Job Responsibilities|工作內容: • Develop, optimize, and maintain SMT production processes to ensure high yield and quality 建立、優化並維持SMT製程,確保高良率與品質穩定 • Define and control process parameters for solder paste printing, pick-and-place, reflow, and AOI/AXI inspection 設定並管控錫膏印刷、貼片、迴焊爐、AOI/AXI檢測等製程參數 • Conduct root cause analysis and implement corrective actions for process-related defects 針對製程異常進行原因分析並執行改善措施 • Collaborate with NPI (New Product Introduction) teams to support prototype builds and process validation 與新產品導入團隊合作,支援樣品製作與製程驗證 • Design and maintain process documentation, including SOPs, work instructions, and control plans 撰寫並維護製程文件,如標準作業程序、作業指導書與管制計畫 • Evaluate and introduce new equipment, materials, and technologies to improve efficiency 評估並導入新設備、材料與技術以提升生產效率 • Support cross-functional teams in yield improvement, cycle time reduction, and cost optimization 支援跨部門專案,提升良率、縮短工時並降低成本
月薪55,000~60,000元
(固定或變動薪資因個人資歷或績效而異)Qualifications|資格條件: • Bachelor’s degree in Mechanical, Electrical, Industrial, or related engineering field 機械、電機、工業工程或相關科系學士學位 • 4+ years of SMT process experience in electronics manufacturing 具備2年以上電子製造業SMT製程經驗 • Familiarity with SMT equipment (e.g., DEK, Fuji, Yamaha, Vitronics, Koh Young) 熟悉SMT設備(如DEK、Fuji、Yamaha、Vitronics、Koh Young) • Knowledge of IPC standards and process capability analysis (CPK, GR&R) 熟悉IPC標準與製程能力分析(CPK、GR&R) • Proficient in data analysis, DOE, and problem-solving methodologies 熟悉數據分析、實驗設計與問題解決方法 • Basic English reading and writing skills for technical documentation 具備基本英文讀寫能力以處理技術文件