「【2025預聘｜校園徵才】TE Team_New Product Test Development Engineer_新產品測試研發工程師 (新竹)」的相似工作

Job Summary: This position is set for product engineer to coordinate all new product development activities, ensure timely completion of all new products definition, design, manufacturing, testing, characterization, qualification and releasing with good consistency, quality and efficiency. Essential Functions: • Co-work with functional engineering team member (TME/DE/TD/TE/RE) to make new product has good definition, risk evaluation and build comprehensive testing plan / Qual plan during new product definition/design/layout stage. • Co-work with other Eng team member to ensure all new product can be thoroughly manufactured, characterized and qualified for reliabilites and qualities. • Organize assignments and independently schedules to complete assigned tasks timely and make project finished efficiently. • Have good coordination and data analysis to solve difficult problems through application of various techniques and approaches to develop effective and practical solutions that result in improved products, processes with good quality. Qualifications: • MS in Electrical Engineering or similar areas. • Good knowledge or experience of analog/digital circuits, device physics, IC manufacture process, Assembly process and related IC testing process. • Familiar with IC bench setup and testing, good statistical data analysis and summary skills. • Good logic for problem solving and schedule orgnization. • Self motivated, strong ability for team work. • Good communications skills for both verbal and writen in English. Location: • Hsinchu, Taiwan

Job Summary: Designing analog and mixed-signal ICs for Power Management Products utilizing leading edge sub-micron BiCMOS /DMOS technologies. Products to be designed may include, switching regulators, display drivers, audio amplifiers and power management ICs for fast-growing portable and non-portable markets such as broadband modems, PDAs, notebooks, cell phones, telecom, fiber optics, digital camera, network equipment, and automotive. Essential Functions: • Works on product definition, circuit synthesis from the transistor/resistor level up to the system level, simulation, layout supervision • Participates in the entire product development cycle, from product definition through product release. Qualifications: • MSEE / PhD of electronic engineering, analog or digital IC design topics • For analog, familiar to power converter (buck/boost/buck-boost/LDO) analog design will be the plus • Self-motivated, could have strong team work/collaboration with overseas colleges.

Job Summary: • This FAE will provide technical support to the Sales and FAE team in developing potential opportunities incorporating MPS products and services. The FAE identifies and shares current and emerging customer technical needs to improve the tactical and strategic product positioning. Qualifications: • At least 1 years' experience in power electronics (DC/DC or AC/DC) related industry; experience in Power IC vendor as AE or FAE will be a plus. • Familiar with general NB/Server DCDC Power Design or DCDC will be a plus. • Ability of initiating and problem solving. • Good interpersonal skills. • Adaptability-ability to meet changing condition. • Strong sense of responsibility, self-motivated and good team spirit. Education: • BS or MS majored in Electronic Engineering or related. Location: • Taipei, Taiwan

我們正在尋找一位經驗豐富、對半導體元件物理有深入了解的SPICE元件工程師加入我們的團隊。您將負責開發、驗證及維護用於積體電路設計的SPICE模型，確保模型的高精準度與可靠性。 【職務內容】 SPICE元件模型開發與驗證： 1.負責開發各類半導體元件(如MOSFET/HV MOS/BJT/Diode/Res & Cap等)SPICE模型。 2.執行模型參數萃取與最佳化，確保模型數據與量測數據高度吻合。 3.開發設計模型驗證Pattern，包括DC、AC、Qg/Qd、Qrr及雜訊特性驗證。 4.協同製程開發團隊，確保模型能準確反映製程變化。 5.模型維護與支援電路設計： 5-1)定期更新與維護現有SPICE模型庫，以支援新製程節點/平台及設計需求。 5-2)為設計工程師提供SPICE模型相關技術支援，協助解決設計中的模型與模擬問題。 5-3)透過與實際IC行為的驗證與分析，完善元件模型架構與建立精準模擬設定流程。 5-4)對IC量測數據進行深入分析，以識別模型局限性並提出改進方案。 5-5)建立並維護模型參數萃取與驗證的自動化流程。

