「視訊影像產品事業部 電子設計主任/高級工程師/工程師」的相似工作

This vacancy is open for talent pool collection. We will contact you if we have proper vacancies that fit with your profile. Job Mission Represent manufacturing and act as gatekeeper from manufacturing to D&E function Add value in overall manufacturing processes such as forming, machining, joining, and assembling Job Description Contribute to the solution of faults and takes the necessary initiatives and practical decisions to ensure zero repeat Identify gaps and drive assigned process improvement projects and successful delivery Initiate and drive new procedure changes and projects Develop and maintain networks across several functional stakeholders Prioritize works and projects based on business situation Transfer knowledge and train colleagues on existing and newly introduced products Education Master degree in technical domain (e.g. electrical engineering, mechanical engineering, mechatronics) Experience 3-5 years working experience in design engineering Personal skills Show responsibility for the result of work Show proactive attitude and willing to take initiative Drive for continuous improvement Able to think outside of standard processes Able to work independently Able to co-work with different functional stakeholders Able to demonstrate leadership skills Able to work in a multi-disciplinary team within a high tech(proto) environment Able to think and act within general policies across department levels Diversity and inclusion ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company. Need to know more about applying for a job at ASML? Read our frequently asked questions.

1.客戶設計問題處理及產品規格制定 2.對所專案進行產品硬體設計及問題解決 3.跨部門工作協調與處理

1. 手提式鍵盤按鍵產品之組立結構設計圖和零件圖之設計與審查。 2. 手提式鍵盤按鍵產品之結構開模、檢討、修正和量產確認核可。 3. 手提式鍵盤產品之按鍵結構核心技術研發、修正和確認核可。 4. 鍵盤新材料的設計運用。

-負責輸入裝置相關電子產品硬體設計開發，熟悉電路設計 -硬體設計驗證與除錯 -工廠端開發階段試產支援與規劃 電腦週邊 包含筆電鍵盤、桌上型鍵盤、配件及電競等相關人機介面產品

1. 視訊影像產品EMI/ESD問題修改與對策 2. 需會操作ORCAD與Allegro Layout軟體

1. 鍵盤背光模組設計開發 2. 供應商新機種開發協調及管理 3. 生產問題協助與分析

1. 手提式鍵盤按鍵產品之組立結構設計圖和零件圖之設計與審查。 2. 手提式鍵盤按鍵產品之結構開模、檢討、修正和量產確認核可。 3. 手提式鍵盤產品之按鍵結構核心技術研發、修正和確認核可。

Responsibilities: 1.技術可行性分析 2.硬體線路設計 3.硬體設計審查和BOM產出 4.審查 PCB Layout 5.執行開機測試 和執行除錯 Work Location: ●新北市土城區自由街2號

鏡頭光學或機構設計及驗證，建立鏡頭規格及品質規範

1.視訊影像產品機構設計與開發 2.機構材料與製造工藝評估 3.樣機製作與測試驗證 4.撰寫技術文件與分析報告

FIH作為全球移動通訊設備領導廠商，持續擴展多元商業機會，跨足通訊產品生產製造、自動化機器設備研發、車載軟硬體整合研發等類別。我們相信-創新源於開放的思維和無限的可能性。我們追求的不僅僅是技術的突破，更是一個共同創造的過程，園區智能生產線連接著各個環節，我們的產品從零件到成品，都經過嚴格的品質控管，確保最優質的創新產物。 我們歡迎不同背景、不同專業領域的人才加入我們的團隊! 【主要工作職責】 1.負責AI行動裝置,手機與物聯網（IoT）相關產品之電子EE電路設計與研發。 2.執行EE基頻功能測試與問題除錯，確保產品性能與穩定性。 3.持續追蹤並研究基頻領域之新興技術，導入創新解決方案以提升產品競爭力。 4.與製造端協同合作，參與試產與量產計畫，並推動良率提升與製程優化。 5.跨部門協作並與客戶進行技術溝通，確保專案需求準確落實並維持良好合作關係。 6.其他主管交辦相關工作任務。

1. PCB 設計（含原理圖設計、佈局佈線、Gerber 輸出）。 2. 客戶服務(PCIe/USB3相關) - 協助客戶釐清技術問題並提供可行解決方案。 - 參與客戶專案評估與設計審查（Design Review，含原理圖與佈局）並提出建議。 - 協助客戶進行產品特性分析與測試驗證。 3. 具跨部門協作與專案支援能力。 作為硬體研發工程師，您將成為我們團隊中關鍵的成員之一。您的工作將有助於產品的開發和改善，確保我們的產品能夠達到高標準的品質和性能。此職位的發展前景良好，並提供豐富的學習和專業成長機會。 如果您符合我們的要求並對此職位感興趣，請盡快申請並表達您的興趣。我們期待能夠與您共事，一起實現更好的產品和更大的成功。

