Key Responsibilities: Build and flash the BSP (Board Support Package) for TI and Rockchip ARM platforms onto production boards. Write technical documentation, report issues, and maintain effective communication with platform vendors. Collaborate with platform vendors to develop and integrate features such as: GPU, FrameBuffer, and related display subsystems (e.g., DRM/KMS, DRI, V4L2 overlay) USB interface functions including USB OTG, USB ADB, USB FTP, USB Ethernet, and related USB gadget/device modes Industrial communication interfaces such as CAN bus, RS485, and RS232 Hardware robustness features such as FRAM, power-loss data retention, and fail-safe mechanisms Develop and maintain test programs to validate required functionalities. Set up the software and hardware environment required for BSP compilation. Establish standard operating procedures (SOPs) for platform development workflows. Design and implement standardized testing processes for BSP validation. Summarize component specifications and provide input for next-generation board design. Perform system performance monitoring and optimization to ensure efficiency and stability. Collaborate with platform vendors to develop BSPs, platform frameworks, and embedded Linux applications using C/C++. Work closely with electrical and mechanical engineers to design and manufacture embedded Linux-based devices. Cooperate with software engineers to implement display features such as GPU rendering, FrameBuffer composition, and multi-layer display management.
待遇面議
(經常性薪資達 4 萬元或以上)
Background: 2+ years of experience in Linux device driver development for embedded systems. 2+ years of full-time system software development on Linux-based platforms. Familiar with standard software development workflows, including Git, bug tracking systems, and design documentation. Proficient in scripting and system administration on Debian/Ubuntu platforms. Skills: Skilled in system-level debugging, tracing, and performance analysis using tools such as perf, ftrace, and others. Hands-on experience with hardware interfaces such as ADC, GPIO, SPI, and I2C. Practical experience in communication drivers, SoC BSP development, operating systems internals, and bootloader integration. Experience working with 64-bit ARM processor architectures.
◆ 分紅/配股 1.員工紅利 ◆ 獎金/禮品類 1.年終獎金 2.三節獎金/禮品 ◆ 保險類 1.勞保 2.健保 3.員工團保 ◆ 休閒類 1.國內旅遊 2.國外旅遊 ◆ 請 / 休假制度 1.週休二日 2.特休/年假 3.女性同仁生理假 ◆教育訓練 1. 提供內部教育訓練 2. 外部教育訓練