1.Layuot設計,PCB發包製作,SMT/DIP發包製作。
2.研究製作PCB產品相關分析與報告。
3.協助技術文件編寫。
Job Description
1.Layout design, PCB outsourcing and production, SMT/DIP outsourcing and production.
2.Research and create analyses and reports related to PCB product manufacturing.
3.Assist in the preparation of technical documents.
Roles & Responsibilities:
-To design High-Speed/High Density (Multi-Layer, Up to 46 layers) PCB Layout projects. Challenges involve highly complex electrical & mechanilcal contraint driven designs, high density interconnects and packaging, meeting client's SI,EMC, DFM, DFA, DFT.
-Troubleshooting and fault finding in PCB layout at Design level.
-Placement of components based on mechanical constranints and schematic flow.
-Routing of signal based on SI constraints.
-DFx Analysis implementation.
-PCB Manufacturing/Assembly files Geneation.