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台北 02-2912-6104 轉 2
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廠商求才專線
台北 02-2912-6104
   02-7703-3104
台中 04-3700-6104
上海 86-21-50277104 轉 1
意見回饋

Sr. Advanced Packaging Engineering - External Manufacturing Operations (122746)

  • 全職

THE ROLE:

Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive external manufacturer (3D Stack and Chiplet packaging) on delivering key performance indices in terms on process development, baseline standardization and continuous improvement.



THE PERSON:

Creative, highly motivated self-driven individual team player with the demonstrated ability to independently complete complex engineering tasks on/ahead of time/Lead & Drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment.

AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology.

This is an extraordinary opportunity to work in an outstanding company like AMD - Join us!



KEY RESPONSIBILITIES:

Responsible for InFO, 2.5D, FCBGA and Chiplet package Manufacturing readiness for New Product bring up at manufacturing site.
Drive assembly process baseline standardization and continuous improvement.
Responsible for packaging yield, quality, cost and operation productivity improvements and sustaining activities.
Responsible for the packaging interaction activities among assembly, bump, 3D IC, HBM and wafer fab, wafer sort, Functional Test and Mark/Pack.
Drive Assembly manufacturer to enhance process, equipment & material capability for future generation/technology products
Co-work with Packaging BU on NPI and Ramp Up readiness at manufacturing site. Proactively follow up task assignments and report status timely to stakeholders.
Responsible to manage performance of assembly manufacturing site/supplier regarding yield & quality, out of control lot disposition, and any outliers with close loop on reporting.
Plan and execute change management from internal or external parties.
Assist in additional duties as deemed fit by supervisor.ernal or external parties.

工作條件

  • 工作經歷: 十年以上
  • 學歷要求: 碩士以上
  • 語文條件: 英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通
  • 其它條件: PREFERRED EXPERIENCE:

    Min 3 years’ experience in InFO or 2.5D TSV/Packaging or WLFO process engineering with min total 8 years assembly work experience.
    Possess InFO, Chiplet packaging, 2.5D TSV/Packaging, Flip Chip BGA/LGA process knowledge and Chip-Packaging Interaction knowledge.
    Familiar with DOE and JMP.
    Experience in preparing reports /presentation and ability to communicate Root cause and Resolution effectively.
    Time & Project Management skills.
    Strong interpersonal skills with excellent written & oral executive communication & presentation skills in Chinese and English.


    ACADEMIC CREDENTIALS:

    MS degree in Material / Chemical / Electrical / Mechanical Engineering or equivalent.



    LOCATION:

    Hsinchu, Taiwan

福利制度

獎金 / 禮品類
  1.年終獎金
  2.三節禮金/禮品
◆ 保險類
  1.勞保
  2.健保
  3.員工團保
  4.眷屬團保
  5.意外險
  6.職災保險
◆ 休閒類
  1.部門聚餐
◆ 制度類
  1.介紹獎金
  2.順暢的升遷管道
3.退休金、離職金制度
◆ 請 / 休假制度
  1.週休二日
  2.優於法定之特休/年假
  3.優於法定之陪產假
  4.不扣薪病假
  5.員工育嬰假
◆ 補助類
  1.員工停車位或停車補助
2.員工進修補助

更新日期:2022-01-14

應徵方式

  • 職務聯絡人: MaggieCai
  • 聯絡E-Mail: 未填寫 我要應徵
  • 洽: 不接受電洽
  • 洽: 不接受親洽
  • 它: Please prepare your English resume

應徵分析

兩週內6-10人應徵
經歷分佈
新鮮人0%
1~3年0%
3~5年11%
5~10年0%
10年以上89%
學歷分佈
碩士及以上78%
大學22%
專科0%
高中0%
高中以下0%
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