求職服務專線
台北 02-2912-6104 轉 2
   02-7703-3104 轉 2
意見回饋
廠商求才專線
台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

Principal Package Development Engineer (Intelligent Sensor Focused)

  • 全職

As a member of the Advanced Packaging team, you will manage various aspects of image senor, Lidar and Radar sensor packaging technology development, process improvement, and new product introduction including CSP, BGA and MCP related packages for sensing systems utilized in automotive, consumer, industrial, medical, and mobile applications. You will directly support and contribute to the corporate product and technology roadmaps.

You will interact directly with the corporate business units, design engineering, product engineering, operations, external material suppliers, and external subcontract assembly packaging service providers. In addition to packaging development and new product introduction, you will be responsible for developing analytical techniques for evaluating new package designs and technologies through quantitative and qualitative approaches including statistical analysis, and design of experiments.

工作條件

  • 接受身份: 上班族
  • 工作經歷: 五年以上
  • 學歷要求: 碩士
  • 語文條件: 英文 -- 聽 /中等、說 /中等、讀 /中等、寫 /中等
  • 其它條件: • Master's degree or above in applicable discipline such as Mechanical Engineering, Chemical Engineering, or Materials Science.
    • Minimum of 10 years experience in semiconductor assembly packaging development, process engineering, materials development, and new product introduction.
    • Experience with imager packaging and related sensor packaging preferred.
    • Experience with wafer level CSP, TSV, and multi-chip packaging very desirable.
    • Possess a solid understanding of packaging materials and properties.
    • Experience with thermal and mechanical stress very desirable.
    • Familiarity with AutoCAD and 3D modeling a plus.
    • Proven experience utilizing statistical analysis techniques such as DOE.
    • Understanding of package reliability requirements for consumer, industrial, medical, and automotive applications.
    • Strong project management and problem solving skills needed.
    • Bilingual in English and Mandarin Chinese.

福利制度

Transportation Allowance
Meal Allowance
Car Plan
Annual Leave and 15 days Supplementary Leave
Festival Gift
Group Insurance
Health Insurance
Labor Insurance
Welfare Program

更新日期:2021-02-24

應徵方式

  • 職務聯絡人: Hallie Hsu
  • 聯絡E-Mail: 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽

應徵分析

兩週內6-10人應徵
經歷分佈
新鮮人0%
1~3年0%
3~5年11%
5~10年33%
10年以上56%
學歷分佈
碩士及以上100%
大學0%
專科0%
高中0%
高中以下0%
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