台北 02-2912-6104 轉 2
   02-7703-3104 轉 2
台北 02-2912-6104
台中 04-3700-6104
上海 86-21-50277104 轉 1

The Advanced Packaging Technology Development group supports Micron with packaging solutions for wafer and die level forms. As a Realtime Defect Analysis (RDA) Engineer in the Advanced Packaging Technology Development department, you will be responsible for managing defect analysis within the rapidly evolving area of advanced IC packaging and next generation 3D Interconnect (3DI) projects. The scope of work involves many emerging and existing forms of inspection and metrology, for both package level and wafer level forms, and requires exceptional analytical and statistical skills. This RDA development role will include next node defect analysis, manual and automated defect classification setup, analyzing results for efficacy, and driving these solutions into the manufacturing environment. Opportunities for expanding process knowledge in other areas other than your area of expertise also exist. You will be a part of the 3DI/Through Silicon Via process team dedicated to vertical stacked memory die products.

Your responsibilities will include, but are not limited to, the following:

Ownership and development of inspection processes to meet roadmap requirements to support technology roadmaps.
Defect analysis, including reporting on engineering experiments, and reporting on baseline defect types and distributions.
Qualification of new methods, such as Automated Defect Classification, with extensive interactions with tool and software suppliers.
Identifying improvement opportunities and novel solutions to roadmap gaps.
Identifying and executing experiments and data collection methods resulting in recommendations for inspection improvements and process improvements.
Utilizing GeRM, MES, CQ, JMP, MS Office and SWR among other MFG and data analysis applications to facilitate SWR execution and data collection for analysis and reporting of experimental results.
Understanding process flow to evaluate failures for potential process interdependencies and analyze gaps in data collected.
Characterizing process and equipment capabilities and implement process control limits to ensure process health.
Developing quality assurance and quality control schemes relating to new equipment and processes.
Delivering documentation for transitioning process to different teams at Micron.
Understanding upstream and downstream processes interactions and ensure that process customers and suppliers to your processes are known and requirements met.
Training and real world use of systematic problem solving (example: Kepner-Tregoe)
Successful candidates for this position will have:

AOI tools (CAMTEK. KLA, ONTO) understanding and patience to develop new BKM recipes
Excellent documentation, organization skills.
The ability to work efficiently independent of direct supervision.
Ability to communicate proposals, concepts and ideas to a varied range of audiences and professional levels.
The ability to prioritize activities and drive them to completion within budget, on time and as defined.
Demonstrated self-motivation to learn process details and the impact of various steps on subsequent steps and overall process and device performance.
The ability to work with others or as an individual contributor in a team environment.
The ability to communicate with engineers and technicians effectively across all areas within and external to the Advanced Packaging team. This includes international sites as well as domestic sites.
Strong understanding of semiconductor manufacturing processes (Diffusion, CVD, Etch, Lithography) and device process flows.
Experience in applied statistics.
Strong data analysis skills and a high level of attention to detail.


  • 接受身份: 上班族、外籍人士、原住民【相關法令】、二度就業
  • 工作經歷: 三年以上
  • 學歷要求: 大學以上
  • 語文條件: 英文 -- 聽 /中等、說 /中等、讀 /中等、寫 /中等
  • 其它條件: Education:

    Masters or Doctorate degree in Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, or related discipline is required. A B.S. degree with 3+ years of industry experience will also be considered.


☆薪資及獎金制度 ☆
1. 12個月基本薪資+2個月年終獎金(需當年度12月31日當日在職員工方能領取)
2. 工程師職位薪資:
(2)輪班工程師NT46000起 (輪班津貼另計)
3. 績效獎金(IPP):按公司營運績效及組織目標成效給與。
4. 即時獎勵(Spot Bonus/Micron Point):發給工作表現卓越之員工。
5. 久任獎勵(Service Award):服務每滿五年之員工,可獲頒特別贈品。
6. 勞工退休金雇主提撥率:8%,優於勞基法規定。
7. 新進員工到職當月即享有特休假(依服務比例按月給予特休),優於勞基法規定。
8. 全薪病假80小時;政府紀念不放假之紀念日給予特別休假,讓同仁有更多的假期安排。
Micron全球人力培訓主要目標是 - 確保每個成員都能夠獲得展現高績效成果所需要的學習資源。Micron提倡標準化的訓練架構,以便根據團隊成員的職位、工作職能、工作角色和執行的特定工作來識別必要和相關的訓練。Micron 的主要訓練架構:
1. 美光核心職能訓練:包含與法規遵循相關且適用於所有 Micron成員的訓練活動。
2. 地區性/廠區核心要求:包含與法規遵循相關、適用於特定地區或廠區之所有成員的訓練活動。
3. 部門核心職能訓練:包含適用於特定部門內所有成員,包含與安全有關以及單位內訓練活動。
4. 特定工作角色的特定訓練:如領導力訓練、接班人計畫。
5. 除了一般的訓練方法,美光也利用多元的學習方式來達到人力發展目標,如:自我學習方案、工作輪調、專案參與等。
1. 健保、勞工保險及免費團體保險(含壽險、意外、健康醫療團體保險)。員工配偶及子女享有免費健康醫療團體保險。
2. 醫務室,具專業護士駐廠並定期提供專科醫師問診。
3. 生日禮券、生育、婚喪賀奠及急難補助。
4. 提供多條路線之交通車搭乘服務。
5. 設有各式公司社團及康樂活動。
6. 設施完善的停車場。
7. 員工餐廳及便利商店。
8. 社團經費補助。
9. 開放式圖書閱覽室以及健身房。
10. 設備完善的電腦教室與訓練教室。
11. 員工宿舍(台中廠)、租屋補助(桃園廠)。

人事部門之雇用平權承辦人負責本政策之執行、解答任何相關問題及查核員工遵守政策之成效狀況。申請過程中如需要協助,請聯繫美光人力資源部 04-25218177(免轉分機) / 03-3272988 ext.3425 。』
Jobseekers are not required to pay fees, deposits or incur debt as part of the recruitment process or for employment with Micron.



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