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生產技術/製程工程師 半導體製程工程師 半導體工程師的工作機會

18 筆查詢結果
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 大學以上
  • 五年以上工作經驗
  • 待遇面議
We are looking for a highly motivated packaging engineer capable of leading state-of-the-art Flip Chip technology projects. You will be responsible for packaging development and new product introduction (NPI) of leading-edge package technologies for compute, mobile, IoT and connectivity market and driving that innovation into high volume manufacturing at assembly suppliers. Extensive knowledge and
3天以前更新 兩週內0-5人應徵
2021-11-29
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 大學以上
  • 二年以上工作經驗
  • 待遇面議
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age
3天以前更新 兩週內6-10人應徵
2021-11-29
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 碩士以上
  • 三年以上工作經驗
  • 待遇面議
【Please apply via www.qualcomm.com/careers and refer to Req. Number 3025422】 The candidate will work as an engineer in Process Technology & Foundry Engineering team. In the role, the candidate is expected to independently analyze process and product testing data, debug the issues observed in process, communicate with foundries, and support new product introduction from QCT side. Being part of t
6天以前更新 兩週內11-30人應徵
2021-11-26
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 碩士以上
  • 三年以上工作經驗
  • 待遇面議
【Please apply via www.qualcomm.com/careers and refer to Req. Number 3020680】 As a semiconductor device and process technologist, you will be part of our Silicon Technology/Foundry Engineering group with exciting opportunities working on cutting-edge device engineering, advanced technology development, and innovative design/technology co-optimization to bring Qualcomm chips to our customers with
6天以前更新 兩週內6-10人應徵
2021-11-26
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 碩士以上
  • 三年以上工作經驗
  • 待遇面議
[Job Role and Job Description] -CMOS device analysis (finfet, GAA) -Yield analysis -Technology benchmarking and scaling analysis -DTCO, standard cell design -Relationship with foundry partners [Basic Qualifications] Minimum Qualifications: 3 years of experience on advanced CMOS process development, device engineering and circuit benchmark [Preferred Qualifications/Knowledge] Experience in t
一週以前更新 兩週內6-10人應徵
2021-11-25
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 碩士以上
  • 三年以上工作經驗
  • 待遇面議
【Job Overview】 We are looking for a multi-faceted engineer that will drive our foundry efforts in the following areas: •CMOS Device and product KPI analysis •Semiconductor yield analysis •Test structure design and test •DTCO •Foundry partnership 【Preferred Qualifications】 •3+ years of experience CMOS technology development (e.g. device, integration, process, enablement), circuit design, EDA,
一週以前更新 兩週內11-30人應徵
2021-11-25
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 大學以上
  • 四年以上工作經驗
  • 待遇面議
General Summary Member of QCT Engineering & Operation team managing assembly/packaging subcontractor sites in Taiwan. Examples of responsibility areas: • Production launch into high volume manufacturing (HVM) • Develop new process manufacturing BKM • Resolve manufacturing and customer quality issue • Drive manufacturing yield and process innovation/cost reduction • New product development Exampl
一週以前更新 兩週內11-30人應徵
2021-11-25
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 碩士以上
  • 工作經驗不拘
  • 待遇面議
【Job Overview】 This position is for a technical individual contributor in QTI process technology team for advanced CMOS strategic technology development. Candidates will be responsible for technology assessment of advanced CMOS nodes including competitive technology selection with best device and circuit FOM (performance/watt/cost), benchmarking of process modules and integration flows for manu
一週以前更新 兩週內11-30人應徵
2021-11-25
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 大學以上
  • 五年以上工作經驗
  • 待遇面議
CMOS device-level characterization for advanced-technology test-chip or new product introduction, and silicon debug in high-volume manufacturing Analyze product metrics (parametric indices, defect behavior) and conduct correlations to electrical/physical parameters in order to identify root cause for product yield loss and/or to make further process/device/design optimizations Interact with QCT in
一週以前更新 兩週內6-10人應徵
2021-11-25
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 大學以上
  • 工作經驗不拘
  • 待遇面議
The main responsibility of this position is to improve performance and power/area efficiency of world-class microprocessor for mobile and portable computers. The potential areas to work include: ‧ Function and performance model development ‧ Performance projection and competitive analysis ‧ Performance bottleneck analysis ‧ Benchmark and workload characterization ‧ Performance, Power, an
一週以前更新 兩週內0-5人應徵
2021-11-25
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 大學以上
  • 二年以上工作經驗
  • 待遇面議
The IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc...). Job responsibilities for this position include package selection, package design, and package EE modeling. This invo
一週以前更新 兩週內0-5人應徵
2021-11-25
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 碩士以上
  • 工作經驗不拘
  • 待遇面議
Job Overview Candidate will be Yield expert in PTE (Product & Test Engineering) team to drive yield, test, and quality improvement at wafer foundries by collaborating with product, test and DFT engineers. Responsibilities will include to analyzing, interpreting, and driving solutions to semiconductor test failures and test escapes from ATPG, Memory BIST, retention, and functional test using WS, FT
一週以前更新 兩週內0-5人應徵
2021-11-25
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 大學以上
  • 二年以上工作經驗
  • 待遇面議
Qualcomm Packaging group is responsible for developing and enabling new packaging technologies for high volume manufacturing. The packaging team is seeking an experienced professional who has worked with various packaging technologies Flipchip, Wirebond, CSP, WLP, PoP, etc. SIP and/or experience in automotive industry will be a plus. Responsibilities: - Responsible from exploring, defining
一週以前更新 兩週內0-5人應徵
2021-11-25
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 碩士以上
  • 五年以上工作經驗
  • 待遇面議
Job Function As process integration engineer, you will use your skills to define, develop and productize BEOL (Back End Of the Line) / and MOL (Middle Of Line) stack in advanced CMOS technology platform meeting Qualcomm Product requirements. You will work closely with our internal design teams to determine the metal stack to meet product speed, power, IR drop, and routing tracks; and MOL arc
一週以前更新 兩週內0-5人應徵
2021-11-25
Qualcomm Semiconductor Corporation_高通半導體有限公司
  • 大學以上
  • 四年以上工作經驗
  • 待遇面議
Job Overview - Support the New Production Introduction (NPI) / Tech Node (TN) Process - Work with RFFE NPI and Package Development Engineering. - Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment. - Support development of products and advanced technologies for Qualcomm RFFE bump bare die, WLP and RF-SiP module ap
一週以前更新 兩週內0-5人應徵
2021-11-25
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