【Molex--2025 校園徵才活動】 ▶3/ 15 (六) 國立陽明交通大學-校園徵才博覽會( 攤位137) ▶3/ 22 (六) 國立清華大學-校園徵才博覽會 ( 攤位E91) 【招募職缺】 1. Engineer, SI/Hardware (新竹) Job Content: RF design and simulation for high-speed module PCB and Siliconphotonics PIC Education: Master or above major in electromagnetic, microwave or EE 2. Engineer, Siphotonics PIC (新竹) Job Content: Siphotonics PIC design/ layout/ characterization Education: Master or above major in Electro-Optical Engineering, or relevant 3. PDE Intern(三重/台北) Job Content: Design flexible printed circuits (FPC) from RFQ costing to mass production and supporting manufacturing document generation. Education: Bachelor of Electrical Engineering or similar (interest or experience for FPC design, preferred tools: ViewMate, ODB++, Siemens NX CAD) 4. Layout Engineer(三重/台北) Job Content: Layout design for flexible printed circuits (FPC), including technical design details for customer needs and manufacture capability. Education: Bachelor of Electrical Engineering or similar (experience with layout, preferred tools: Allegro or AltiuM) 5. Engineer (Intern), Production/ IE(三重/台北) Job Content: IE: production cost analysis, efficiency and productivity baseline monitoring and improvement Production: line leader and area supervisor training and internship Education: Bachelor of Industrial Engineering, Statistics or similar fields 6. ME Engineer(三重/台北) Job Content: Flexible printed circuits (FPC) New machine qualification, Process validation, Process capability development for new manufacturing generation Education: Bachelor’s degree in electrical engineering and chemical engineering or similar field 7. Process Automation Engineer(三重/台北) Job Content: Flexible printed circuits (FPC) New automation machine evaluation and development Education: Bachelor’s degree in technical or engineering field Experience in the software design of industrial automation 8. Optical Engineer (WSS)(新竹/新店) Job Content: 1. WSS Product development 2. Optical design 3. Optical component support 4. Bench top LAB optical table work Education: 1. Master/ PhD in Optical related field 2. Optical table / bench work experience, accurate optical alignment experience 3. Optical design / ZEMAX experience (Prefer) 9. Engineer, Firmware (WLM)(新店) Job Content: 1.Work in the product engineering team for firmware design and/or verification. 2.Write/review on the firmware specification and the related documents. Education: Master or above major in Computer Science, Software or Electrical Engineering 10. Engineer, Product Design (Optical Connectivity)(新店) Job Content: 1. Develop protocols and perform product verification and validation testing, build and test prototype designs for proof of concept. 2.Communicates product progress and facilitate decision-making with the core team and throughout their relevant functional organization. Education: 1.Bachelor’s degree above in mechanics or related field. 2.Good ability to use relevant drawing software such as Solid work, NX, Pro-E or CAD for mechanical structure handling 11.Assistant Engineer, Product design(Cage)(淡水) Job Content: Assist in the development, process control, 3D model, 2D drawing and BOM data generating and coordination of functional teams Education: Master or above major in mechanical related 12.Assistant Engineer, Product design(Internal Cable)(淡水) Job Content: Assist in the development, process control,3D model, 2D drawing and BOM data generating and coordination of functional teams Education: Master or above major in mechanical related 13.Assistant Engineer, PDE (NPD)(淡水) Job Content: Assist in product development, Ex: CAD/3D/experiment Education: Master or above major in Mechanical or Thermal/Materials engineering-related. 14.Associate Sales Engineer (2025 Talent Program) (淡水/信義區) Job Content: Design in Molex products to customers Education: Bachelor’s or Master’s Degree

