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Senior Manager, Packaging Engineering

FULL_TIME
台中市北屯區
Western Digital_新加坡商西部數據有限公司台灣分公司
  • 大學以上
  • 十年以上工作經驗
  • 待遇面議
As package design senior manager leads package design team for multi-product package design wins including flip chip, hybrid and wire bonding packages and works with global cross-functional teams to guide development of package designs to meet SI PI performance, thermal and mechanical consideration.  Be responsible for management to meet strategic KPI and adapt OKR success. A management role in pa
2小時以前更新 兩週內0-5人應徵
2021-12-02

Manager, Package Tech Integration

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 五年以上工作經驗
  • 待遇面議
Package Integration development : Key responsibilities and qualities in the JD: Micron's Package Development Engineering team in Taiwan is looking for a manager position in Tech Dev Team. A good candidate will be developing, configuring and optimizing Packaging processes (wafer level, unit level) for Micron's memory from pathfinding through development to NPI start up and certification side by sid
兩個月以前更新 兩週內0-5人應徵
2021-06-23

Package Materials Engineer

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
As a PDE Senior Package Materials Engineer (Pathfinding) you will be primarily responsible for defining, planning, and characterize new packaging materials requirements for advance packaging such as cryogenic applications, advance SER mitigated packaging in order to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management.
一個月以前更新 兩週內6-10人應徵
2021-10-06
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 五年以上工作經驗
  • 待遇面議
As a Global Quality (GQ), Package Reliability & Lab Sr. Manager at Micron Technology Inc., you will be managing both Package Reliability and Characterization lab. You are responsible for driving lab performance to support Product and Package Reliability Qualification. Interfacing with internal and external stakeholders to identify resources required to support the qual plan. In addition, you are
兩個月以前更新 兩週內0-5人應徵
2021-09-23

SR ENGINEER- PACKAGE SILICON INTEGRATION

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 工作經驗不拘
  • 待遇面議
As an Integration Engineer in Micron's Package Development Engineering (PDE) Group, you will be responsible for driving leading edge Technode development. You will collaborate with various functional teams such as silicon design, package design, wafer fab, package integration, test and QRA to formulate and execute the characterization and qualification plan. Demonstration of the technology is show
兩個月以前更新 兩週內0-5人應徵
2021-06-23

Senior MTS -PACKAGE RELIABILITY R&D

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 碩士以上
  • 工作經驗不拘
  • 待遇面議
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainab
兩個月以前更新 兩週內0-5人應徵
2021-09-09

Senior Substrate Design Engineer

FULL_TIME
台中市北屯區
Western Digital_新加坡商西部數據有限公司台灣分公司
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
Job Responsibility 1.Substrate lay out and design 2.Design package outline drawing and strip drawing 3.Design bonding diagram Job Requirement 1.   Major subject is science and engineering 2.   Must have electronics and mechanics concept. 3.   Familiar with Autodesk 2000 version up. 4.   Fluent English communication skill
2小時以前更新 兩週內0-5人應徵
2021-12-02

Senior Design Engineer- Aluminum Bike

FULL_TIME
台中市南屯區
Specialized Bicycle Components, Inc._美商斯貝特自行車股份有限公司台灣分公司
  • 大學 碩士
  • 三年以上工作經驗
  • 待遇面議
Innovation has guided our every decision since 1974. As more riders of all ages get on the roads, trails, and streets than ever before, we're here to do the best work of our lives to push the greatest human powered machine into the future each and every day. We're a team of barrier-breakers, disrupters, and problem solvers. We're committed to building a diverse and inclusive workforce where every
1天以前更新 兩週內0-5人應徵
2021-12-01

ENGINEER PACKAGE STACKING

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 一年以上工作經驗
  • 待遇面議
Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with chip to substrate or chip to wafer interaction Familiar with TCB(thermal compression bonding) process Familiar with assembly and packaging processes Familiar with SPC, JMP data analysis and DOE matrix design Process problem identification and solving Work effectively to pr
兩個月以前更新 兩週內0-5人應徵
2021-07-14
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 碩士以上
  • 工作經驗不拘
  • 待遇面議
Micron in Taiwan Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM. Micron’s Taiwan sites include sales and technical support in Taipei along with state-of-the-art fabrication facilities in Taichung a
兩個月以前更新 兩週內6-10人應徵
2021-07-16

Associate Design Engineer – Bike

FULL_TIME
台中市南屯區
Specialized Bicycle Components, Inc._美商斯貝特自行車股份有限公司台灣分公司
  • 專科 大學 碩士
  • 工作經驗不拘
  • 待遇面議
Innovation has guided our every decision since 1974. As more riders of all ages get on the roads, trails, and streets than ever before, we’re here to do the best work of our lives to push the greatest human powered machine into the future each and every day. We’re a team of barrier-breakers, disrupters, and problem solvers. We’re committed to building a diverse and inclusive workforce where every
1天以前更新 兩週內0-5人應徵
2021-12-01

ENGINEER, PACKAGE CHARACTERIZATION

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
Micron PDE Package Characterization Engineer Job Description As a PDE Package Characterization Engineer you will be primarily responsible for defining, planning, and characterizing new packages, new packaing materials in order to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management. You will also be required to identif
兩個月以前更新 兩週內0-5人應徵
2021-06-23
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 工作經驗不拘
  • 待遇面議
JOB DESCRIPTION: Micron’s Assembly Package Technology Development team in Taiwan is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end , bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification
兩個月以前更新 兩週內0-5人應徵
2021-07-14
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學以上
  • 三年以上工作經驗
  • 待遇面議
Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development PWF(MEOL) and Assembly Process Integration for 3DI/TSV HBM(High Bandwidth Memory) Familiar with JMP data analysis and DOE matrix design and analysis Material characterization experience Process problem identification and solving Work effectively to produce cross sections cooperation Acc
兩個月以前更新 兩週內11-30人應徵
2021-08-20

SENIOR ENGINEER, NVM PDE - PIE

FULL_TIME
台中市后里區
台灣美光(台灣美光晶圓科技股份有限公司/台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司)
  • 大學 碩士
  • 五年以上工作經驗
  • 待遇面議
Job Description An PDE PIE senior Engineer is responsible for managing overall NPI qualification process from design review until safe launch for successful ramp in HVM and meet develipment milestone and package quality and relibility requirement of the package. Must interface with package design team, define/develop BOM and process flow, a point of contact with the BU/PDT/Quality and Reliabilit
兩個月以前更新 兩週內0-5人應徵
2021-06-23
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