[General Summary] As a forward-thinking technology company, Augentix advances the limits of innovation in "Industrial and Embedded IoT" to deliver next-generation experiences and accelerate digital transformation toward a smarter, more seamlessly connected world. You will join a team building production-grade Linux SDKs for camera-centric industrial and edge devices. You will help define how our system software is structured, built, packaged, and delivered—balancing openness, modularity, and long-term maintainability. [Responsibilities] ★ Architect and implement a modular SDK structure for embedded Linux systems using the Buildroot and Yocto. ★ Define directory layout, layer hierarchy, and build integration strategy for key system components (e.g., bootloader, kernel, device tree, root filesystem, multimedia and AI stack). ★ Integrate and maintain Linux kernel 6.x configurations and patches for supported platforms. ★ Design and maintain the build configuration and packaging structure for our SDK, supporting both Yocto and Buildroot environments. ★ Deliver installable SDKs including cross-toolchain exports, setup scripts, and development guides for external consumption. ★ Interface with DevSecOps to support reproducible builds, licensing compliance, and secure release handling. ★ Monitor and adopt upstream practices from major BSP and SoC vendors for long-term compatibility and ease of maintenance. ★ Occasional business travel across APAC and other regions may be required. [Minimum Qualifications] ★ Master's degree in Electrical Engineering, Computer Science, or related field with 3+ years of relevant experience, or a PhD in a related field. ★ Deep experience with the Buildroot and Yocto Project. ★ Proficient in Linux kernel configuration and integration for ARM-based SoCs. ★ Strong understanding of cross-compilation toolchains, sysroot management, and embedded SDK packaging. ★ Solid programming/scripting skills (Bash, Python, Make). [Preferred Qualifications] ★ Experience designing SDKs for commercial embedded platforms (e.g., IoT, automotive, industrial edge). ★ Experience with Buildroot/Yocto-compatible security hardening and SBOM workflows. ★ Understanding of CI/CD flows for firmware or SDK packaging. ★ Comfortable working in a globally distributed, cross-disciplinary engineering team.
待遇面議
(經常性薪資達 4 萬元或以上)
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