「電性模擬工程師-新竹」的相似工作

1.SI/PI量測與模分析 2.網路分析儀與探針平台操作 3.量測與模擬數彙整 4.機台操作：網路分析儀 5.專業知識需求：電磁學、微波工程、SI/PI理論分析

1.PCB測試板工程變更/Debug/Maintain(需要焊接) 2.PCB測試板上機驗証(需PCB維修相關經驗，維修過LB、PC、BIB尤佳) 3.面對客戶、與客戶溝通工程內容

1. Ensure PKG design is optimized with SI/PI/Thermal requirements. 2. Create the PKG/RDL/Subtract SI 3D modeling and perform extraction of S-Parameters and RLGC model. 3. Full-wave modeling of VIAs, Connectors, Package and PCB channels, components using 3D full-wave EM tools. 4. Provide the CM(Construction rules) and Design Rules(guidelines) for the PKG/RDL/Subtract design. 5. Provide the Substrate manufacturing process and material property. 6. SI(Signal integrity) simulation and optimization on package stack-up, power/ ground plane assignment and optimization, decoupling cap locations to minimize power ground noise. 7. PI(Power integrity) analysis for state of art package/system designs, which include but not limited to package layout model extraction, transient noise analysis to meet the silicon noise spec, decoupling strategy and analysis. 8. CTK(Crosstalk) analysis and reduction on-package considering mutual-effect by on-die, on-silicon interposer and on-PCB. 9. SSN(Simultaneous Switching Noise)/SSO analysis for I/O (DDR5/4/3, LPDDR5/4/3, etc.) power domain. 10. Eye diagram(ZRZ/PAM4) and jitter analysis for CPS(Die Chip-PKG-System PCB) co-simulations. 11. Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements. 12. Familiar with assembly and substrate manufacturing process is a plus. 13. Familiar with programming/scripting in Java, VBScript, PERL, TCL, MatLab and/or equivalent. 14. Experienced in SI PI automation tool development with Python or PyAEDT is a plus. 15. Working with ASIC/HW/Production team.

【產品範疇】 1.DDI / TP / TDDI/ TCON/ Power等顯示相關產品 【工作內容】 1. SI/PI/EM issue solving, performance optimization, and design rule development 2. Chip/PKG/Board simulation and measurement for SI/PI/EM issue. 3. Co-work with system engineers, IC designers, and customers on product design-in tasks.

1. 進行訊號完整性與電源完整性(SI/PI) 模擬與優化分析 2. 執行SI實體卡測試量測與結果分析 3. 完成其他主管交辦事項

THE ROLE The Lead Signal Integrity Engineer is a technical leader responsible for advancing Isola’s laminate materials to meet and exceed high-speed electrical and signal integrity (SI) performance requirements. This role provides mentorship and direction to the Signal Integrity team in Taiwan, drives innovation in SI test methodologies, and ensures strong technical engagement with global OEMs. The Lead serves as a recognized authority in SI, bridging customer needs with material performance and representing Isola in the high-performance electronics community. KEY RESPONSIBILITIES: Customer-Facing Technical Support: • Lead technical engagement with OEMs and direct customers on high-speed laminate characterization. • Act as primary technical contact for SI-related design validation and adoption cycles. • Oversee the creation of technical reports, white papers, and collateral for internal and external use. Strategic & Technical Leadership: • Define and develop advanced SI measurement, modeling, and simulation methodologies. • Collaborate with Product Management, R&D, and Sales to ensure alignment of SI capabilities with product strategy. • Represent Isola as a thought leader through publications, conferences, and industry forums. Organizational Management: • Mentor, guide, and grow the Taiwan-based Signal Integrity Engineering team. • Establish scalable, cost-effective SI test methods that accelerate R&D and customer response. • Drive alignment with global Application Engineering teams to ensure best-in-class technical service. Technology & Standards Thought Leadership: • Maintain expertise in SI methods, PCB processing effects, and high-speed digital design requirements. • Contribute to industry standards development and support customer forums on SI requirements. QUALIFICATIONS & EXPERIENCE • 8+ years of experience in signal integrity engineering, PCB laminates, or high-speed design. • Expertise in VNA measurements, probing techniques, and advanced SI methodologies. • Experience with PCB manufacturing and processing effects on SI performance. • Demonstrated leadership and mentoring experience. • Proven record of technical publications, white papers, or conference presentations. EDUCATION • PhD or Master’s in Electrical Engineering or related field required. OTHER CONSIDERATIONS • Fluent in English – required for global communication and technical documentation. • Proficiency in Mandarin Chinese – strongly preferred for engagement with Taiwan/China teams and customers. • Ability to travel regionally and globally as needed.

