Senior/Principal Packaging Engineer

09/11更新

安科諾科技有限公司本公司其他工作

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應徵

應徵人數 0~5 人

工作內容

★Job Purpose: Drive and execute packaging development with OSATs, and support iCana team for package define, assembly build, package qualification, and safe launch. ★Principal Accountabilities: 1. Work with OSATs for package development and execute the projects from prototying, NPI, to Mass Production 2. Cooperate with design/engineering team for package define, assembly build, and package qualification plan 3. Provide build-related document (build instruction, bonding diagram, POD, BOM..etc) 4. Responsible for package yield management, on time delivery and good quality of deliverables 5. Support failure analysis, root cause finding, and continuous improvement process 6. Oversee the new technologies and package innovation

職務類別

工作待遇

待遇面議

（經常性薪資達 4 萬元或以上）

工作性質

全職

上班地點

新北市新店區寶高路28-2號 (寶高智慧產業園區)

遠端工作

管理責任

不需負擔管理責任

出差外派

無需出差外派

上班時段

日班

休假制度

週休二日

可上班日

一個月內

需求人數

1人

條件要求

工作經歷

5年以上

學歷要求

碩士

科系要求

材料工程相關、機械工程相關、電機電子工程相關

語文條件

英文 -- 聽 /精通、說 /精通、讀 /精通、寫 /精通

擅長工具

不拘

工作技能

不拘

其他條件

1. Minimum 5 years of working experience, preferably in the role of package process engineer in either design houses or OSATs 2. Good understanding on IC assembly technologies such as QFN, LGA, flip chip, bumping, WLCSP, SiP, and various substrate/leadframe/PCB solutions 3. Good communication skill with internal/external parties 4. Excellent problem-solving skill 5. Engages interest and participation of others and has a collaborative approach to working with others 6. Systematic, proactive and meticulous in work approach 7. Good command of written and spoken English

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