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1. Perform DC/RF characterization, analysis, and modeling of semiconductor devices, including GaN, HBT, pHEMT, switches, diodes, and passive components.
2. Develop EM substrates for ADS and Microwave Office (MWO) simulation tools.
3. Operate measurement equipment such as probe stations, network analyzers (PNA), and DC power supplies.
4. Support design kit development and release.
Overview:
MOSFET Design Team offers the innovative environment for talents to dive deep into the world of device design, platform development, and research. We offer working locations in both Xindian and Tainan. Come and join us to focus on the most cutting-edge semiconductor materials and applications!
Key Responsibilities:
• Develop and execute innovative device layouts in line with customer requirements, ensuring optimal functionality and efficiency.
• Partner with PE and Quality teams to enhance device reliability and address any arising issues in time.
• Establish and continuously optimize SPICE models to reflect the characteristics of both new and existing devices.
• Work alongside the PIE team and collaborate with external foundries, paving the way for the next generation of advanced devices.
• Drive the research and patenting efforts centered around novel designs, applications, and advanced materials, such as GaN and SiC.
• Accomplish additional tasks delegated by the supervisor.
Qualifications:
• A Master’s degree in EE, Physics, or a related field.
• Expertise in power devices, with a spotlight on UMOS, SGT, LDMOS, MLSJ, GaN and SiC.
• Comprehensive understanding of device physics and semiconductor manufacturing processes.
• Proficiency in semiconductor simulation tools.
• Strong English communication skills, catering to both technical and non-technical stakeholders.
1. MOSFET device research and development, especially Trench MOSFET/ SGT/ SJ.
a). Define device layout design and product design rule
b). TCAD simulations to build device structure
c). Device measurement
d). DOE plan for MOSFET new product
2. Interface with Product engineer and Marketing.
3. EFA/ PFA for trouble shooting
4. Build related patent for new design
1. Develop power device.
2. Design new device architectures and layout to meet customer's request.
3. Work closely with foundry team to reach mass production of the new process.
4. Device reliability judgment and analysis.
1.研發 SiC / GaN 新技術與產品設計,應用於 5G、IoT、AI Server、電動車等領域
2.負責新產品導入、封裝設計與量產評估
3.優化製程與成本結構,提升產品良率與競爭力
4.規劃與執行可靠度測試,撰寫技術文件並回應客戶導入需求
5.與內部團隊協作推進專案並支援技術移轉
1.Develop innovative SiC / GaN technologies and product designs for applications in 5G, IoT, AI servers, and EVs
2.Lead new product introduction, packaging structure, and mass production evaluation
3.Optimize process flow and cost performance to enhance product competitiveness
4.Plan and execute reliability testing, documentation, and customer technical engagement
5.Collaborate with cross-functional teams to ensure smooth project delivery and knowledge transfer