求職服務專線
台北 02-2912-6104 轉 2
   02-7703-3104 轉 2
意見回饋
廠商求才專線
台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

Job description:
As PWF HBM PIE (package integration engineering) Engineer, in close collaboration with Multi-functional Groups ( BU, APTD, DESIGN, Site Engineering, Central Team, KEG) , is responsible for the effective and efficient execution of new product and integration from NPN (new product notification) to high volume manufacturing. The success of this position will be assessed by the timely BU project timeline readiness for DC/ES/QS/Stick build, first time & on time package Qual release and the ability to ramp the product to minimum, predefined yield and quality targets from NPI-LVM and meeting 100% of handover criteria.
Key responsibilities and task
Drive the introduction of the new product through the Advance Package Qualification Process (APQP).
Work closely with different teams to ensure seamless transition into HVM within the stipulated time and meeting minimum yield & quality expectations. Manage new product by management and NPI execution by assessing the QUAL, LVM result and status by mean of NPI Checklist & phase gate meeting.
Create NPI plan to collect, analyze input and communicate Process of Record, TRA, PDSS and other relevant documents for each new product. Develop, validate and document the configuration requirement, baseline plan and/or model in relation to MOR (Model of Record), POR (Plan or Process of Record), TOR (Tool of Record) and BOM (Bill of Materials) for the new or transferred products and packages, to support the effort to create commonality and one recipe across all sites.
Collaborate with development and module groups (ex: APTD, NPI, DESIGN, KEG) to enable on-time qualification of new product/packaging solution, thru the definition of package multi-functional design review with initial feasibility study and review, leading to Final package stackup/process flow/BOM/TRA.
Develop strategic solutions and roadmaps through collaboration with internal and external stakeholders. Provide leadership in problem analysis and resolution at network level. Work with groups outside of your department to identify and close technical gaps related to new product integration.
Be the domain specialist of the NPI business process and system and develop strategies to drive continuous improvement. Provide rigorous documentation for all aspects of product development from design, direct materials, process parameters, equipment and PML validation.
Support Build fulfilment with Customer Samples, Engineering Samples, Quality Samples or other Controlled Engineering builds for new products/packages.
Take Product E2E Responsibility and solve the critical issues factory escalates or customer returns.
Ensure flawless ramp up from NPI to HVM Analyze yield , process and semiconductor test data , isolate root cause of yield loss and product performance degradation.
Technology benchmarking and development
Requirements
Masters or Bachelor's degree in an Engineering
Experience in Fab Process, PWF or Backend engineering process or package development preferred
Experience in Python, Scripting is added points
Good technical knowledge in component test and/or module manufacturing process
Excellent data analysis, statistical analysis, data interpretation skills
Ability to make sound data-driven decisions. Prioritize and apply due-diligence in day to day task.
Proficiency in Excel, Word, Power Point, Project Management Software or any equivalent software.
With good oral and written English communication skills

工作條件

  • 接受身份: 上班族、外籍人士、原住民【相關法令
  • 工作經歷: 三年以上
  • 學歷要求: 大學 碩士
  • 語文條件: 英文 -- 聽 /中等、說 /中等、讀 /中等、寫 /中等
  • 其它條件:

福利制度

﹝以下薪資福利僅適用於台灣美光晶圓科技(股)公司與台灣美光記憶體科技(股)公司正式員工,其他廠區或辦公室及非正式員工薪資福利另議。﹞
☆薪資及獎金制度 ☆
1. 12個月基本薪資+2個月年終獎金(需當年度12月31日當日在職員工方能領取)
2. 工程師職位薪資:
(1)工程師NT54000起
(2)輪班工程師NT46000起 (輪班津貼另計)
(3)具半導體經驗者薪優另議
3. 績效獎金(IPP):按公司營運績效及組織目標成效給與。
4. 即時獎勵(Spot Bonus/Micron Point):發給工作表現卓越之員工。
5. 久任獎勵(Service Award):服務每滿五年之員工,可獲頒特別贈品。
6. 勞工退休金雇主提撥率:8%,優於勞基法規定。
7. 新進員工到職當月即享有特休假(依服務比例按月給予特休),優於勞基法規定。
8. 全薪病假80小時;政府紀念不放假之紀念日給予特別休假,讓同仁有更多的假期安排。
☆教育訓練☆
Micron全球人力培訓主要目標是 - 確保每個成員都能夠獲得展現高績效成果所需要的學習資源。Micron提倡標準化的訓練架構,以便根據團隊成員的職位、工作職能、工作角色和執行的特定工作來識別必要和相關的訓練。Micron 的主要訓練架構:
1. 美光核心職能訓練:包含與法規遵循相關且適用於所有 Micron成員的訓練活動。
2. 地區性/廠區核心要求:包含與法規遵循相關、適用於特定地區或廠區之所有成員的訓練活動。
3. 部門核心職能訓練:包含適用於特定部門內所有成員,包含與安全有關以及單位內訓練活動。
4. 特定工作角色的特定訓練:如領導力訓練、接班人計畫。
5. 除了一般的訓練方法,美光也利用多元的學習方式來達到人力發展目標,如:自我學習方案、工作輪調、專案參與等。
☆福利措施☆
1. 健保、勞工保險及免費團體保險(含壽險、意外、健康醫療團體保險)。員工配偶及子女享有免費健康醫療團體保險。
2. 醫務室,具專業護士駐廠並定期提供專科醫師問診。
3. 生日禮券、生育、婚喪賀奠及急難補助。
4. 提供多條路線之交通車搭乘服務。
5. 設有各式公司社團及康樂活動。
6. 設施完善的停車場。
7. 員工餐廳及便利商店。
8. 社團經費補助。
9. 開放式圖書閱覽室以及健身房。
10. 設備完善的電腦教室與訓練教室。
11. 員工宿舍(台中廠)、租屋補助(桃園廠)。


『美光政策已經且將持續落實所有人力資源活動及福利待遇,不分種族、宗教、膚色、性別、國籍、年齡、殘疾、性向、婚姻狀態、軍籍地位或其他受法律保護之類別。每位經理人、主管及團隊成員均有責任貫徹此政策規定。
人事部門之雇用平權承辦人負責本政策之執行、解答任何相關問題及查核員工遵守政策之成效狀況。申請過程中如需要協助,請聯繫美光人力資源部 04-25218177(免轉分機) / 03-3272988 ext.3425 。』
求職者在招募過程中或受僱於美光時,無須支付費用、押金或承擔債務
Jobseekers are not required to pay fees, deposits or incur debt as part of the recruitment process or for employment with Micron.

更新日期:2021-06-23

應徵方式

  • 職務聯絡人: 台灣人力資源營運中心
  • 聯絡E-Mail: 未填寫 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽
  • 它: *請務必至本公司職缺網站應徵本職缺,並附上英文履歷/自傳。謝謝。
    https://app.eightfold.ai/careers/job?domain=micron.com&pid=7500715

應徵分析

兩週內0-5人應徵
經歷分佈
新鮮人0%
1~3年0%
3~5年25%
5~10年0%
10年以上75%
學歷分佈
碩士及以上100%
大學0%
專科0%
高中0%
高中以下0%
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