1. 產品硬體研發 2. 電⼦電路硬體分析、電路設計與驗證及除錯 3. 零件料號申請、BOM表建立與修改 4. 跨單位研發團隊合作開發設計、量測驗證、認證、問題協調及解決 5. 報告整理製作 6. 試產階段支援生產單位並協助導入量產 7.協助解決試產不良分析問題 8. 主管交辦與事務工作

1.電路圖繪製、零件選用 2.協同Layout工程師進行PCB設計 3.BOM製作及協助助工備料 4.執行相關PCBA及整機測試 5.能烙鐵作業 6.與供應商討論零件規格 7.EMI/EMC外測並能解決大部份的問題 8.依專案開發的時程，支援工廠之技轉

1. RFI /RFP/RFQ 規格確認與可行性評估. 2. IP Camera 及AIOT產品硬體平台評估 / 設計 / 驗證與優化. 3. 專案試產跟進DFM/DFC、良率改善與量產協助. 4. Technology Support Customer. 5. 能獨立工作及跨部門協調整合.

工作內容: 硬體設計 基本迴路構成設計 方案及主要零件選擇 工程樣品 及 零件表製作 及試作 與配合工廠協調 共同設計開發 產品性能測試及測試報告撰寫 規格確認 驗證除錯 規格書及日程管理 EMI, ESD, EMC, 認證測試 跨部門（軟體、品保 QC/QA、生產）協作，完成產品技術轉移並導入量產 RMA 分析對應 協助主管完成時程內交辦事項 主要使用電子郵件和SNS（TEAMS 、WECHAT）與日本總公司以英語溝通. Experienced in designing, developing and evaluating CPU boards. Video related professional design split or experience. Maintaining MOSFET circuit design skills Hardware-Circuit design with more than 7 years of mass production start-up experience. Overseas customer business management & communication experience. A person who is interested not only in the development of computer equipment but also in the development of products that apply electrical technology in other fields. 必要經歷： 影像相關產品 硬體開發 設計迴路 組裝製品 Linux / android 軟體搭配 嵌入式產品設計 多層PCB設計 IOT 物聯網 微處理器等相關產品開發 對開發新產品有興趣者 CPU board system design experience Future: Those who are not related to computers but are willing to take on the challenge of developing home appliances.

Responsibilities include: 1. Act the staff/sr. role to develop shelf controller module inside OCP ORV3 21 " or 19" rack to monitor and control Power and BBU shelf for data center. 2. Familiar with ARM Cortex A7 BMC AST2600/2620 chip or Intel x86 CPU design. 3. Experiences for Linux embedded board bring up and debugging. 4. Good knowledge of protocol for IPMI, I2C, UART, SPI RS485, Redfish. 5. Lead for schematic circuit design and PCB layout review. 6. Familiar with, CanBus, Modbus communication, ethernet, PoE, eMMC, security feature 7. Familiar with DC/DC converter circuit design, buck-bust converter and flyback . 8. Signal integrity and power integrity measurement and verification. 9. Support RFI and RFQ activities and provide technical proposal. 10. Good communication in English, both oral and written. Capable to talk and discuss technical topic in front of customer. Requirements: • BS in Electrical Engineering or related field. Prefer MS degree or above • 8+ years of related experience in consumer PC/Industrial PC, laptop, RISC and networking related products; for Team Lead prefer least 3 years for people manager role. • Demonstrated strong leadership for product design in multiple-disciplinary environment. • Competence in customer focus innovation and able to drive technology growth • Good communication skills, people management, self-motivation and the ability to successfully deal with ambiguity are a must. • Cadence Orcad capture or Mentor PADS capture. The information we collect: We may collect personal information that you choose to submit to us through the Website or otherwise provide to us. This may include your contact details; information provided in online questionnaires, feedback forms, or applications for employment; and information you provide such as CV/Resume. We will use your information for legitimate business purposes such as responding to comments or queries or answering questions; progressing applications for employment; allowing you to choose to share web content with others or; where you represent one of our customers or suppliers, administering the business relationship with that customer or supplier.

1.矽光子高速光模組硬體設計 2.熟悉高速DSP晶片 3.解決光與電高頻電路並具備debug處理能力 4.具備2年以上採用 EML或矽光子光通訊產品相關經驗

1. 硬體線路設計規劃與繪製 2. PCB 走線及檢查 3. 硬體功能檢測及除錯 4. 評估零件與規格，選用適合零組件 5. 電源及訊號品質量測與問題分析 6. 系統功能及可靠度驗證 7. 認證(EMS, Safety) 8. MCU/SOC IOT硬體設計開發

1.負責新專案前期評估(RFI/RFP/RFQ)和導入。 2.專案進度控管，從NPI到MP階段展開project mileston、掌握產品開發、量產。 3.試產階段與 Function team 含 RD、工廠端協作，領導團隊完成專案目標。 4.專案風險評估、品質要求、與成本規畫。 5.與世界一級品牌大廠(Brand and OEM)之間溝通、協調與合作。 6.領導新技術研究與應用創新。