求職服務專線
台北 02-2912-6104 轉 2
   02-7703-3104 轉 2
意見回饋
廠商求才專線
台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

JR0158676 Substrate Module Development Integration Engineer

  • 全職

* This position presents an excellent opportunity for a highly motivated technical contributor to excel in substrate manufacturing process development for packaging at suppliers factories through Development Ramp and High Volume Manufacturing HVM phases.
* Substrate process development include various technologies for Patterning, Lithography, Development, Plating, Dielectric Formation Surface Finish, solder mask, ball/chip cap attach.
* Work together with supplier and internal partners for technology transfer fingerprinting and benchmarking across manufacturing tools and chemicals, planning/execution of process window characterization and validation, validation of process control plan and FMEA, improvement of process control system and process development methodology.
* Develops solutions to technical problems and systemically closes the problems to ensure smooth Ramp and HVM of the new substrate technology.

工作條件

  • 接受身份: 上班族
  • 工作經歷: 八年以上
  • 學歷要求: 大學以上
  • 語文條件: 英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通
  • 其它條件: • Qualifications

    1.BS, MS, or PhD in Science or Engineering fields with minimum 8 years experiences in Semiconductor Fab Substrate Packaging development or manufacturing environment is required
    2.Strong skill required for Supplier Management Quality Management Analytical Problem Solving and Influence in relevant fields of Technology Development and Ramp.
    3.Highly experienced in managing Fab or Substrate factory operations for manufacturing process control preventive maintenance of the manufacturing lines are required.
    4.Indepth knowledge required on Substrate Manufacturing Processes, Raw Materials, Packaging Technologies and Quality, Process Control Systems.
    5.Knowledgeable in Cleanroom operations and Foreign Material control are preferred.
    6.Fluent communication in business level English communication preferred, excellent Presentation skill, good Stakeholder Management ability to work in cross functional teams are required.

福利制度

In addition to a challenging and interesting work environment, Intel offers a benefits and compensation package that goes well beyond base salary. Below are some of our unique benefits and compensation programs. Please note that the benefits and compensation programs within Asia Pacific Sales and Marketing may vary somewhat as they are tailored to meet the needs of our employees in their own countries.

http://www.intel.com/jobs/apac/bencomp/

更新日期:2021-07-14

應徵方式

  • 職務聯絡人: Talent Acquisition
  • 聯絡E-Mail: 未填寫 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽
  • 它: Please directly send an English resume to winnie1.hsu@intel.com

應徵分析

兩週內6-10人應徵
經歷分佈
新鮮人0%
1~3年0%
3~5年13%
5~10年38%
10年以上50%
學歷分佈
碩士及以上88%
大學13%
專科0%
高中0%
高中以下0%
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