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台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

Packaging Engineer- Principal Package Design Engineer

  • 全職


What you do at AMD changes everything
At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, Immersive platforms, and the data center.
Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology.
This is an extraordinary opportunity to work in an outstanding company like AMD - Join us!

THE ROLE:
Member of advanced packaging group, focused on establishing design rules for heterogeneous packages with various 2D/2.5D/3D package architectures. Defines test chip/test vehicle strategy to qualify new technology building blocks. Partners with internal and external partners to optimize design and analyze performance vs yield trade-off. Drive technology design rules with ecosystem partners and support package design, SI, PI studies on new packaging concepts to drive advanced packaging technologies to support new AMD products.

THE PERSON:
The candidate should have a proven track record in developing silicon and package design rules with ecosystem partners as well as hands on experience in test chip and substrate design. He/she should have deep expertise in silicon-package co-design on high performance computing applications, as well as excellent oral and written communication skills to communicate ideas with Technology Partners, Colleagues, product architects and AMD management.

KEY RESPONSIBILITIES:
• Design and develop advanced packaging technologies for AMD products
• Define and implement design for manufacturing/design for yield (DFM/DFY) guidelines
• Silicon package design rule owner for advanced packaging programs
• Ability to drive cost and SI/PI assessment based on design
• Test chip, test vehicle design support

PREFERRED EXPERIENCE:
The candidate should have hands on experience with EDA tools such as Cadence, Synopsys, Mentor Graphics. Candidate should have experience with software development and scripting tools such as Python, PERL, SKILL etc. Successful candidate would have a proven track record of defining and implementing DFM/DFY rules. Demonstrated leadership/influencing skills working with cross functional teams as well as with OSAT/foundries partners to establish technology design rules. Statistical data analysis of test data using JMP/JSL, Python experience as well as yield engineering experience is a plus.

ACADEMIC CREDENTIALS:
Master’s in Electrical Engineering, Computer Science and Engineering or equivalent.

LOCATION:
Hsinchu, Taiwan

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law.

工作條件

  • 接受身份: 上班族
  • 工作經歷: 五年以上
  • 學歷要求: 碩士以上
  • 語文條件: 英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通
  • 其它條件: Please submit English CV

福利制度

獎金 / 禮品類
  1.年終獎金
  2.三節禮金/禮品
◆ 保險類
  1.勞保
  2.健保
  3.員工團保
  4.眷屬團保
  5.意外險
  6.職災保險
◆ 休閒類
  1.部門聚餐
◆ 制度類
  1.介紹獎金
  2.順暢的升遷管道
3.退休金、離職金制度
◆ 請 / 休假制度
  1.週休二日
  2.優於法定之特休/年假
  3.優於法定之陪產假
  4.不扣薪病假
  5.員工育嬰假
◆ 補助類
  1.員工停車位或停車補助
2.員工進修補助

更新日期:2021-05-04

應徵方式

  • 職務聯絡人: Ms. Chou
  • 聯絡E-Mail: (請利用104履歷表應徵此工作) 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽
  • 它: AMD website-Req#90664

應徵分析

兩週內6-10人應徵
經歷分佈
新鮮人0%
1~3年0%
3~5年29%
5~10年29%
10年以上43%
學歷分佈
碩士及以上86%
大學14%
專科0%
高中0%
高中以下0%
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