德商儀艾銳思半導體電子有限公司

Tasks and responsibilities: • Equipment Demonstration: Conduct in-depth equipment demonstrations tailored to the specific needs of potential clients. • Technical Training: Train both internal teams and external customers on equipment functionalities and best practices. • Customer Requirement Analysis: Analyse customer requirements for semiconductor packaging and recommend suitable equipment configurations. • Technical support to Sales: Work closely with Sales team and distributors to convert technical requirements into business contracts. • Trade Shows & Conferences: Represent the company at industry events, delivering technical presentations and networking to generate leads. • Close cooperation with customers in case of functional problems and making remote diagnoses. • Diagnosis, parameterization and functional testing of defective machines. • Installation and repair of systems at customer sites. • Product Development Input: Contribute to R&D activities by providing customer feedback and industry requirements for new features and functionalities. • Travel within Taiwan and potentially in Asia (up to approx. 30% of working time). Requirements and qualifications: • Preferred Education: Bachelor’s or master’s degree in Materials Science, electrical engineering, or related field. • Industry Experience: Minimum 5 years of experience in the semiconductor packaging capital equipment industry or Semiconductor packaging manufacturing. • Strong understanding of advanced semiconductor packaging technologies. • Proven track record in a similar role involving both technical application support. Role in New Product Introduction is a plus. • Experience with wafer bonding and debond processes is a plus. • Analytical Skills: Strong analytical skills, with the ability to interpret complex data and reports. • Excellent communication skills, both written and verbal. • Languages: Traditional Mandarin as mother tongue, fluent in English. What you can expect: • An interesting job with a versatile range of tasks in a dynamic high-tech company. • Flat hierarchies and short communication channels. • Individual educational opportunities.