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台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
JOB DESCRIPTION: Micron’s Assembly Package Technology Development team in Taiwan is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end , bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification
兩個月以前更新 兩週內0-5人應徵
2021-07-14
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
JOB DESCRIPTION: Micron’s Assembly Package Technology Development team in Taiwan is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end , bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification
兩個月以前更新 兩週內0-5人應徵
2021-07-14

Manager, Package Tech Integration

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 五年以上工作經驗
  • 待遇面議
Package Integration development : Key responsibilities and qualities in the JD: Micron's Package Development Engineering team in Taiwan is looking for a manager position in Tech Dev Team. A good candidate will be developing, configuring and optimizing Packaging processes (wafer level, unit level) for Micron's memory from pathfinding through development to NPI start up and certification side by sid
兩個月以前更新 兩週內0-5人應徵
2021-06-23

PDE TD PI, Sr./Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
As Sr/Engineer for PDE Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for NAND, mNAND and DRAM, Controller in Micron. To drive new Technode process readiness and improving the yield, quality and reliability with process characterization and
一週以前更新 兩週內6-10人應徵
2021-11-19
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development PWF(MEOL) and Assembly Process Integration for 3DI/TSV HBM(High Bandwidth Memory) Familiar with JMP data analysis and DOE matrix design and analysis Material characterization experience Process problem identification and solving Work effectively to produce cross sections cooperation Acc
兩個月以前更新 兩週內11-30人應徵
2021-08-20

SENIOR MANAGER – PACKAGE DESIGN

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
Job Description As a Senior Manager Package Design, within the Global Design, Simulation and Substrate team for Micron Technology, you will be responsible for supporting management in meeting strategic deployment goals, managing and developing Taiwan Package Design Center, further enhancing its core competencies of design and simulation. You will be working with a cross-functional team across s
兩個月以前更新 兩週內0-5人應徵
2021-07-19

SR. ENGINEER, MATERIAL CHARACTERIZATION

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 博士
  • 一年以上工作經驗
  • 待遇面議
As a Sr. Material Characterization Engineer-Advanced Packaging Technology Development you will be responsible for global coordination of mechanical characterization and testing for advanced packaging development efforts. You will develop and document test methods as needed to characterize materials, processes, and semiconductor packages to globally support Materials Engineering, Simulation Enginee
兩個月以前更新 兩週內11-30人應徵
2021-07-14

PDE Sr. Technology development Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
Micron’s Assembly Package Technology Development team in Taiwan is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end , bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification side by side with
一個月以前更新 兩週內0-5人應徵
2021-10-18

ENGINEER, PACKAGE CHARACTERIZATION

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
Micron PDE Package Characterization Engineer Job Description As a PDE Package Characterization Engineer you will be primarily responsible for defining, planning, and characterizing new packages, new packaing materials in order to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management. You will also be required to identif
兩個月以前更新 兩週內0-5人應徵
2021-06-23

Package Materials Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
As a PDE Senior Package Materials Engineer (Pathfinding) you will be primarily responsible for defining, planning, and characterize new packaging materials requirements for advance packaging such as cryogenic applications, advance SER mitigated packaging in order to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management.
一個月以前更新 兩週內6-10人應徵
2021-10-06

Engineer, Package RDA

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
The Advanced Packaging Technology Development group supports Micron with packaging solutions for wafer and die level forms. As a Realtime Defect Analysis (RDA) Engineer in the Advanced Packaging Technology Development department, you will be responsible for managing defect analysis within the rapidly evolving area of advanced IC packaging and next generation 3D Interconnect (3DI) projects. The sco
兩個月以前更新 兩週內6-10人應徵
2021-06-23

Package Reliability Engineer -BLR

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
As a Package Lab Engineer in the DRAM and Emerging Memory Quality/Reliability Assurance (DEMQRA) team at Micron Technology Inc., you will be responsible for developing, maintaining, and improving characterization methods and Failure Analysis (FA) for microelectronics packages and PCB Assemblies.  This responsibility includes specifying and improving processes, selecting equipment, and interpretati
兩個月以前更新 兩週內0-5人應徵
2021-06-23
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 五年以上工作經驗
  • 待遇面議
As a Global Quality (GQ), Package Reliability & Lab Sr. Manager at Micron Technology Inc., you will be managing both Package Reliability and Characterization lab. You are responsible for driving lab performance to support Product and Package Reliability Qualification. Interfacing with internal and external stakeholders to identify resources required to support the qual plan. In addition, you are
兩個月以前更新 兩週內0-5人應徵
2021-09-23

PACKAGE RELIABILITY ENGINEER

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 工作經驗不拘
  • 待遇面議
As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., you will be responsible for package quality and reliability for one of Micron’s product lines. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced; and providing recommendations on product release based on package reliabi
兩個月以前更新 兩週內0-5人應徵
2021-06-23

ENGINEER PACKAGE STACKING

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 一年以上工作經驗
  • 待遇面議
Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with chip to substrate or chip to wafer interaction Familiar with TCB(thermal compression bonding) process Familiar with assembly and packaging processes Familiar with SPC, JMP data analysis and DOE matrix design Process problem identification and solving Work effectively to pr
兩個月以前更新 兩週內0-5人應徵
2021-07-14
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