歡迎2026年畢業並正在找尋研發替代役的同學申請! Direction 1: System Design Power Validation Engineer Direction 2: PCB Layout Engineer Direction 3: System Application Engineer What you'll be doing: • Collaborate with system design, hardware, and power engineering teams to participate in end-to-end design, validation, and optimization of hardware products (such as GPUs, AI accelerators, server platforms, etc.) • Responsible for circuit schematic design and PCB layout using EDA tools (such as Altium, Cadence, Mentor Graphics) for multilayer high-speed board design and optimization • Perform PCB design reviews, assist in resolving signal integrity, power integrity, EMI/EMC issues to improve design quality and manufacturability • Participate in board bring-up, debugging, power testing, and performance validation of hardware prototypes, helping to ensure optimal power efficiency under varying operating conditions • Write and maintain design, validation, and test documentation, including but not limited to design specifications, validation reports, and test plans • Work closely with cross-functional teams to continuously improve design processes and enhance product innovation and competitiveness What we need to see: • Hold a Master of Science/Ph.D in Electrical Engineering or related field • Familiar with circuit schematic design and PCB layout processes, and basic proficiency with EDA tools (such as Altium, Cadence Allegro/OrCAD, Mentor PADS, etc.) • Strong interest in power management, DC-DC converters, signal integrity, and high-speed digital design is a plus • Good debugging, analysis, and problem-solving skills; able to work independently or within a team to resolve design and validation challenges • Good command of English for reading technical documentation and communication • Proactive, eager to learn, and passionate about the latest electronics and AI hardware technologies 應徵方式: 請提供以下資料： • 英文個人履歷 • 學士+碩士成績單 (中英文皆可) 提交申請: 請將上述資料投遞至104，符合資格者將會收到進一步的聯繫通知。

歡迎2026年畢業並正在找尋研發替代役的同學申請! We are seeking talented Firmware Engineers to join our team to work at the intersection of hardware and software, contributing to the core firmware that powers NVIDIA’s industry-leading GPUs and high-performance server products. In this role, you will design, develop, and optimize low-level software that enables reliable operation, high performance, and advanced features for both GPU and server platforms. These directions are: Direction 1: GPU Firmware Engineer Direction 2: Server Firmware Developer You’ll be doing: • Design, implement, and test embedded firmware for NVIDIA GPUs and server systems, enabling seamless hardware-software interaction. • Develop, maintain, and enhance bootloaders, device initialization code, and system management features. • Work closely with hardware, software, and systems teams to ensure robust bring-up and integration of new silicon and server platforms. • Diagnose, debug, and solve complex firmware and hardware-related issues across various development and production environments. • Drive innovation and optimization in areas such as power management, error handling, security, and performance monitoring for GPU and server hardware. • Contribute to documentation, compliance, and support for new product features and industry standards. Qualifications: • Master’s degree in Computer Engineering, Electrical Engineering, Computer Science, or related field. • Proficiency in C/C++ and embedded firmware development principles. • Understanding of computer architecture, hardware interfaces (I2C, SPI, PCIe), and real-time operating systems. • Experience with hardware bring-up, debugging tools, and low-level programming. • Strong analytical, troubleshooting, and communication skills. • Experience with server, GPU, or large-scale data center hardware is a plus. 應徵方式: 請提供以下資料： • 英文個人履歷 • 學士+碩士成績單 (中英文皆可) 提交申請: 請將上述資料投遞至104，符合資格者將會收到進一步的聯繫通知。

【Main Responsibilities】 1. Develop and review the system and chip safety architectures and market trends 2. Communicate and coordinate safety designs with HW teams 3. Develop function safety fault injection simulation flow. 4. Co-work with BU design verification teams to achieve pre-silicon verification of hardware safety requirements 5. Review system safety analysis (ex: FMEDA, DFA, FMEA, FTA) 6. Review the implementation effectiveness and work output of ISO 26262 project activities for automotive products 7. Systematic maintenance and establishment of ISO 26262 related standards (ex: ALM, MEDINI) *Suggested to have at least four of the above-mentioned skills/experiences*

