求職服務專線
台北 02-2912-6104 轉 2
   02-7703-3104 轉 2
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廠商求才專線
台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

RFFE Package Manufacturing Engineer(PME) Sr. or Staff (3022625)

  • 全職

Job Overview
- Support the New Production Introduction (NPI) / Tech Node (TN) Process - Work with RFFE NPI and Package Development Engineering.
- Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment.
- Support development of products and advanced technologies for Qualcomm RFFE bump bare die, WLP and RF-SiP module applications.
- Support product material and design selections, technical risk assessments, mitigation plans, and development from concept to production.
- Candidate will develop a strong understanding of substrate and assembly process details, SPC, Control plans, OCAPs, FMEAs, PCN, CARs.
- Candidate will work cross-functionally with Design, Device process development, internal and subcontract Packaging groups.


Minimum Qualifications
-8+ year experience in any of the following: Semiconductor (Packaging) Engineering or Manufacturing.
- Deep understanding of packaging requirements, process capability and equipment capability throughout the industry and the ability to incorporate best engineering practices for all backend assembly process; including but not limited to WLP process.
- Basic skill of JMP data analysis tool.
- Good understanding of Chip level and package level reliability and failure analysis methodology.
- Understand yield management, continuous improvement, assembly cycle time analysis and cost reduction.
- Fluent in English and Mandarin, both spoken and written.
- Proactive working attitude and capable to handle new challenge.


Preferred Qualifications
- Basic knowledge of quality concept and RMA process.
- Basic knowledge of foundry process of GaAs wafer.
- Good understanding of GaAs wafer bump, laser grooving and wafer saw process.
- Good experience with yield management software (O+)
- Understand assembly and test house working model, turnkey model, supply chain and KPI.

Education Requirements
Preferred Master's degree in Electrical Engineering, Physics, Materials Science, or related discipline. Good Bachelor candidate with wide spectrum may be considered as well.

工作條件

  • 接受身份: 上班族
  • 工作經歷: 四年以上
  • 學歷要求: 大學以上
  • 語文條件: 英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通
  • 其它條件: 未填寫

福利制度

Along with quality, life-enhancing programs. When we say the benefits of working at Qualcomm are many, you’ll see we mean that quite literally. Just take a look…

The benefits listed below apply to the employees of Qualcomm Taiwan Corporation & Qualcomm Communication Technologies Limited located in Taiwan

National Health and Labor Insurance
National Retirement Scheme
Public Holidays
Paid Maternity Leave
Paid Paternity Leave
Annual Leave
Education Assistance

更新日期:2021-11-25

應徵方式

  • 職務聯絡人: HR
  • 聯絡E-Mail: (請利用104履歷表應徵此工作) 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽
  • 它: Please apply via www.qualcomm.com/careers and refer to req number #3022625

應徵分析

兩週內0-5人應徵
經歷分佈
新鮮人0%
1~3年0%
3~5年0%
5~10年0%
10年以上100%
學歷分佈
碩士及以上75%
大學25%
專科0%
高中0%
高中以下0%
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