1. Participate in digital design specification, architecture definition, and microarchitecture planning.
2. Conduct FPGA prototyping, testing, and debugging of digital IP designs.
3. Collaborate closely with analog/mixed-signal design teams, firmware engineers, and system engineers to ensure successful product integration.
4. Develop, implement, and verify RTL code (Verilog/SystemVerilog) for high-speed Serdes interfaces including USB, DP, HDMI, DDR and PCIe.
1. 具 0~2年數位晶片設計,或有 0~5年類比晶片設計工作經驗。
2. 具備基本數位和類比電路知識,熟習標準晶片設計流程。
3. 熟習業界常用EDA tools, 或Matlab/ Simulink。
4. 研習過CMOS or BiCMOS 類比設計電路課程,對放大器有基礎認識。
5. Experience in these areas is preferred:
* BiCMOS or CMOS high-speed (>20Gb/s) circuit, Linear electrical amplifier &
equalizer, High-speed (>25G) CDR/PLL/SerDes.
* Linear optical laser driver & receiver (TIA + linear amplifier)
本職位負責類比IC電路的設計、驗證和除錯。這是一個高度技術性的職位,對公司的產品開發至關重要。我們正在尋找一位熱愛類比IC設計並具有相關經驗的人才,以推動公司的技術創新和發展。
如果您對這個職位感興趣,請投遞您的履歷表,我們立即與您聯繫。
We are seeking a skilled Analog IC Design Engineer with expertise in MIPI TX/ PLL design and sensor readout circuits. The ideal candidate will possess a strong foundation in analog design and a passion for developing cutting-edge solutions in a collaborative environment.
1.Design and implement MIPI TX and PLL circuits for high-speed data transmission.
2.Develop charge pump and LDO (Low Dropout Regulator) circuits to ensure efficient power management.
3.Design and optimize oscillator (OSC) circuits for precise timing applications.
4.Create sensor readout circuits, including CDS (Correlated Double Sampling), TDC (Time-to-Digital Converter), ramp circuits, DAC (Digital-to-Analog Converter), and comparators.
5.Collaborate with system engineers to define specifications and ensure alignment with overall project requirements.
6.Perform circuit simulations and analyses using tools such as Cadence, Spectre, or HSPICE.
7.Conduct design verification and validation through prototyping and testing.
8.Optimize designs for performance, power efficiency, and reliability.
9.Participate in design reviews and contribute to project documentation.
10.Provide support during the layout and fabrication process.
Preferred Qualifications:
1.Familiarity with IP design principles.
2.Experience with mixed-signal circuits.
3.Knowledge of low-noise and high-speed design techniques.
1. Analog circuit design and verification, such as OPAMP, Bandgap, ADC/DAC, PLL, and etc.
2. Power management circuit design and verification, such as LDOs, Charge Pumps, Switching Regulators, Gamma reference, and etc.
3. Whole chip integration with mixed-signal circuit.
4. HV I/O and ESD design.
Digital IC design engineer
- Familiar with Verilog RTL coding
- Familiar with digital design flow (pre-layout simulation, timing constraint, synthesis, post-layout simulation)
- Will be working on high speed Serdes IPs
- Experience or interest in all-digital PLLs or clock-data recovery circuits is a big plus
1. 負責數位IC設計整合:
a. 依客戶需求設計整合IC功能、工作頻率、介面規格、消耗功率等基本規格
b. 完成SoC系統架構設計,並依功能單元運作屬性區分區塊規格
c. 使用Verilog/VHDL編程內部功能並撰寫RTL code
2. 負責功能驗證與除錯
a. 制定功能驗證計畫
b. 審核驗證計畫的完整性和正確性
c. 進行基本模擬,確認RTL code的功能
d. RTL code寫入FPGA晶片連接系統測試,驗證RTL code
3. 負責時序分析與功耗管理
a. 產出邏輯閘級電路連線網表(netlist)
b. 進行SoC系統的時序分析
c. 進行SoC系統的功耗分析
4. 其它主管交辦事項
【必要條件】
1. 電機、電子、資訊工程或相關科系,碩士以上學歷
2. 三年以上 SoC 設計或整合經驗
3. 熟悉CPU子系統設計整合
a. 熟悉 ARM 架構,
b. 對 RISC-V 架構有基本認識
4. 熟悉數位IC前端設計流程,如RTL design、Lint/CDC、Synthesis、STA、LEC、ECO等
5. 具類比IP整合相關經驗,例如PHY、Serdes、PLL等
6. 熟悉IC後段設計流程,如DFT、MBIST、P&R、post-cilicon system level debugging等
1. Develop the verification plans and build up the verification environment.
2. Coverage hole analysis and improve coverage.
3. Build VIP and test cases
4. Work with RTL design team to debug failing test cases and resolve bugs.
The VLSI Physical Design Engineer is responsible for implementing and optimizing the layout of integrated circuits (ICs) from netlist to GDSII. This role plays a key part in turning high-level logic designs into manufacturable silicon chips, ensuring electrical performance, area, and power (PPA) goals are met, and the physical verification results are good.
Key responsibilities:
1. Derive full-chip and block-level physical design from netlist to tape-out (netilst to GDSII).
2. Floorplanning, power planning, placement, clock tree synthesis (CTS), routing, and layout verifications.
3. Work closely with front-end design, DFT, and package teams to ensure design closure.
4. Sign-off on signal integrity, power integrity, reliability and manufacturability including performing static timing analysis (STA), IR drop analysis, EM analysis, and physical verification (DRC/LVS/DFM).
5. Analyze, optimize and resolve congestion, timing, power integrity and signal integrity issues.
6. Create and maintain physical design automation Tcl scripts, and flows development for design implementation.
7. Interface with EDA tool vendors and foundries to ensure design compliance and manufacturability.
具備1~4之中1種以上的設計經驗。
1. 放大器應用電路; band-gap, op-amp, filter, etc.
2. 電源類比電路: DCDC, LDO, charge-pump, etc.
3. 信號處理電路: SAR ADC, sigma-delta ADC, DAC, etc.
4. 時脈產生電路: PLL, DLL, frequency synthesizer, etc.