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台北 02-2912-6104 轉 2
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廠商求才專線
台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

Advanced Packaging Development and Integration

  • 全職

What you do at AMD changes everything
At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, Immersive platforms, and the data center.
Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

THE ROLE:
Work with AMD manufacturing partners to develop new advanced packaging technology and integrate new products into high volume manufacturing.

THE PERSON:
The candidate should have a proven track record in developing advanced wafer level packaging technologies at OSAT, Foundry, or Fabless/IDM ecosystem. He/She should have direct experience with developing wafer level process modules such as reconstitution, molding, RDL lithography, Cu-plating, mold grinding, PVD, Si-interposer processing, and singulation. Experience with manufacturing of large chip modules is preferred. He/she should have excellent oral and written communication skills to communicate ideas with technology partners, colleagues, product architects and AMD management. The candidate will be able to coordinate with different teams internal and external to AMD.

KEY RESPONSIBILITIES:
• Develop and productize advanced packaging technologies for AMD products
• Select development partners to bring into AMD supply chain to invest and develop these concepts.
• Work with development partners to assess risk of new package architecture concepts, then diagnose and solve manufacturing yield and reliability issues.
• Partner with Product teams and Manufacturing Engineering to demonstrate reliability and smoothly transition new packaging technologies from concept though NPI.
• Transfer the new product into a high yielding, efficient, high-volume manufacturing environment.

PREFERRED EXPERIENCE:
The candidate should have profound experience of semiconductor packaging, including direct experience with wafer level advanced packaging technologies at a OSAT, Foundry, or a Fabless/IDM ecosystem.

ACADEMIC CREDENTIALS:
Master’s in Solid State Physics, Chemistry, Materials Science, Mechanical Engineering or equivalent.

LOCATION:
Hsinchu, Taiwan

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law.

工作條件

  • 接受身份: 上班族
  • 工作經歷: 十年以上
  • 學歷要求: 碩士以上
  • 語文條件: 英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通
  • 其它條件: 未填寫

福利制度

獎金 / 禮品類
  1.年終獎金
  2.三節禮金/禮品
◆ 保險類
  1.勞保
  2.健保
  3.員工團保
  4.眷屬團保
  5.意外險
  6.職災保險
◆ 休閒類
  1.部門聚餐
◆ 制度類
  1.介紹獎金
  2.順暢的升遷管道
3.退休金、離職金制度
◆ 請 / 休假制度
  1.週休二日
  2.優於法定之特休/年假
  3.優於法定之陪產假
  4.不扣薪病假
  5.員工育嬰假
◆ 補助類
  1.員工停車位或停車補助
2.員工進修補助

更新日期:2021-05-12

應徵方式

  • 職務聯絡人: Shirley Chou
  • 聯絡E-Mail: (請利用104履歷表應徵此工作) 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽
  • 它: AMD official website - Req#82941

應徵分析

兩週內11-30人應徵
經歷分佈
新鮮人0%
1~3年0%
3~5年0%
5~10年25%
10年以上75%
學歷分佈
碩士及以上67%
大學33%
專科0%
高中0%
高中以下0%
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