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ENGINEER, PACKAGE PROCESS INTEGRATION

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
Responsibilities and Tasks: - Design, execute, and analyze experiments to improve yield and quality. - Engage and/or lead cross-area engineering teams to solve process integration issues. - Own and ensure that the in-line process spec limits are set at optimum and reviewed as needed. - Partner with process team to better forecast and balance yield, output and process issues. Qualifications:
5天以前更新 兩週內0-5人應徵
2022-01-12

Central Team Process Integration Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 碩士以上
  • 工作經驗不拘
  • 待遇面議
As a Central Team Process Integration Engineer at Micron Technology, Inc., you will be responsible for providing leadership to the global Micron network to drive yield, product quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution. In this position, you will participate in new technology node deployment and NPI, product/p
5天以前更新 兩週內6-10人應徵
2022-01-12

MTB HBM/TSV Process Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 三年以上工作經驗
  • 待遇面議
Job Description As a MTB Assembly Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly
5天以前更新 兩週內11-30人應徵
2022-01-12
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 五年以上工作經驗
  • 待遇面議
As an Experienced Advanced Package TD Process Integration Engineer in Micron Taiwan you will be expected to define technology requirements, integrate process flows, build program plans and secure resources to drive process technology development programs. You will take ownership of these programs or projects through to deployment of technology nodes into our High Volume Manufacturing (HVM) operati
5天以前更新 兩週內11-30人應徵
2022-01-12

HBM Assembly Process Development Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 三年以上工作經驗
  • 待遇面議
Specific Responsibilities: - Advanced package technology (chip stacking, 2.5D or 3D) research and development - Familiar with Wafer Level Molding process. - Familiar with EMC material characteristics and fabrication. - Familiar with package reliability tests. - Familiar with assembly and packaging processes. - Familiar with SPC, JMP data analysis and DOE matrix design. - Process problem identifi
5天以前更新 兩週內6-10人應徵
2022-01-12

PDE SENIOR/ENGINEER - PIE PWF HBM

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 三年以上工作經驗
  • 待遇面議
Job description: As PWF HBM PIE (package integration engineering) Engineer, in close collaboration with Multi-functional Groups ( BU, APTD, DESIGN, Site Engineering, Central Team, KEG) , is responsible for the effective and efficient execution of new product and integration from NPN (new product notification) to high volume manufacturing. The success of this position will be assessed by the timely
5天以前更新 兩週內0-5人應徵
2022-01-12

HBM/CEM Assembly Process Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
As a Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by a
5天以前更新 兩週內11-30人應徵
2022-01-12

PDE TD PI, Sr./Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
As Sr/Engineer for PDE Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for NAND, mNAND and DRAM, Controller in Micron. To drive new Technode process readiness and improving the yield, quality and reliability with process characterization and
5天以前更新 兩週內0-5人應徵
2022-01-12
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 工作經驗不拘
  • 待遇面議
The Advanced Packaging Technology Development group supports Micron with packaging solutions for wafer and die level forms. As a Plating Process Engineer in the Advanced Packaging Technology Development department, your primary responsibility will be the process development for very key layers of HBM (high bandwidth memory). This includes new tool/ new material evaluation and process parameters tu
5天以前更新 兩週內11-30人應徵
2022-01-12

HBM/TSV Assembly Engineer Manager

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 五年以上工作經驗
  • 待遇面議
Job Description As an Assembly Engineering Manager at MTB HBM/TSV products, you will be responsible for providing leadership and management for both Process Engineering and Equipment Engineering Groups in your area. You will be involved in ensuring the process is in control and quality/reliability of the product meets expectations, achieving business and organizational objectives, developing/defin
5天以前更新 兩週內0-5人應徵
2022-01-12
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 工作經驗不拘
  • 待遇面議
In Micron’s Technology Development (TD) organization, we work in a state-of-the-art semiconductor facility to develop future memory technology. As a Photolithography Process Development Engineer with focus on Field Tuning Applications in our Taiwan Technology Center (TTC), you will be responsible for Overlay and Critical Dimension (CD) characterization and optimization for memory devices, in addit
5天以前更新 兩週內11-30人應徵
2022-01-12

Manager, Package Tech Integration

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 五年以上工作經驗
  • 待遇面議
Package Integration development : Key responsibilities and qualities in the JD: Micron's Package Development Engineering team in Taiwan is looking for a manager position in Tech Dev Team. A good candidate will be developing, configuring and optimizing Packaging processes (wafer level, unit level) for Micron's memory from pathfinding through development to NPI start up and certification side by sid
5天以前更新 兩週內0-5人應徵
2022-01-12

MTB Assembly Process Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 二年以上工作經驗
  • 待遇面議
As a MTB Assembly Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related
5天以前更新 兩週內6-10人應徵
2022-01-12

SR ENGINEER- PACKAGE SILICON INTEGRATION

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 工作經驗不拘
  • 待遇面議
As an Integration Engineer in Micron's Package Development Engineering (PDE) Group, you will be responsible for driving leading edge Technode development. You will collaborate with various functional teams such as silicon design, package design, wafer fab, package integration, test and QRA to formulate and execute the characterization and qualification plan. Demonstration of the technology is show
5天以前更新 兩週內6-10人應徵
2022-01-12

51481_Process Engineer

FULL_TIME
台中市西屯區
台灣康寧顯示玻璃股份有限公司
  • 大學 碩士
  • 二年以上工作經驗
  • 待遇面議
Day to Day Responsibilities -Recommend process improvements for quality, yield, or cost improvement. -Documentation of improvements and process understanding. Assist with transfer of technology across the business, Taiwan and overseas (Japan, Korea, US and China) -Support plant engineering organizations in problem solving; applying the fundamentals of heat transfer and fluid dynamics to determin
兩週以前更新 兩週內大於30人應徵
2022-01-03
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