「資深軟韌體工程師」的相似工作

Job Responsibilities - BMC firmware development Responsibility -Teamwork capability: You will work with EE, BIOS, Thermal,.. etc. - Have a development experience with any BMC source code type - Familiar with embedded Linux - Have an experience with the Redfish feature - Understand the Open BMC structure is better. Qualifications - 2 years of BMC-related experience or equivalent. - Firm understanding of servers operating in a data center environment. - Demonstrated ability to work in a fast-moving, small team environment. - Working knowledge of major server components (motherboards, hard drives, RAM, CPU, heat sinks, fans, etc.) required. - Ability to use appropriate test equipment for development/debugging.

About the Job: We are looking for talents with development enthusiasm and tenacity to join our team. Candidates must have Embedded Linux / RTOS software/firmware development and problem-solving skills, as well as good interpersonal communication and teamwork. As the scale of our team organization continues to expand, the scope of services has become wider and wider. In the future, there will be more unknown areas waiting for us to explore and dig. If you want to do some challenging work, you don't want to stay the same. Welcome to contact us, we hope to hear from you! Responsibilities : - ARM Embedded System Linux / RTOS Platform development & maintenance - Label Printer Firmware development & maintenance - Customer Firmware Requirement development & maintenance - Customize Firmware development & maintenance - Production models function integration & maintenance - OEM/ODM project development - To define test plan for Software / Firmware project design - Develop and write technical specifications

《About this Role》 We're looking for a full-stack IoT firmware engineer who takes ownership of the complete development lifecycle - from MCU integration to cloud connectivity, and from code implementation to automated testing. You'll be responsible for building IoT wireless modules that bridge device hardware with cloud services, ensuring end-to-end functionality and quality. 我們正在尋找一位全端 IoT 韌體工程師，能夠負責完整的開發生命週期 - 從 MCU 整合到雲端連接，從代碼實作到自動化測試。您將負責構建連接設備硬體與雲端服務的 IoT 無線模組，確保端到端的功能性和品質。 《What We're Looking For》 "You build it, you own it, you test it" - We believe in empowering engineers to take full ownership of their work. With modern AI tools and testing frameworks, we expect our firmware engineers to deliver production-ready, thoroughly tested solutions. 「你開發，你擁有，你測試」 - 我們相信賦權工程師完全擁有自己的工作。透過現代 AI 工具和測試框架，我們期望韌體工程師交付可投產的、經過完整測試的解決方案。 《Your Key Responsibilities》 ● End-to-End Development | 端到端開發 ○ Wireless Module Development: Build application layers for IoT wireless modules (Wi-Fi, BLE, Thread, etc.) that interface with existing MCU systems. ○ Protocol Integration: Implement communication protocols to bridge MCU data with cloud platforms efficiently. ○ Cloud Connectivity: Design and develop reliable data transmission pathways from device MCU to cloud services. ● Full Testing Ownership | 完整測試責任 ○ Automated Testing: Design and implement automated test suites for your firmware using modern testing frameworks. ○ Manual Validation: Perform thorough manual testing for edge cases and integration scenarios. ○ Performance Testing: Ensure optimal memory usage, power consumption, and network performance. ○ AI-Assisted Testing: Leverage AI tools to generate test cases, identify potential issues, and optimize testing strategies. ● Quality Assurance | 品質保證 ○ Code Quality: Write clean, maintainable, and well-documented code that passes all quality gates. ○ Debugging & Troubleshooting: Independently identify, analyze, and resolve firmware issues across the entire stack. ○ Performance Optimization: Continuously improve firmware efficiency and reliability based on testing feedback. ● DevOps & Automation | 開發維運與自動化 ○ CI/CD Integration: Set up and maintain automated build, test, and deployment pipelines for your firmware. ○ Documentation: Create comprehensive technical documentation for APIs, protocols, and testing procedures. ○ Monitoring: Implement logging and monitoring solutions to track firmware performance in production.

