Principal Package Development Engineer (Intelligent Sensor Focused)

As a member of the Advanced Packaging team, you will manage various aspects of image senor, Lidar and Radar sensor packaging technology development, process improvement, and new product introduction including CSP, BGA and MCP related packages for sensing systems utilized in automotive, consumer, industrial, medical, and mobile applications. You will directly support and contribute to the corporate product and technology roadmaps.

You will interact directly with the corporate business units, design engineering, product engineering, operations, external material suppliers, and external subcontract assembly packaging service providers. In addition to packaging development and new product introduction, you will be responsible for developing analytical techniques for evaluating new package designs and technologies through quantitative and qualitative approaches including statistical analysis, and design of experiments.