1. 高/低速訊號完整性量測與分析 2. SI/PI量測與模擬分析 3. 產品故障分析 4. 量測報告整理與撰寫 (EVT & DVT Report) 5. 撰寫量測SOP 6. 儀器設備校正與維護 7. 其它主管交辦事項

1. Electromagnetic simulation and electrical modeling by using Ansys EM suite. 2. SI/PI high frequency / high speed signal integrity / power integrity / antenna radiation with Ansys EM/ADS systems. 3. 3D full wave FEM/FDTD large-scale simulation and validation with EMpro and HFSS HPC. 4. Signal emulation and performance simulation in PCB/Substrat of optical module.

工作內容 1. 負責Ansys SIwave/HFSS/Q3D 等高頻軟體技術支援，包含售前/售後支援、教育訓練 2. 拜訪客戶介紹、推廣軟體以及解決方案 3. 與原廠技術團隊對接，協助溝通/解決客戶問題、學習軟體新功能 4. 高頻相關工程專案規劃與執行 5. 支援公司市場行銷活動 ---------------------------------------------------- 本公司具備Ansys產品專業技術人員，擁有廣大的技術資源供學習， 市場遍及台灣、中國及東協等地。 我們不斷地開拓新技術及市場，誠摯希望有志一同的你加入~ 歡迎光學、電磁學、電子電路、電磁干擾、光波導、矽光子各領域專家加入我們的團隊!! 思渤科技培養的不只只針對工作需求的專業工程技術人才， 更是培養技術人才自身技術品牌的職涯延伸， 讓你不單只是單一技術在此發展， 而是廣闊長遠的打造出個人技術品牌知名度， 讓你在專業領域中與更多佼佼者一起發光發亮!! ｜遠距辦公。節省通勤成本。溝通不斷線｜ ☆業務試用期三個月通過後，即可申請遠距辦公方式！ ☆每週只需進公司辦公一天，剩下四天靈活運用外勤出差或在家辦公，節省塞車通勤時間，線上溝通快速不斷線。 ｜舒適好開公務車。公務拜訪便利又安全｜ ☆提供三年內新車預約公務拜訪使用，安全又舒適。 ☆不需自己養車，找車位，公司定期保養管理，外勤無負擔。 ｜薪獎優渥。輕鬆get百萬年薪！｜ ☆業績獎金 ☆盈餘獎金 ☆年終獎金 ☆中秋、端午獎金 ☆配發公務機 ☆結婚禮金/生育津貼 ☆推薦人才獎金 ☆近3年平均調薪幅度3~5%

主要產品為低軌道衛星地面站與5G毫米波基站，產品型態可分為設計代工與生產代工，具體工作內容如下： 陣列天線設計代工 1. 主動相位陣列天線設計與模擬 I. 電路板材挑選與疊構設計評估 II. 單元天線之設計與模擬 III. 陣列天線之設計與模擬 IV. 功率分配器設計與模擬，整合至陣列天線 V. 相移器晶片與陣列天線之整合 VI. 主動相位陣列天線控制單元設計 2. 主動相位陣列天線實作與量測 I. 電路板製作與打件 II. 天線控制單元驗證 III. 陣列天線輻射場型校正量測與最佳化，驗證波束指向準確性 IV. 產線用快速陣列天線量測系統設計與驗證 陣列天線生產代工 1. 主動相位陣列天線實作與量測 I. 基於客戶設計，提出製程改善建議 II. 電路板製作與打件 III. 陣列天線特性量測，包含天線控制單元驗證與輻射場型量測 微波被動電路與射頻收發機設計 1. TX/RX射頻電路規畫及設計 2. 分析及挑選適合材料 3. 畫電路線路圖及與電路佈局工程師溝通、協調並完成電路及送件完成PCB製作 4. 與機械工程師溝通並完成電路板與機械結構的組裝及量產可行性評估 5. 與軟/韌體工程師合作完成整體系統運作及生產測試 6. 電路板製作與打件 7. 電路板測試驗證及除錯分析 以上模組會整合進低軌道衛星地面站或5G毫米波基站 1. 射頻收發機與陣列天線整合設計 2. 整機組裝，系統特性測試驗證與除錯分析 產品驗證完成導入量產，客戶溝通與專案進行 1. 統籌公司內部資源，達成專案需求 2. 與客戶溝通技術問題，並轉知公司內部團隊研究改良 3. 協助產品導入量產，各項文件建立及產出 4. 出差至客戶處報告專案進度

