

Responsibilities:
- Responsible from exploring, defining business justification, development and HVM deployment of SiP (System in Package) Module packaging technologies.
- Responsible for defining package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable SIP/Module products.
- Interface with OSATs and substrate suppliers in developing technology related to SiP product requirements. Align with internal product teams.
- Work with internal design team and drive DFM methodology for new technologies.
- Work with internal design, modeling and procurement teams to implement technically best and lowest cost SIP options.
- Technical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to management.

All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.

工作條件

  • 接受身份: 上班族
  • 工作經歷: 二年以上
  • 學歷要求: 大學以上
  • 語文條件: 英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通
  • 其它條件: - Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
    - 2+ years Hardware Engineering experience or related work experience.
    - years Hardware Engineering experience or related work experience.
    - years experience with semiconductor packaging, SIP/Module packaging, manufacturing process experience in - Wafer bumping, wafer handling, flipchip, wirebond, Underfill, Molding, SMT and other semiconductor packaging technologies.
    - years experience working , working with OSATs, suppliers, internal design and product teams.
    - years experience with in new product development in electronic packaging, exposure to - design and characterization techniques, DFM methodology, design of experiments and statistical data analysis.

福利制度

Along with quality, life-enhancing programs. When we say the benefits of working at Qualcomm are many, you’ll see we mean that quite literally. Just take a look…

The benefits listed below apply to the employees of Qualcomm Taiwan Corporation & Qualcomm Communication Technologies Limited located in Taiwan

National Health and Labor Insurance
National Retirement Scheme
Public Holidays
Paid Maternity Leave
Paid Paternity Leave
Annual Leave
Education Assistance

更新日期:2021-02-24

應徵方式

  • 職務聯絡人: HR
  • 聯絡E-Mail: (請利用104履歷表應徵此工作) 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽
  • 它: Please apply via www.qualcomm.com/careers and refer to req number 3001152.

應徵分析

兩週內6-10人應徵
經歷分佈
新鮮人0%
1~3年0%
3~5年14%
5~10年29%
10年以上57%
學歷分佈
碩士及以上57%
大學43%
專科0%
高中0%
高中以下0%
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