求職服務專線
台北 02-2912-6104 轉 2
   02-7703-3104 轉 2
意見回饋
廠商求才專線
台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

High Performance Compute Packaging Engineer, Senior to Staff (3024998)

  • 全職

We are looking for a highly motivated packaging engineer capable of leading state-of-the-art Flip Chip technology projects. You will be responsible for packaging development and new product introduction (NPI) of leading-edge package technologies for compute, mobile, IoT and connectivity market and driving that innovation into high volume manufacturing at assembly suppliers. Extensive knowledge and experience in package assembly process, materials, and equipment are required. The position also requires the ability to lead multi-functional teams and solve complex technical problems in working with multiple OSATs. Some international travel will be required.

工作條件

  • 工作經歷: 五年以上
  • 學歷要求: 大學以上
  • 語文條件: 英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通
  • 其它條件: Minimum Qualifications
    Minimum of 5-10 years of experience in the development and high-volume manufacturing of advanced IC packages.
    Expertise in Flip Chip CSP, FCBGA, 2.5D/3D IC packaging technologies, materials, assembly processes, equipment, and design rules.
    Understanding industry packaging trends, end-user packaging considerations, and previous experience with high performance compute and mobile consumer products.
    Excellent verbal and written communication skills.
    Exhibit organized technical project management skills (preferably, involving off-shore factories).
    Able to work independently and lead multiple programs.
    Able to lead multi-functional teams to solve complex technical problems.
    Self-driven, passionate, and creative.

    Preferred Qualifications
    Hands on experience in package manufacturing, experience in technical project management, and working first-hand with semiconductor material suppliers.
    Proficiency in material and package characterization data analysis, and statistical data analysis.
    Knowledge of reliability test methods, qualification procedure, and FA techniques.
    Six Sigma Green or Black belt a plus.

    Education Requirements
    Bachelor's degree in Mechanical, Materials, Chemical Engineering or related disciplines.
    M.S. or higher degree in Engineering preferred.

福利制度

Along with quality, life-enhancing programs. When we say the benefits of working at Qualcomm are many, you’ll see we mean that quite literally. Just take a look…

The benefits listed below apply to the employees of Qualcomm Taiwan Corporation & Qualcomm Communication Technologies Limited located in Taiwan

National Health and Labor Insurance
National Retirement Scheme
Public Holidays
Paid Maternity Leave
Paid Paternity Leave
Annual Leave
Education Assistance

更新日期:2022-01-21

應徵方式

  • 職務聯絡人: HR
  • 聯絡E-Mail: (請利用104履歷表應徵此工作) 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽
  • 它: Please apply via www.qualcomm.com/careers and refer to req number 3024998.

應徵分析

兩週內0-5人應徵
經歷分佈
新鮮人0%
1~3年0%
3~5年0%
5~10年25%
10年以上75%
學歷分佈
碩士及以上75%
大學25%
專科0%
高中0%
高中以下0%
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