1.負責 Probe Card（探針卡）之測試、維護、校正與效能驗證 2.進行 RF 高頻測試（含S參數、插入損耗、回波損耗、訊號完整性等量測） 3.分析測試數據，針對異常情況進行失效分析（FA）並提出改善方案 4.支援新產品導入（NPI）測試流程開發與驗證 5.協助開發與優化測試治具、負載板（Load Board）與測試程式 6.撰寫測試報告、建立標準作業流程（SOP）

[General Summary] As a forward-thinking technology company, Augentix advances the limits of innovation in "Industrial and Embedded IoT" to deliver next-generation experiences and accelerate digital transformation toward a smarter, more seamlessly connected world. We are seeking a PCB Design Engineer with strong theoretical foundation and simulation driven design methodology to lead high speed board level development. You will be responsible for defining and verifying board level electrical design, ensuring optimal signal integrity across multiple high speed interfaces. You will be supported by experienced layout engineers capable of implementing your design guidance and constraints, allowing you to focus on PCB circuit design and system validation. This position offers the opportunity to build structured PCB design practices, improve team capability, and drive electrical excellence through direct ownership of simulation and cross team collaboration. [Responsibilities] ★ Lead system level PCB electrical design for interfaces such as LPDDR4/5, USB 3.x, SDIO 3.x, MIPI and Ethernet. ★ Define PCB stack up and routing strategy to meet signal integrity objectives. ★ Perform circuit level simulations using tools such as PSpice. ★ Own schematic level electrical planning and define layout constraints for critical signal groups. ★ Provide guidance to supporting layout engineers to ensure adherence to electrical rules and best practices. ★ Correlate simulation results with lab measurements and assist in electrical issue root cause analysis. ★ Document simulation methodology constraint guidelines and validation reports. ★ Occasional business travel across APAC and other regions may be required. [Minimum Qualifications] ★ Familiarity with differential and single ended routing across LPDDR4/5, USB 3.x, SDIO 3.x, MIPI and Ethernet. ★ Proficiency with layout tools such as Allegro. ★ Exposure to EMI mitigation techniques and hands on experience in EMI pre compliance testing. ★ Demonstrated ability to lead layout teams or mentor junior engineers in constraint based PCB design. ★ Ability to create structured documentation and design guidelines to scale internal processes. ★ Strong debugging and problem solving skills with working knowledge of firmware and software to support system level root cause analysis. ★ Comfortable working in a globally distributed, cross-disciplinary engineering team.

a. SI訊號/PI電源完整性模擬分析 (Pre-Layout & Post-Layout) b. PCB/Layout設計建議與Guideline制定 c. SI/PI/EMI新技術專研與導入

1.負責生產及客退PCBA與零組件之異常分析與維修 2.執行異常分析儀器之操作、架設與維護

1.依客戶需求設計PCB (Load board) 達成客戶所需交期 2.整合與改進Layout and PCB simulation 3.協助客戶解決PCB問題與技術支援 4.BOM表維護, PCB生產問題排除與追蹤 5.具良好團隊合作、溝通能力與學習力

1. 毫米波與衛星陣列天線最佳化設計、評估及模擬開發 2. 毫米波天線專案設計、分析和解決問題 3. 毫米波天線性能測試與驗證 4. 協助天線導入生產相關事宜 5. 提供毫米波天線技術諮詢 6. 具備天線基本儀器量測 7. 熟悉天線理論與電磁模擬軟體 8. 偕同RF、熱流、機構以及軟體演算法團隊合作開發毫米波天線 9. 協助建立毫米波天線layout footprint 10.主管交辦事項

1.天線設計與開發,評估分析。 2.天線性能量測。 3.電路matching 調適與設計。 4.BOM表 Release ,設計報告與分析。 5.協助設計導入生產。

RF探針卡開發與製作 1.使用繪圖軟體-機械結構設計、分析、出圖、詢價、發包、驗收 2.設計組裝工治具-設計架構確認，功能性、可靠度、再現性 3.製作原因分析與改善對策執行報告

1.Chip level IR drop 分析 2.Chip power estimation/calculation 3.IR drop flow 建構 4.IR drop tool 維護 5.撰寫程式

Layout Design 協助專案佈線,文字面等後續處理事宜 <薪資依學經歷而定>