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ENGINEER, PACKAGE CHARACTERIZATION

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
Micron PDE Package Characterization Engineer Job Description As a PDE Package Characterization Engineer you will be primarily responsible for defining, planning, and characterizing new packages, new packaing materials in order to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management. You will also be required to identif
兩個月以前更新 兩週內0-5人應徵
2021-06-23

Package Materials Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
As a PDE Senior Package Materials Engineer (Pathfinding) you will be primarily responsible for defining, planning, and characterize new packaging materials requirements for advance packaging such as cryogenic applications, advance SER mitigated packaging in order to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management.
一週以前更新 兩週內11-30人應徵
2021-10-06

PDE Metrology/RDA Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 二年以上工作經驗
  • 待遇面議
Description: We facilitate improvement of manufacturing capability, executing global business processes, and enabling the leverage of world-wide resources to deliver Best-In-Class performance. We drive global peer groups to align and optimize manufacturing performance; which will include involvement in resolving tactical issues and execute to this by focusing on manufacturing big rock performance
一個月以前更新 兩週內0-5人應徵
2021-09-10

PACKAGE RELIABILITY ENGINEER

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 工作經驗不拘
  • 待遇面議
As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., you will be responsible for package quality and reliability for one of Micron’s product lines. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced; and providing recommendations on product release based on package reliabi
兩個月以前更新 兩週內0-5人應徵
2021-06-23

ENGINEER PACKAGE STACKING

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 一年以上工作經驗
  • 待遇面議
Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with chip to substrate or chip to wafer interaction Familiar with TCB(thermal compression bonding) process Familiar with assembly and packaging processes Familiar with SPC, JMP data analysis and DOE matrix design Process problem identification and solving Work effectively to pr
兩個月以前更新 兩週內0-5人應徵
2021-07-14

Package Reliability Engineer -BLR

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
As a Package Lab Engineer in the DRAM and Emerging Memory Quality/Reliability Assurance (DEMQRA) team at Micron Technology Inc., you will be responsible for developing, maintaining, and improving characterization methods and Failure Analysis (FA) for microelectronics packages and PCB Assemblies.  This responsibility includes specifying and improving processes, selecting equipment, and interpretati
兩個月以前更新 兩週內6-10人應徵
2021-06-23
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 碩士以上
  • 工作經驗不拘
  • 待遇面議
Micron in Taiwan Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM. Micron’s Taiwan sites include sales and technical support in Taipei along with state-of-the-art fabrication facilities in Taichung a
兩個月以前更新 兩週內6-10人應徵
2021-07-16

SR ENGINEER- PACKAGE SILICON INTEGRATION

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 工作經驗不拘
  • 待遇面議
As an Integration Engineer in Micron's Package Development Engineering (PDE) Group, you will be responsible for driving leading edge Technode development. You will collaborate with various functional teams such as silicon design, package design, wafer fab, package integration, test and QRA to formulate and execute the characterization and qualification plan. Demonstration of the technology is show
兩個月以前更新 兩週內0-5人應徵
2021-06-23

SENIOR MANAGER – PACKAGE DESIGN

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
Job Description As a Senior Manager Package Design, within the Global Design, Simulation and Substrate team for Micron Technology, you will be responsible for supporting management in meeting strategic deployment goals, managing and developing Taiwan Package Design Center, further enhancing its core competencies of design and simulation. You will be working with a cross-functional team across s
兩個月以前更新 兩週內0-5人應徵
2021-07-19
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
JOB DESCRIPTION: Micron’s Assembly Package Technology Development team in Taiwan is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end , bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification
兩個月以前更新 兩週內0-5人應徵
2021-07-14
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development PWF(MEOL) and Assembly Process Integration for 3DI/TSV HBM(High Bandwidth Memory) Familiar with JMP data analysis and DOE matrix design and analysis Material characterization experience Process problem identification and solving Work effectively to produce cross sections cooperation Acc
一個月以前更新 兩週內0-5人應徵
2021-08-20

Engineer - Package Characterization

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 三年以上工作經驗
  • 待遇面議
Job Description As a PDE Senior Board Level Reliability Characterization Engineer you will be primarily responsible for defining, planning, and characterize module and SSD board level reliability in order to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management. You will also be required to identify, diagnose and resolve
兩個月以前更新 兩週內0-5人應徵
2021-07-02

Senior MTS -PACKAGE RELIABILITY R&D

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 碩士以上
  • 工作經驗不拘
  • 待遇面議
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainab
一個月以前更新 兩週內0-5人應徵
2021-09-09
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 工作經驗不拘
  • 待遇面議
As a PDE Package Characterization Engineer you will be primarily responsible for defining, planning, and characterizing IC packages and IC packaging materials in order to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management. You will also be required to identify, diagnose and resolve assembly process related problems by
兩個月以前更新 兩週內0-5人應徵
2021-06-23
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
JOB DESCRIPTION: Micron’s Assembly Package Technology Development team in Taiwan is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end , bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification
兩個月以前更新 兩週內0-5人應徵
2021-07-14
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