求職服務專線
台北 02-2912-6104 轉 2
   02-7703-3104 轉 2
意見回饋
廠商求才專線
台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Responsibilities:

- Be the overall leader in driving discussion with packaging material suppliers in meeting Micron materials specification and roadmaps
- Familiar with industrial JEDEC standard i.e. JESD 47, IPC-9701/02/03 and AEC standard i.e. AEC-Q100, Q104 etc.
- Lead and define reliability test plan and methodologies for LPDRAM, NAND, HBM packaging materials
- Own and establish overall package reliability test plan, sampling and characterization planning and execution, resource allocation.
- Collaborate with Other Packaging Stakeholders on materials, package reliability & mechanical characterization.
- Define and innovate in new test method/ package reliability methodology or testing
Lead in driving resolution of issues encountered during package characterization/ NPI qualifications
- Plan out overall package mechanical characterization tracking and forecasting for new package NPIs, post reliability survivor analysis
- Be the Point-of Contact pertaining to all aspects of assigned products/packages in relating to package reliability development
- Develop reliability assessment strategies to drive materials and package with regards to materials improvement from mechanical, polymer, interconnect materials perspective
- Establish acceleration models to estimate intrinsic reliability field life and extrinsic defect failure rate (PPM over time) based on customer mission profiles or industry use conditions
- Define stress test matrix for determining constants, such as Eaa (Apparent Activation Energy) and Coffin-Manson exponent used for modeling
Working with Stakeholder derive correlations between Test, Reliability and In-Process Data.

工作條件

  • 工作經歷: 不拘
  • 學歷要求: 碩士以上
  • 語文條件: 英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通
    中文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通
  • 其它條件: 1. Master/ PhD in Mechanical/ Materials Science and Engineering/ Semiconductor Packaging Engineering
    2. Highly motivated individuals with 12 ~ 15 years of relevant working experience are encouraged to apply
    3. Proficient in package reliability & modeling, acceleration models used in packaging reliability
    4. Possesses at least 3 years technical and people management experience in package development
    5. Well-versed in semiconductor packaging process and materials reliability
    6. Good knowledge in package reliability models and failure mechanisms. Well-versed in package and/or system level mechanical testing and material science
    7. Lead and drive technical discussion and directive in driving taskforce meetings for package reliability failures
    8. Proven track records of patent filing/ technical publications/ co-work with industrial Consortia i.e. JEDEC/ AEC/ IRPS/ IEEE Packaging Society
    9. A team player equipped with excellent interpersonal and communication skills.
    Possess initiative and ability to work independently.
    10. Good semiconductor package reliability, materials analysis and failure analysis skill sets
  •  
  • 歡迎外籍人士、原住民【相關法令】、中壯齡(45~54歲)、中高齡(55~64歲)

福利制度

﹝以下薪資福利僅適用於台灣美光晶圓科技(股)公司與台灣美光記憶體科技(股)公司正式員工,其他廠區或辦公室及非正式員工薪資福利另議。﹞
☆薪資及獎金制度 ☆
1. 12個月基本薪資+2個月年終獎金(需當年度12月31日當日在職員工方能領取)
2. 工程師職位薪資:
(1)工程師NT54000起
(2)輪班工程師NT48000起 (輪班津貼另計)
(3)具半導體經驗者薪優另議
3. 績效獎金(IPP):按公司營運績效及組織目標成效給與。
4. 即時獎勵(Spot Bonus/Micron Point):發給工作表現卓越之員工。
5. 久任獎勵(Service Award):服務每滿五年之員工,可獲頒特別贈品。
6. 勞工退休金雇主提撥率:8%,優於勞基法規定。
7. 新進員工到職當月即享有特休假(依服務比例按月給予特休),優於勞基法規定。
8. 全薪病假80小時;政府紀念不放假之紀念日給予特別休假,讓同仁有更多的假期安排。
☆教育訓練☆
Micron全球人力培訓主要目標是 - 確保每個成員都能夠獲得展現高績效成果所需要的學習資源。Micron提倡標準化的訓練架構,以便根據團隊成員的職位、工作職能、工作角色和執行的特定工作來識別必要和相關的訓練。Micron 的主要訓練架構:
1. 美光核心職能訓練:包含與法規遵循相關且適用於所有 Micron成員的訓練活動。
2. 地區性/廠區核心要求:包含與法規遵循相關、適用於特定地區或廠區之所有成員的訓練活動。
3. 部門核心職能訓練:包含適用於特定部門內所有成員,包含與安全有關以及單位內訓練活動。
4. 特定工作角色的特定訓練:如領導力訓練、接班人計畫。
5. 除了一般的訓練方法,美光也利用多元的學習方式來達到人力發展目標,如:自我學習方案、工作輪調、專案參與等。
☆福利措施☆
1. 健保、勞工保險及免費團體保險(含壽險、意外、健康醫療團體保險)。員工配偶及子女享有免費健康醫療團體保險。
2. 醫務室,具專業護士駐廠並定期提供專科醫師問診。
3. 生日禮券、生育、婚喪賀奠及急難補助。
4. 提供多條路線之交通車搭乘服務。
5. 設有各式公司社團及康樂活動。
6. 設施完善的停車場。
7. 員工餐廳及便利商店。
8. 社團經費補助。
9. 開放式圖書閱覽室以及健身房。
10. 設備完善的電腦教室與訓練教室。
11. 員工宿舍(台中廠)、租屋補助(桃園廠)。


『美光政策已經且將持續落實所有人力資源活動及福利待遇,不分種族、宗教、膚色、性別、國籍、年齡、殘疾、性向、婚姻狀態、軍籍地位或其他受法律保護之類別。每位經理人、主管及團隊成員均有責任貫徹此政策規定。
人事部門之雇用平權承辦人負責本政策之執行、解答任何相關問題及查核員工遵守政策之成效狀況。』
求職者在招募過程中或受僱於美光時,無須支付費用、押金或承擔債務
Jobseekers are not required to pay fees, deposits or incur debt as part of the recruitment process or for employment with Micron.

更新日期:2021-09-09

應徵方式

  • 職務聯絡人: 台灣人力資源營運中心
  • 聯絡E-Mail: 未填寫 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽
  • 它: *請務必至本公司職缺網站應徵本職缺,並附上英文履歷/自傳。謝謝。
    https://micron.eightfold.ai/careers?pid=9084750&query=JR6789&domain=micron.com&jobIndex=0

應徵分析

兩週內0-5人應徵
經歷分佈
新鮮人0%
1~3年0%
3~5年0%
5~10年100%
10年以上0%
學歷分佈
碩士及以上100%
大學0%
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高中0%
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