~公司積極發展 "能源管理" , "工業4.0 與 物聯網" 等相關產品 與 工業通訊系統架構技術， 目前正需擴大規模以發展此正在成長的趨勢，希望具有熱誠 與 優秀的你, 加入銓盛團隊, 一起迎接成長機遇~，想了解更多相關資訊，請瀏覽 公司網站 : www.ADtek.com.tw , FB : www.facebook.com/adtekpower/ , LinkedIn : www.LinkedIn.com/company/adtek-electronics/ 1. MCU 程式開發 2. 韌體程式撰寫及維護 3. 韌體設計研發 4. 演算法 z transfer 或離散數學 5. DSP 資料處理與運算

1. Closely collaborating with silicon vendor to build up strategy partnership, manage co-engineering/co-marketing activities and create UEFI BIOS product roadmap. 2. Working closely with engineering teams to come out product development plan and define key milestones/deliverables. 3. Drive product development from marketing and customer perspective to ensure product meets customer expectation and leads the market. 4. Manage product development/validation activities throughout product life cycle, including planning, kickoff, development, launch, sustaining and EOL. 5. Own and manage feature requests, including respond to requests from customers, customer support team, project manager and sales; verifying the validity of feature request. 6. Take responsibility for decision in regards to feature/schedule tradeoffs, priority of customer issues, and all other product related issues. 7. Serve as an expert on the product roadmap, including answer questions from the fields, customers and internal teams as well as escalating the appropriate issues to stakeholders. 8. Create promotional materials and promote product to customers for project design-in & design-win. 9. Prepare reports and host meetings to update status and share information with stakeholders.

• 3-7 years of experience in the x86 BIOS/UEFI development • Experience with x86 CPU/APU architectures and associated compilation tools • Expert in C language Experience with platform bring-up. • Familiar with at least one BIOS code base • Experience of working with opensource coreboot project & mainboard related porting. • Experience of working with Intel FSP codebase and understanding of coreboot & FSP boot flow. • Understanding of coreboot & FSP build tools and build processes. • Experience of working with different coreboot payloads like edk2, SeaBios, Tianocore etc • Ability to read platform Hardware and Processor specifications to understand the coreboot mainboard porting required. • Good understanding of UEFI framework concepts to port UEFI code to FSP.

1.電子、電機相關科系 。 2.熟悉C語言程式設計。 3.對PIC16/24,ARM Cortex-M 韌體開發有興趣者。 4.具ADC(Analog to digital converter)測量領域相關知識。 5.有MCU相關周邊 I2C、I2S、SPI、UART、USB等介面韌體開發經驗者佳。 6.協助公司電控部門規劃。 7.支援其他部門電控產品開發。

1 AC充電機韌體開發 2 DC充電機韌體開發　 3 嵌入式通訊板之OCPP通訊協定開發 ISO15118通訊協定研究開發 充電漫遊（eRoaming）協議 & OCPI通訊協定研究開發 4 技術資料蒐集與彙總 5 研發相關之內外部會議參與 6 其他主管交辦工作事項執行及回報

•BIOS feature study/implement: Secure BIOS, BIOS module implement. •BIOS Porting & Maintenance: Lead BIOS projects, collaborating with cross-functional teams for motherboard porting. Oversee the design, development, planning, and continuous maintenance of BIOS for gaming products. •Testing & Debugging: Work with cross-functional teams to diagnose and resolve BIOS-related technical issues. Provide comprehensive analysis and solutions for custom BIOS development in gaming hardware. •Documentation: Create and maintain detailed technical documentation, including BIOS features, development processes, and testing procedures. ＊彈性工作時間，薪優福利佳，並備有新店/中和線交通車＊

1. 負責韌體撰寫與維護。 2. 熟悉分析 USB PD 通訊協議。 3. 熟悉分析 USB4、DP2.1、TBT 通訊協議。 4. 客戶服務(Active Cable相關) - 協助客戶釐清技術問題與產品特性分析與測試驗證。 - 具備信號完整性分析，並能進行 Cable 測試與除錯。 5. 具跨部門協作與專案支援能力。 韌體工程師在當今技術發展中扮演了至關重要的角色，他們負責開發和維護公司產品的韌體，並確保其運行穩定。這個職位有著廣闊的發展前景，在未來的技術發展中將會扮演越來越重要的角色。 我們正在尋找有經驗的韌體工程師加入我們的團隊。如果您符合上述要求，請盡快提交您的申請，期待與您合作！

