69762_Market Intelligence Manager_Packaging and Wafers (Taipei)

Scope of Position: Develop in-depth understanding of the advanced package and wafer value chain players within the semiconductor industry and develop/maintain models that connect the growth of advanced packaging and wafer markets. The scope also includes a deep understanding on direct and emerging competitors, analyzing their strategies, market position, and operational capabilities. In addition to the semiconductor market, this role will cover adjacent markets utilizing glass materials, such as DRAM, HBM, wafer-level capping, and wafer-level optics, to provide complete environmental analysis. Day to Day Responsibilities: • Monitor, analyze and synthesize performance of advanced package & wafer value chain players, focusing on the link between semiconductor advanced package & wafer growth and P&W revenues. • Conduct in-depth analysis of key competitors to analyze their behavior, including their strategy in advanced package, track and model competitor manufacturing capacity, triangulate their demand & share and potential threats to our business. • Communicate key findings to division leadership and beyond via regular reports, alerts, presentations, etc. • Manage external consulting studies and be the liaison with these third parties. • Develop and understanding of the competitors in the value chain to support product team's environment understanding.