We are looking for a Mixed-Signal/Analog/IO Circuit Design Engineer – someone who is excited to join a rapidly growing team of creative circuit design engineers pushing frontiers of the high-speed SerDes solutions. NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can pursue, and that matter to the world. This is our life’s work, to amplify human creativity and intelligence. What you'll be doing: • Mixed-Signal/Analog circuit design for High-Speed I/O Interfaces • Develop and implement high speed interfaces and analog circuits using the latest CMOS FinFET processes • Help define circuit requirements and complete design from schematic, layout, and verification to characterization • Optimize design to meet the specifications for system performance. What we need to see: • TX/RX related design experience or is fairly familiar with high-speed SerDes/analog circuit design concepts • CMOS Analog / Mixed Signal Circuit Design Experience in deep sub-micron process (especially in FINFET) • Strong background of Cadence custom design tools, various circuit simulators like Hspice, XA, FineSim, Spectre • Experience in crafting test bench environments for component and top level circuit verification • Knowledge of Verilog, Verilog-A, Matlab, or similar tools for behavioral modeling of analog and digital circuits is a plus • Strong debugging and analytical skills • Strong interpersonal skills and ability & desire to work as a good teammate • Minimum bachelor's degree and/or pursuing Master's degree in Electrical Engineering.

1.IC測試程式開發 2.IC新產品wafer debug 3.IC量產測試異常支援 4.程式開發/維護 5.產品可靠度/低良率分析

【成為円星人】 円星科技由一群專業與充滿熱情的夥伴創立於2011年，為積體電路矽智財設計服務業之新秀，秉持著『成為半導體業最值得信賴之IP公司』的願景，追求永續經營與成長。 誠摯歡迎您成為円星人，加入我們，站上國際舞台！ 一起共同打拚，以精品文化之精神，創造價值，追求卓越！ 【職務簡介】 M31主要業務為向 IC 設計業者和晶圓代工廠授權 IP，此職務為負責High Speed interface相關PHY IP進行電氣特性驗證(測試), 功能驗證(測試)之職缺。 【將負責的工作內容】 1. USB, SATA , PCI-e , MIPI PHY 高速I/O介面之電氣特性量測 2. PCB board design for High-Speed I/O interface 3. FPGA board design for High-Speed I/O platform 4. USB, SATA, PCI-e, MIPI C/D/M-PHY高速I/O介面之認證測試 5. 協助Analog/Digital RD進行testchip測試 6. 與合作廠商之Controller進行系統整合驗證與測試 7. 協助客戶進行 FPGA驗證 與 客戶產品之初期驗證 【條件與特質】 1. 擅長工具： -EMC/EMI -FPGA -OrCAD -PowerPCB -USB技術 2. 熟悉USB, SATA, PCI-e, MIPI等高速I/O介面之電氣特性與認證流程 3. 熟悉高速示波器,BERT, ENA & AWG 4. 測試自動化程式(Labview)之規劃與撰寫(option) 5. 認真負責、配合度高 6. Any of following experience are plus -PCB Layout -PCB焊接 7. 有 TV Engineer 相關工作經歷 5 年以上 8. 電機電子相關科系碩士畢業 如果您有以上相關經驗且對此職缺有興趣，歡迎投遞您的履歷！

- Test program development and application development - Benchmark planning, implementation and execution - Competitor analysis and our product value proposition - Asist Sales/Marketing for account strategies development. - Pre-sell for new applications / customers.

Job Summary: • This FAE will provide technical support to the Sales and FAE team in developing potential opportunities incorporating MPS products and services. The FAE identifies and shares current and emerging customer technical needs to improve the tactical and strategic product positioning. Qualifications: • 2 years' experience in power electronics (DC/DC or AC/DC) related industry; experience in Power IC vendor as AE or FAE will be a plus. • Familiar with general NB/Server DCDC Power Design or DCDC will be a plus. • Ability of initiating and problem solving. • Good interpersonal skills. • Adaptability-ability to meet changing condition. • Strong sense of responsibility, self-motivated and good team spirit. Education: • BS or MS majored in Electronic Engineering or related. Location: • Taipei, Taiwan

1.IC測試程式開發. 2.IC量產維護. 3.工程實驗 4.測試軟硬體模組開發. 5.主管交辦事宜.

