Qualcomm Semiconductor Corporation_高通半導體有限公司誠徵 Packaging Development Engineer (3001276)

求職服務專線
台北 02-2912-6104 轉 2
02-7703-3104 轉 2

廠商求才專線
台北 02-2912-6104
02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1

The position is focused on working with leading semiconductor wafer foundries and IC package assembly factories to develop innovative mechanical testing methodologies in support of Qualcomms advanced packaging technologies. This engineer will be responsible for thermal and mechanical materials characterization (ex DMA, TMA, shadow moire, etc), mechanical test development, and methodologies to validate process and design improvements of IC package materials and interconnect technologies. The candidate is expected to interact closely with suppliers and internal process/design/packaging/quality/PM teams to deliver high quality and novel testing solutions for Qualcomm products.

職務類別：半導體工程師、IC封裝／測試工程師
上班地點：新竹市(依照公司規定分派)
上班時段：日班
休假制度：依公司規定
工作待遇：待遇面議查看市場薪資行情
需求人數： 1人
是否出差：無需出差
管理責任：不需負擔管理責任
可上班日：不限

接受身份：上班族
工作經歷：二年以上
學歷要求：大學以上
語文條件：英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通
其它條件： Minimum Qualifications:
- Minimum of 5+ years work experience with emphasis on mechanical and/or materials testing
- Development experience with advanced IC package applications in areas such as: material selection, assembly process development, product qualification and reliability, IC package characterization, interconnect quality and reliability, and/or failure analysis
- Experience using common industry thermal-mechanical test methodologies such as: DMA, TMA, Shadow Moire, Bump shear/pull, DIC, Nano-identation, and/or Universal mechanical testers (ex. Instron)
- Ability to perform package structural analysis via techniques such as optical/digital microscopy and/or SEM

Preferred Qualifications:
- Test methodology development to validate process improvements, structural interactions and robustness
- Materials development for new technology introduction into high volume manufacturing
- Knowledge of ASTM, MIL-STD, JEDEC, IPC, ISO, AEC or relevant industry specification related to IC packaging and interconnect technology - Experienced with JMP, ReliaSoft, or equivalent statistical analysis software
- Excellent analytical and project management skills with ability to manage external manufacturing resources
- Exceptional communication skills and experienced in publishing technical reports to broad audiences - Able to work flexible hours with occasional domestic/international travel (<10%)
- Fluent in Mandarin and functional in English

Education Qualifications:
Required: Bachelor's, Materials Science and/or Mechanical Engineering
Preferred: Master's, Materials Science and/or Mechanical Engineering

Along with quality, life-enhancing programs. When we say the benefits of working at Qualcomm are many, you’ll see we mean that quite literally. Just take a look…

The benefits listed below apply to the employees of Qualcomm Taiwan Corporation & Qualcomm Communication Technologies Limited located in Taiwan

National Health and Labor Insurance
National Retirement Scheme
Public Holidays
Paid Maternity Leave
Paid Paternity Leave
Annual Leave
Education Assistance

職務聯絡人： HR
聯絡E-Mail： (請利用104履歷表應徵此工作) 我要應徵
電洽：不接受電洽
親洽：不接受親洽
其它： Please apply via www.qualcomm.com/careers and refer to req number 3001276.

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經歷分佈

新鮮人		0%
1~3年		0%
3~5年		25%
5~10年		58%
10年以上		17%

學歷分佈

碩士及以上		92%
大學		8%
專科		0%
高中		0%
高中以下		0%

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Packaging Development Engineer (3001276)

Qualcomm Semiconductor Corporation_高通半導體有限公司

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