Senior Application Engineering Manager

Location: Thailand Requirements: 1. Bachelor or above degree in Chemical Engineering, Material Engineering, Mechanical Engineering, or consideration of an equivalent combination of education and experience. 2. 11 to 14 years of relevant experience in Server, Storage and Networking products. 3. Project Management 4. Leadership 5. Communication 6. PCB related: ● Good knowledge of PCB materials – Core, PP, copper foils and different types of via filling materials. ● Ability to use PCB software, such as ODB++, to read PCB design files for deep understanding and analysis of PCB designs. ● Familiarity with PCB designs in PTH, via in pad, skip vias, staggered vias, buried vias, VIPPO, backdrill; and different types of PCB surface finishes. ● Understanding of PCB key manufacturing processes, such as sequential lamination, drilling, chemical/electrical plating and the processes for different types of vias manufacturing. ● Deep understanding the thermal mechanical behaviors in PCB assembly process for a PCB with asymmetrical design ● Experience with a variety of PCB qualification methods for rigid and rigid-flex PCBs, and typical failures. ● Good knowledge of IPC standards (IPC-A-600, IPC-6012, IPC-6013, etc.) 7. Soldering process related: ● Good knowledge of DFM for SMT & wave, and solder materials (solder alloys, solder pastes, fluxes, etc.) ● Expertise in soldering techniques (wave soldering, reflow soldering, hand soldering, selective wave soldering, vacuum soldering) ● Experience in SMT and rework of hyper-BGAs in B2B assembly, and other processes -- PTH Rework, Cleaning Processes, Conformal Coating, Underfills / Edge bonding, etc. ● Familiarity with evaluation & qualification soldering materials, chemicals, bonding/coating materials and solder joint reliability ● Good understanding of potential failures in seach process and failure analysis methodologies, both destructive & non-destructive ● Familiarity with PCBA assembly equipment ( solder paste printers, pick-and-place machines, reflow ovens, wave soldering machines) ● Knowledge of relevant industry standards, IPC-A-610, IPC-9701,IPC-9704, IPC-9201 etc. 8. Thermal management related: ● Good knowledge of various thermal management techniques (heat sinks, fans, liquid cooling, phase-change cooling, immersion cooling) and the thermal performance of different types of TIMs ● Understanding of the thermal requirements in products of switch, server, networking, data storage, ML & AI etc.. Identify and implement innovative thermal solutions to meet challenging design requirements. ● Experience in thermal modeling and analysis techniques (finite element analysis, lumped parameter modeling) ● Develop and execute rigorous thermal validation and testing plans for both thermal performance and reliability ● Collaborate with hardware and software engineers to optimize thermal performanceand reliability. ● Familiarity with industry standards (e.g., IEC, Telcordia) ● Understanding of reliability engineering principles and failure mechanisms related to thermal stress ● Stay up-to-date with the latest advancements in thermal management technologies and industry standards. ● Collaborate with customers, industry partners and academic institutions to explore new thermal solutions. Responsibilities: ● Responsible for understanding the customer’s technical roadmap, product design architecture and applications ● Understand manufacturing requirements and identify capability deficiency in PCB design, soldering processes and thermal management. ● Evaluate potential manufacturing impact from the design concept of each product. ● Negotiate trade-offs for DFX issues with customers, suppliers of PCB, components and manufacturing for delivering a cost-effective solution with proven reliability. ● Investigate all manufacturing processes related technical issues and provide technical solutions for products in the full life cycle. ● Manage multiple projects simultaneously and meet tight deadlines.