綠能時代來臨，鋰電池產業將成為明星產業，鋰電池是各式電動載具及綠色再生能源搭配儲能系統的關鍵技術，兼具高產業 關聯性與高附加價值，鋰電池需求遽升將帶動市場規模在 5 年內翻倍。您是否也準備好成為職場的明日之星 ? 誠摯的邀請 您加入西勝，一起共創商機，共享榮耀。 BMS韌體專案開發內容如下： 1. State Diagram build up 2. Protection 3. Protocol 4. Bootloader 5. Certification 6.主管交辦事項

1.醫療產品MCU韌體開發與維護 2.軟體確校文件協助撰寫(IEC62304) 3.測試軟體維護 4.Git 版本管控 5.主管交辦事項 6.可獨立開發及協助團隊除錯與合作

【職責說明】 主要負責強固平板產品硬體平台MCU軟體開發及維護，並有機會主導韌體專案從0-1的開發過程，親手打造差異化的IPC產品。 【工作內容】 1. 負責MCU的韌體設計與除錯，確保MCU於產品上正常且穩定運作。 2. 負責設計產品的圖形使用者界面（HMI），創造良好使用者體驗，提升客戶黏著度。 3.依照產品規格分析、討論、歸納、撰寫韌體規格 4.整合上下游，確保開發進度遵循既定計畫。 【須具備以下條件者】 1. 具5年經驗(含)以上韌體工作經驗 2. 擅長VScode, Git 3. 熟悉STMicron 開發流程 4. 熟悉Microchip開發流程 5. 熟悉C/C++語言 6. 熟悉I2C/UART/SPI protocol 7. 熟悉FreeRTOS 8. 熟悉TouchGFX (圖形使用者界面) 9. 熟悉電子電路 10. 會使用Scope 【具以下條件者尤佳】 1. 熟悉USB protocol 2. 熟悉 CAN / LIN protocolv 3. 熟悉 TCP/IP stack (LWIP)

About the job : With the advent of the IoT era, Wireless has become an important connection method for IoT products. How to provide customers with a stable, reliable and secure wireless communication product will be an important market value. Therefore, we are looking for colleagues who are looking for wireless network communication development to join our team, expect to establish a stable Wi-Fi connection on TSC’s system platform, make products more reliable and secure, and then develop competitive and differentiated wireless functions. This is a very interesting and challenging work that is directly connected to future trends. The scope of services becomes wider and wider. In the future, there will be more unknown network application areas waiting for us to explore and mine. If you are interested in this kind of work, please feel free to contact us and let us work together to create a product that you are proud of. 工作簡介： 隨著IoT時代的到來，Wireless變成IoT 產品的重要連線方法。如何提供給客戶一個穩定可靠安全無線通訊產品將會是重要市場價值。我們正在找尋求無線網路通訊開發的同仁加入我們，期望在TSC的系統平台上建立穩定的Wi-Fi連線，讓產品更可靠與安全，並進而開發出具競爭力的雲端應用。這是一件非常有趣、連結未來趨勢的挑戰性工作。未來將會有更多的未知網路應用領域與雲端應用等著我們去探索與挖掘。如果你對這樣的工作內容有興趣的話，歡迎跟我們聯絡，讓我們一起共同創出你自己也覺得驕傲的產品。 Responsibilities : • Introduction of new Wi-Fi module and function maintenance of existing Wi-Fi module • Technical cooperation and technical discussions with Wi-Fi module suppliers • Wi-Fi Security Solution • Wi-Fi Software & Protocol application development • Handle and communicate issues related to client wired/wireless network communications • Collaborate with project development teams for functional development and integration • Cloud trend application and function development 工作職責： • 全新Wi-Fi module導入與既有Wi-Fi module功能維護 • Wi-Fi module供應商技術合作與技術討論 • Wi-Fi Security解決方案 • Wi-Fi Software & Protocol 應用開發 • 客戶端有線/無線網路通訊相關問題處理與溝通 • 協作專案開發團隊進行功能性開發與整合 • 雲端趨勢應用與功能開發

