求職服務專線
台北 02-2912-6104 轉 2
   02-7703-3104 轉 2
意見回饋
廠商求才專線
台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.
Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing.
Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity
Responsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time.
Take on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirements
Drive capability enhancement and cost reduction projects

工作條件

  • 接受身份: 上班族
  • 工作經歷: 八年以上
  • 學歷要求: 大學以上
  • 語文條件: 英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通
  • 工作技能: 協助改善產品良率、產品生產製程規劃及工時估算、新產品封裝導入及封裝良率改善
  • 其它條件: Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemical or Electrical).
    8 years’ experience in IC substrate manufacturing technologies and processes.
    Direct process and operational experience in a substrate manufacturing operations line is required.
    Expertise in ABF substrate interactions with Ball Grid Arrays, flipchip; laminate substrates interactions with die attach, wirebonding, molding, flipchip attach, singulation, packaging materials is required.
    Track record of good achievements managing substrate technical specifications that impact the downstream margins of assembly processing.
    Direct process and operational experience in manufacturing environment
    Experience in component quality interactions with SMT processibility is not a pre-requisite, but will be favourable
    Proven ability to manage and coordinate complex activities across multiple groups including operations, quality, business units, suppliers, marketing, customers.
    Experience with managing activities with packaging subcontractors and driving resolution of manufacturing issues. Demonstrate leadership in working within different internal functional groups to manage issue containment and drive the best path forward.
    Thorough knowledge of problem solving methodologies and failure analysis techniques. Must demonstrate the ability to quickly make assessments of risks and take the necessary steps in managing escalations. Demonstrate good communication skills in problem resolution.
    Have a very good command on spoken and written English
    Fluent in Mandarin
    Willing to travel throughout Asia to support manufacturing locations.

福利制度

1.週休二日。
2.享勞保、健保、團保及商務差旅醫療平安險
3.定期健康檢查。
4.員工旅遊。
5.社團補助
6.員工福委會多項福利活動
7.ESPP (Employee Stock Purchase Program) 員工認購比市價低的股票。
8.選單式員工健康福利制度

更新日期:2020-12-22

應徵方式

  • 職務聯絡人: 徐先生
  • 聯絡E-Mail: (請利用104履歷表應徵此工作) 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽

應徵分析

兩週內6-10人應徵
經歷分佈
新鮮人0%
1~3年0%
3~5年17%
5~10年33%
10年以上50%
學歷分佈
碩士及以上83%
大學17%
專科0%
高中0%
高中以下0%
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