「硬體研發工程師(資深)」的相似工作

負責x86 系統主機板的硬體研發設計與驗證，確保產品符合性能和可靠性，協助解決設計與生產中遇到的問題。 主要負責x86系統主機板的 1‧線路設計 2.layout review 3. HW issue debug 4. 主機板 BOM

Responsibilities: 1.技術可行性分析 2.硬體線路設計 3.硬體設計審查和BOM產出 4.審查 PCB Layout 5.執行開機測試 和執行除錯 Work Location: ●新北市土城區自由街2號

Has lead experience for X86 or GPU system. 1. 獨立(或領導一個團隊)負責伺服器(Server)產品之電子電路設計與開發 2. 能進行新技術/概念/晶片世代的研究並透過新案子實踐並提供符合(或超越)市場需要之產品設計 3. 審查設計及驗證之相關文件(Schematic/Layout/Validation Repot/Issue-analysis Report/Product specification…etc.) 4. 產品除錯及問題排除 5. 在不影響產品品質的前提下, 有效率執行設計研發流程; 並將價格(cost)和品質(quality)兩者都放進設計考慮中. 6. 能同時執行多個專案目標並成功完成 7. 能推動跨組織討論,有效率解決技術問題,並主持與客人之技術討論 8. 協助引領團隊並協助其他成員解決問題

1. 能夠了解主板的線路及其動作方式與原理並獨立完成設計。 2. 硬體設計問題的初步分析與解決。 3. 負責線路的Net list check 並確認其正確性。 4. 負責產品的方案制定、器件選型、硬體設計、調試等工作 。 5. 編寫產品BOM、生產指導文件等技術資料 。

1. In-depth knowledge of PCB layout, OrCAD/Allegro tools, circuit design, and PCB structure. 2. Prepare technical documentation including product specifications, layout instructions, test procedures, etc. 3. Transfer products to manufacturing with clear documentation and help C.M. and technical support to solve problems. 4. Hardware engineer need co-working with PM, BIOS, IPMI, EMI, Thermal, ME RD friendly. Need have good team work. Need to have the concept of project ownership. 5. Need have power VR and component design knowledge 6. Resolve complicated issues and drive to root cause on critical engineering problems

1. 負責硬體(HW)產品專案開發設計與產品規格書編寫 (交流充電樁-Charging Pile System) 2. 負責專案Embedded System SOC電路板開發。 3. RF Module選用與設計，如：RFID、Wi-Fi、BLE、LTE、5G。 4. Ethernet、USB port設計開發。 5. 具備產品RF De-sense能力 6. 確認RF相關認證，如：PTCRB，電信商認證。 7. 電動車Electric Vehicle(EV)客戶ODM/OEM專案 其他條件: 1. 電路繪製(如：OrCAD、PADS)， 2. 開發經驗3年以上(數位產品硬體BB/RF經驗佳) 3. 具備網通產品和安規測試經驗者較佳。

Synology's portfolio of NAS, IPSAN, networking, and surveillance solutions are depended upon by millions of customers around the world. All of that starts from having a solid foundation to build upon, the hardware itself. The Hardware Division is responsible throughout the entire product development cycle, starting from the initial design, mass production, and then obtaining market feedback. Through every step, we aim for quality and most importantly, reliability. A building is only as strong as its foundation. The same can be said for the hardware powering our solutions. You'll be working with software, firmware, and other hardware engineers to implement and design hardware platforms for maximum reliability. You will: - Create specifications and product design documentation - Schematic capture and PCB layout design - Perform design validation - Verify and optimize for volume manufacturing

※ 目前初試皆採Teams線上面談 1. 具備電子電路基本知識 2. 產品測試驗證及波形量測 3. 電路設計及製作BOM 4. 跨部門技術支援 加分條件： 熟知電路設計、電路板佈局、射頻、毫米微波相關原理尤佳

希望你對於雲端硬體設備設計有興趣，且勇於學習新技術！ 1. 負責伺服器(Server)相關產品之電子電路設計與開發 2. 板階設計和完成相關周邊零件的選用和設計 3. 對於設計進行自我審查(self-review), 和完成零件廠商所提供的審查清單(review/check-list); 並針對與其他板卡橋接之介面做交叉審查(end-to-end cross review) 4. 除錯及問題排除；並在問題解決後，整理分析報告 5. 執行設計訊號量測與驗證 6. 制定量測計畫和整理量測報告 7. 協助工廠將產品導入量產