1.製作音響產品核心：負責音響產品的微控制器程式設計（MCU/SoC），從想法到實際產品，打造好用的智慧音響。 2.開發無線連接功能：製作藍牙、網路連接和各種控制界面，讓產品能依照客戶需求穩定運作，可使用AI工具幫助寫程式。 3.管理韌體開發：計劃和執行韌體設計，確保專案順利進行，使用版本控管系統，讓韌體更可靠且好維護。 4.測試和修正問題：進行韌體測試、修改和除錯，確保產品表現最好。 5.團隊合作：與硬體工程師、結構工程師和專案經理一起工作，共同設計出符合市場需求的產品。 6.設計使用介面：開發網頁、iOS和Android應用程式的使用者介面，讓產品易於使用且吸引人，確保用戶有良好的使用體驗。

1. 工業標準研讀 2. 產品韌體開發與維護 3. C#工程軟體開發與維護 4. 產品測試分析與除錯

1. 熟悉 MCU，如TI MSP430系列或、ST stm32系列。 2. 微控器的運轉及各部分結構、通訊、數位控制。 3. 懂 C 語言且有 MCU 程式撰寫能力及 UART、 USB、I2C、CAN等。 4. 熟悉 ARM Cortex-M 相關 MCU 開發環境與程式設計。 5. 提供底層程式、配套應用程式，進行軟體整合與 Release。 6. 連接藍牙 / WIFI / LTE 模組、開發 MCU。 7. 負責產品韌體、軟體功能程式維護、測試。 8. 與硬體工程師合作，驗證硬體功能正確性。 工作地點在達方 : 桃園市龜山區山鶯路167號

1.負責產品硬體研發 2.電子電路設計、驗證與除錯 3.PCB LAYOUT 4.零件料號申請、BOM表建立與修改 5.跨單位研發團隊合作開發設計、量測驗證、認證、問題協調及解決 6.安規零件資料整理製作 7.試產階段支援工廠生產單位並協助導入量產 8.協助解決客戶反饋問題等相關事務 9.具備相關產業經驗

[關於團隊]  我們是IEI 醫療事業中心，專注醫療產品、器材研發設計。其研發團隊具備研發熱誠，也具備豐富的開發經驗。歡迎樂於團隊合作，並能接受國內外醫療客戶挑戰與密切合作的您，加入~ [職務需求] 1. MCU程式撰寫，以及開發技術文件撰寫。 2. 獨立作業、團隊合作、不排斥學習。 [要求條件]  1. 熟悉 C/C++程式語言。 2. 熟悉 8051/ARM MCU。 3. 看得懂硬體線路圖，會使用示波器、三用電表等量測硬體設備。   [有了更加分項]  1. 熟悉 醫療軟體文件撰寫者佳。 2. 熟悉 RTOS 程式開發。 

韌體團隊開發範疇： 1. 研究電池特性(例如：鋰電池)，開發新的電池電瓶分析演算法。 2. 完成電池測試儀器、電池充電器功能開發。 專案執行過程的常態性工作： 1. 使用MCU開發工具及程式語言，主要是C語言。 2. 進行單元功能程式整合。 3. 單元功能程式撰寫及驗證。 4. 撰寫工程規格 / 技術文件 (包含測試計畫)。 5. 韌體版本管控 (Git)。 Our FW team is responsible for: 1. Developing the functionalities of battery diagnosis/charging products. 2. Investigating new diagnosis algorithm for batteries is part of our job. Regular duties in project execution: 1. Use MCU development tools and programming languages, primarily C language. 2. Perform unit function program integration. 3. Write and verify unit function programs. 4. Write engineering specifications / technical documentation (including test plans). 5. Firmware version control (Git).

1.工業電腦、影像主板、控制卡等檢測及維修，針對異常提供分析及建議。 2.製作維修報表及管理相關文件。 3.需熟悉電子電路、電子零件及實際焊接經驗。