求職服務專線
台北 02-2912-6104 轉 2
   02-7703-3104 轉 2
意見回饋
廠商求才專線
台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

Job Description

As a Senior Manager Package Design, within the Global Design, Simulation and Substrate team for Micron Technology, you will be responsible for supporting management in meeting strategic deployment goals, managing and developing Taiwan Package Design Center, further enhancing its core competencies of design and simulation. You will be working with a cross-functional team across several geographies to guide development of package designs optimized for electrical performance that address high speed interfaces, power integrity, thermal and mechanical considerations. Responsibilities include the following, but are not limited to: Codesign Coordination and Management, design execution to meet BU strategic objectives, alignment on various package designs between sites, support for new package development activities, research into new/alternative packaging designs to meet packaging requirements, develop and maintain effective communications with stakeholders and key customers. You will assist to improve your teams’ individual capability through performance appraisals, goal setting, and developmental plans designed to identify and implement continual improvement opportunities.

Develop and maintain BU specific packaging roadmap(s)
Identify and evaluate key package enabling technologies
Provide technical leadership that influences and sets packaging direction
Recognize opportunities and drive technical innovation
Collaborate with peers to construct global solutions
Act as key bridging member between Micron and Local Semiconductor Industry and communities
Exhibit knowledge of IC package assembly technology, PCB design and fabrication, industry packaging trends, and end-user packaging considerations
Collaborate with Stakeholders to Deliver Strategic Solutions

Engage with Micron’s key customers on packaging technology and roadmap(s)
Communicate capabilities to ensure stakeholder expectations are met
Provide functional area expertise to customers and other stakeholders
Manage conflict and build effective relationships with internal and external stakeholders
Initiate and sustain effective communication with internal and external stakeholders
Create and execute strategies according to stakeholder requirements
Manage Technical Projects

Liaise with Technical Program Manager and Package Integration Engineering on products startup
Ensure sufficient feasibility studies are completed prior to new product introduction
Ensure proper design and timely startup of new devices, this include alignment on various pkg, substrate designs among sites.

Collaborate with Mfg, Operation, design centers and development Groups

Conduct regular design review meetings to support new product introduction/operations needs
Guide design engineers to provide on time design review support to various Asia silicon design teams
Improve the process margin, productivity, and package reliability by implementing lesson learnt in package design

Enable Team members with Tools and Technical knowledge
Interface with Silicon design and various groups to define Package design rules/guidelines and layout methodology
Enhance core competencies of various simulation techniques (electrical, thermal stress and mold flow).

工作條件

  • 接受身份: 上班族、外籍人士、原住民【相關法令
  • 工作經歷: 不拘
  • 學歷要求: 大學 碩士
  • 語文條件: 不拘
  • 其它條件: Qualifications
    The applicant should have a MS degree or higher in Electrical Engineering, Mechanical Engineering, Materials Engineering, or related field with 5 years relevant experience ASIC or IC Package design.
    Strong Experience with Cadence SIP, APD, Ravel and ACAD software tools is a must
    Knowledge with Ansys Mechanical, HFSS, Cadence Sigrity, is preferred
    Strong English oral communication and written skills
    Excellent 8D problem solving skills and communication skills
    Experience with ORCAD, Mentor Graphics is a plus
    Experience
    5 years of relevant experience in package design and packaging
    Manage and Develop Team

    Lead and manage talent in Taiwan
    Oversee all packaging design activities
    Manage team staffing and succession
    Distribute work and learning opportunities
    Empower team members and promote teamwork
    Promote partnership across functional areas and customer groups
    Cover all personnel issues including performance management
    Provide Technical Leadership

福利制度

﹝以下薪資福利僅適用於台灣美光晶圓科技(股)公司與台灣美光記憶體科技(股)公司正式員工,其他廠區或辦公室及非正式員工薪資福利另議。﹞
☆薪資及獎金制度 ☆
1. 12個月基本薪資+2個月年終獎金(需當年度12月31日當日在職員工方能領取)
2. 工程師職位薪資:
(1)工程師NT54000起
(2)輪班工程師NT46000起 (輪班津貼另計)
(3)具半導體經驗者薪優另議
3. 績效獎金(IPP):按公司營運績效及組織目標成效給與。
4. 即時獎勵(Spot Bonus/Micron Point):發給工作表現卓越之員工。
5. 久任獎勵(Service Award):服務每滿五年之員工,可獲頒特別贈品。
6. 勞工退休金雇主提撥率:8%,優於勞基法規定。
7. 新進員工到職當月即享有特休假(依服務比例按月給予特休),優於勞基法規定。
8. 全薪病假80小時;政府紀念不放假之紀念日給予特別休假,讓同仁有更多的假期安排。
☆教育訓練☆
Micron全球人力培訓主要目標是 - 確保每個成員都能夠獲得展現高績效成果所需要的學習資源。Micron提倡標準化的訓練架構,以便根據團隊成員的職位、工作職能、工作角色和執行的特定工作來識別必要和相關的訓練。Micron 的主要訓練架構:
1. 美光核心職能訓練:包含與法規遵循相關且適用於所有 Micron成員的訓練活動。
2. 地區性/廠區核心要求:包含與法規遵循相關、適用於特定地區或廠區之所有成員的訓練活動。
3. 部門核心職能訓練:包含適用於特定部門內所有成員,包含與安全有關以及單位內訓練活動。
4. 特定工作角色的特定訓練:如領導力訓練、接班人計畫。
5. 除了一般的訓練方法,美光也利用多元的學習方式來達到人力發展目標,如:自我學習方案、工作輪調、專案參與等。
☆福利措施☆
1. 健保、勞工保險及免費團體保險(含壽險、意外、健康醫療團體保險)。員工配偶及子女享有免費健康醫療團體保險。
2. 醫務室,具專業護士駐廠並定期提供專科醫師問診。
3. 生日禮券、生育、婚喪賀奠及急難補助。
4. 提供多條路線之交通車搭乘服務。
5. 設有各式公司社團及康樂活動。
6. 設施完善的停車場。
7. 員工餐廳及便利商店。
8. 社團經費補助。
9. 開放式圖書閱覽室以及健身房。
10. 設備完善的電腦教室與訓練教室。
11. 員工宿舍(台中廠)、租屋補助(桃園廠)。


『美光政策已經且將持續落實所有人力資源活動及福利待遇,不分種族、宗教、膚色、性別、國籍、年齡、殘疾、性向、婚姻狀態、軍籍地位或其他受法律保護之類別。每位經理人、主管及團隊成員均有責任貫徹此政策規定。
人事部門之雇用平權承辦人負責本政策之執行、解答任何相關問題及查核員工遵守政策之成效狀況。申請過程中如需要協助,請聯繫美光人力資源部 04-25218177(免轉分機) / 03-3272988 ext.3425 。』
求職者在招募過程中或受僱於美光時,無須支付費用、押金或承擔債務
Jobseekers are not required to pay fees, deposits or incur debt as part of the recruitment process or for employment with Micron.

更新日期:2021-07-19

應徵方式

  • 職務聯絡人: 台灣人力資源營運中心
  • 聯絡E-Mail: 未填寫 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽
  • 它: 其他應徵方式及備註: *請務必至本公司職缺網站應徵本職缺,並附上英文履歷/自傳。謝謝。
    https://micron.eightfold.ai/careers?pid=8128387&domain=micron.com

應徵分析

兩週內0-5人應徵
經歷分佈
目前無資料
學歷分佈
目前無資料
一零四資訊科技享有網站內容著作權 © 2001- 2021 104 Corporation All Rights Reserved