【職務說明】 1. 負責電子電路的系統設計整合、軟硬體開發及產品測試與試驗工作。 2. 設計及規格選型設計優化，如 : 提升現有設計、設計降低生產成本、提升產品可靠性。 3. 與試產單位人員溝通合作，協助自動化製造生產能力效率優化改善，並確認生產組裝過程與設計相符。 4. 撰寫設計報告及品質問題分析與改善之8D報告。 5. 替代零件承認、電路板開發、產品電路設計、產品功能測試、產品測試除錯、可靠性測試及環境試驗。 6. 樣品製作實驗、樣品承認、製作作業指導書(插件規範)、建立BOM表。 7. 協助客戶產品故障分析及解決方案擬定。 ***此職務屬研發團隊***

[歡迎具度研發替代役資格者投遞履歷] 1. 電路設計。 2. 具基本電子學概念。

【產品線描述】 1. LCD應用 Power IC 2. 手機及筆電OLED 應用Power IC 【工作說明】 1. PMIC驗證及規格制定 2. 客戶design-in 工程支援 及 Issue 解析 (需出差) 【必要條件】 碩士以上，電子、電機、控制相關科系畢業，具下列經驗者 1. DC/DC 相關IC驗證經驗尤佳 2. 具基礎電子學/電路學 與 PCB Layout 經驗

歡迎2026年畢業並正在找尋研發替代役的同學申請! What You'll Be Doing: • Post-layout model extraction for project review sign-off • pre-layout model extraction for DOE • Work closely w/ Package and PCB Design teams to design and ensure link performance meets expectation before tapeout • Develop novel algorithms & new methodologies to improve SI/PI/EMI modeling efforts • Work w/ Application Engineering teams to support customers w/ SI/PI questions • Support signal integrity simulation and analysis for interfaces PCIE, NVLink, display, LPDDR etc. What We Need To See: • MS in EE and majoring in SI/PI technology or equivalent experience, • Strong understanding of electromagnetics, specifically electromagnetic waves including transmission line theory and via properties, and the SI/PI/EMI applications; S/Y/Z parameters; discrete signal processing knowledge • Know how to use ANSYS HFSS/Q3D/SIwave/Designer, Synopsis HSPICE, Cadence PowerSI, and Keysight ADS • Understanding of high-volume manufacturing variations and impact to channel signal integrity is a plus • Familiarity with high-speed I/O design concepts including clock generation, transmitter & receiver design, and equalization schemes • Familiarity with transient simulation in tools and understanding of eye diagram methodology • Exposure to lab measurements including VNA & TDR, and oscilloscope experience • Passionate about SI/PI work Ways To Stand Out From The Crowd: • SI analysis flow including frequency and time domain simulation • PDN analysis flow including model generation and time domain simulation • PSIJ Analyses involving co-simulation of circuits and PDN models • Experience w/ Matlab, Python, VBS, and C • RF/microwave engineering; EMI/RFI analysis capability 應徵方式: 請提供以下資料： • 英文個人履歷 • 學士+碩士成績單 (中英文皆可) 提交申請: 請將上述資料投遞至104，符合資格者將會收到進一步的聯繫通知。

由於先進製程與高整合度晶片需要較長的研發時間及高製造成本，DV (Design Verification) 已成為聯發科技晶片開發流程中不可或缺的一環。 CDG DV部門負責開發與執行最高整合度 Smartphone，TV與ASIC驗證工程。 內容包含:整合型驗證環境開發，大數據分析與效能改善，BUS Fabric / EMI (External memory interface ) / Low power functions 驗證規劃及執行。 工作中需要設計及精進Verification plan/methodology/bench，對SOC系統有整體而深入的了解。 利用最新EDA tool and concept來完成你的驗證計畫。 工作地點:新竹/台北

工作內容: 1. 新產品測試評估(DFT) 2. 新產品測試軟/硬體開發與驗證 3. 協助驗證產品規格、封裝、可靠度 4. 新產品測試量產導入 5. 協助改善產品良率及優化測試時間 6. 協助測試量產異常處理 7. 能配合加班，及配合公司需求調整工作內容與職務