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1075 筆查詢結果

HBM TD Process Integration Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 一年以上工作經驗
  • 待遇面議
As a Process Integration engineer within our Technology Development organization at Micron Technology, you will be part of a world-wide advanced packaging team responsible for next generation high bandwidth memory (HBM-DRAM) pathfinding and development. You will be responsible for vertical integration efforts across FABs, wafer level packaging and assembly unit processes. Roles & Responsibilities
兩週以前更新 兩週內6-10人應徵
2022-01-12

MTB HBM/TSV Process Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 三年以上工作經驗
  • 待遇面議
Job Description As a MTB Assembly Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly
兩週以前更新 兩週內11-30人應徵
2022-01-12

HBM/TSV Assembly Engineer Manager

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 五年以上工作經驗
  • 待遇面議
Job Description As an Assembly Engineering Manager at MTB HBM/TSV products, you will be responsible for providing leadership and management for both Process Engineering and Equipment Engineering Groups in your area. You will be involved in ensuring the process is in control and quality/reliability of the product meets expectations, achieving business and organizational objectives, developing/defin
兩週以前更新 兩週內0-5人應徵
2022-01-12

HBM/CEM Assembly Process Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
As a Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by a
兩週以前更新 兩週內0-5人應徵
2022-01-12
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 工作經驗不拘
  • 待遇面議
The Advanced Packaging Technology Development group supports Micron with packaging solutions for wafer and die level forms. As a Plating Process Engineer in the Advanced Packaging Technology Development department, your primary responsibility will be the process development for very key layers of HBM (high bandwidth memory). This includes new tool/ new material evaluation and process parameters tu
兩週以前更新 兩週內11-30人應徵
2022-01-12

MTB Assembly Process Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 二年以上工作經驗
  • 待遇面議
As a MTB Assembly Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related
兩週以前更新 兩週內0-5人應徵
2022-01-12

ENGINEER, PACKAGE PROCESS INTEGRATION

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
Responsibilities and Tasks: - Design, execute, and analyze experiments to improve yield and quality. - Engage and/or lead cross-area engineering teams to solve process integration issues. - Own and ensure that the in-line process spec limits are set at optimum and reviewed as needed. - Partner with process team to better forecast and balance yield, output and process issues. Qualifications:
兩週以前更新 兩週內0-5人應徵
2022-01-12

Assembly Engineer

FULL_TIME
台中市西屯區
瑞士商賽明運動用品股份有限公司台灣分公司
  • 專科 大學 碩士
  • 五年以上工作經驗
  • 待遇面議
Product Management, Project Engineering, Quality, Design Engineering, Oldenzaal Assembly, and Global Warranty. They Assembly Engineering position is located in Taichung and will be responsible for working directly with assembly factories located in China, Southeast Asia, and Taiwan. You will support CSG assembly in Europe by sharing SOPs and other information as needed. As an Assembly Engineer
一週以前更新 兩週內0-5人應徵
2022-01-19

PDE - Sr. Engineer, Process development

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 一年以上工作經驗
  • 待遇面議
•Micron’s Package Development Engineering (PDE) team in Taiwan is looking for a motivated and experienced individual contributor for this position in Process Development team and warpage tuning team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron's memory from pathfinding through to NPI start up and certificat
兩週以前更新 兩週內11-30人應徵
2022-01-12

Assembly CR2 Process Manager

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 五年以上工作經驗
  • 待遇面議
Job Description - As an Assembly Process Engineering Manager, responsible for leading and managing the activities and operation of a Process Engineering, working together with other functional groups locally and/or globally to accomplish organizational and business objectives by ensuring the process is in control and quality/reliability of product meets expectation; sustaining and improving yiel
兩週以前更新 兩週內0-5人應徵
2022-01-12
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 五年以上工作經驗
  • 待遇面議
As an Experienced Advanced Package TD Process Integration Engineer in Micron Taiwan you will be expected to define technology requirements, integrate process flows, build program plans and secure resources to drive process technology development programs. You will take ownership of these programs or projects through to deployment of technology nodes into our High Volume Manufacturing (HVM) operati
兩週以前更新 兩週內0-5人應徵
2022-01-12
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
1. Advanced package technology (chip stacking, 2.5D or 3D) research and development 2. Process development of assembly stacking processes 3. Experience with different die stacking processes like flipchip attach and TCB (thermocompression bonding) 4. Experience with materials used during stacking processes like flux and NCF (non-conductive film) 5. Collaboration with external suppliers to develop e
兩週以前更新 兩週內0-5人應徵
2022-01-12
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 碩士
  • 一年以上工作經驗
  • 待遇面議
As Process Integration Engineer at Micron Technology, Inc., you will be responsible for providing leadership to drive improvement in various pillars of manufacturing, package development a in Micron’s Assembly. This involves spearheading or integrating a network level projects that aims to define or enhance manufacturing and/ or business processes, institute better materials and other improvement
一週以前更新 兩週內11-30人應徵
2022-01-17

PDE TD process integration, Sr./Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
As Sr/Engineer for PDE Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for NAND, mNAND and DRAM, Controller in Micron. To drive new Technode process readiness and improving the yield, quality and reliability with process characterization and
兩週以前更新 兩週內0-5人應徵
2022-01-12

PDE SENIOR/ENGINEER - PIE PWF HBM

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 三年以上工作經驗
  • 待遇面議
Job description: As PWF HBM PIE (package integration engineering) Engineer, in close collaboration with Multi-functional Groups ( BU, APTD, DESIGN, Site Engineering, Central Team, KEG) , is responsible for the effective and efficient execution of new product and integration from NPN (new product notification) to high volume manufacturing. The success of this position will be assessed by the timely
兩週以前更新 兩週內0-5人應徵
2022-01-12
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