✅About the job As a Senior System Hardware Design Engineer, you will drive system hardware design focusing on high-speed interfaces such as PCIe, USB, Thunderbolt, and MIPI, and manage the entire product development cycle. You will collaborate closely with CM/JDM/ODM partners to solve DFM/DFT issues, optimize designs for manufacturability and yield, and ensure high-quality production. You will also be a key contributor in ASIC/SoC validation and system bring-up. ✅Responsibilities: #System Hardware Design & Architecture: • Architect and design hardware platforms with high-speed I/Os (PCIe, USB, Thunderbolt, MIPI). • Lead schematic design, component selection, and architecture definition. • Co-work and support the entire hardware development process with SI companies. #Signal/Power Integrity (SI/PI) & PCB Design: • Perform SI/PI analysis for high-speed signals and power domains to ensure robust performance. • Define PCB stack-up, high-speed routing rules, and work closely with layout engineers. • Review and guide PCB layout and layer stacking for optimal signal/power integrity and EMI/EMC considerations. #ASIC/SoC Validation & System Bring-Up: • Design validation and evaluation boards for new ASIC/SoC platforms. • Collaborate with ASIC/SoC teams to validate hardware interfaces and system functionalities. • Conduct lab bring-up, debug, and hardware validation using high-end equipment (oscilloscopes, VNAs, BERTs). #Productization & Mass Production Collaboration: • Work directly with CM, JDM, ODM partners to bring hardware from prototype to production. • Address and resolve DFM (Design for Manufacturing), DFT (Design for Test), and yield-related issues. • Drive continuous improvement of hardware designs for manufacturability, cost, and quality. • Support pre-production builds, validation, and troubleshooting during ramp-up phases. ✅Qualifications • Bachelor’s or Master’s degree in Electrical/Electronics Engineering or related field. • 8+ years of hands-on experience in high-speed system hardware design and development. • Strong design experience with PCIe Gen3/4/5, USB 3.2/4.0, Thunderbolt 3/4, MIPI (CSI/DSI), and similar high-speed protocols. • Deep expertise in SI/PI analysis (tools like Ansys HFSS, Keysight ADS, Cadence Sigrity). • Proficiency with PCB design tools (Allegro, Altium, Mentor Xpedition) and PCB stack-up design. • Solid understanding of ASIC/SoC validation, hardware bring-up, and integration testing. • Experienced working with CM, JDM, ODM partners and managing DFM/DFT/yield issues for high-volume production. • Familiarity with lab instruments for signal measurement, validation, and debugging. ✅Nice to have: • Prior experience in IC design house, OEM/ODM/JDM, or system integrator roles. • Exposure to firmware/software interaction with hardware and system-level integration. • Familiarity with industry compliance standards (e.g., USB-IF, PCI-SIG). • Excellent problem-solving skills and the ability to drive issues across multi-disciplinary team

職務介紹： 做為一名硬體研發工程師，您將負責產品評估、硬體規劃及設計，Layout佈局及走線檢查，電子電路訊號量測及除錯系統設計，零件料號申請、BOM表建立與修改，以及專案技轉量產，品質分析等。主要產品為Intel /AMD Server, x86 Motherboard, ODM專案等產品開發。 職務匯報： 此職務會匯報於研發主管 主要工作內容： 1. 電子電路之研發，新產品設計，硬體除錯，良率提升等工作 2. 硬體線路及工程樣品製作 3. 研發新產品，改善現有產品，改善作業流程 4. 與客戶或公司的硬體部門的同仁共同研發或解決問題 5. 舊專案維護或改良，BOM變更與維護 人才需具備： 1.工作經驗：3年以上Server/PC/Notebook相關產業x86硬體研發經驗為佳 2.學歷要求：大學、碩士 3.科系要求：電機電子工程相關為佳 4.語文條件：英文(讀:中等、寫:中等) 5.擅長工具：擅長OrCAD, Allegro 等EDA軟體、Microsoft Office 軟體和示波器、電表等儀器之操作 6.工作技能：電子零件及電子線路解析能力 7.其他條件：細心、思考靈活，積極主動，良好的溝通能力，富有團隊合作精 神以及強烈的學習意願也是我們重視的條件。

1 5G Small Cell/O-RAN product development: a). Product Spec definition/Review b). Product Solution Evaluation: Architecture assessment, component survey, EVB verification c). ME/Thermal solutions Analysis & Verification d). Baseband Circuit design (power, digital and RF integration), including Schematic drawing, BOM creation, layout and test plan 2. MFG supporting from NPI to MP stages 3. HW quality verification (Compliance, SI/PI, thermal, reliability) 4. System quality verification with SW/Q 5. Product trouble shooting supporting for NPI, MFG and Customer site failure 6. Customer support, include RFQ response, field try or on-site support, failure analysis 7. Optimization for sustained products 8. Resource coordination and Schedule control for on-hand project

1.負責車用 ECU 產品的硬體系統架構設計、原理圖繪製與 PCB layout 規劃。 2.開發基於Renesas、NXP車用 SoC的ECU。 3.設計與驗證高速訊號，如 DDR4/5、SerDes、PCIe、Ethernet、LVDS。 4.建構 8~12 層 HDI PCB、盲/埋孔設計、stacked via 結構與 EMC/EMI/ /ESD對策。 5.協助系統 bring-up、功能測試、信號完整性分析與熱分析。 6.熟悉 ISO 26262 功能安全規範，並導入車規元件與安全設計。

【工作內容】 1. 研發設計伺服器電源相關應用線路 2. 負責電源相關電路測試驗證 3. 負責產品電源相關應用除錯，並進行產品驗證 【其他條件】 1. 熟悉電子電路 2. 熟悉示波器及相關量測設備操作 3. 有相關電源設計經驗者佳 ※為增加身心障礙人才就業機會及維護身心障礙者就業權益，歡迎持身心障礙手冊朋友主動投遞。

Job Summary: 1. We are looking for a highly skilled and experienced Senior Hardware Design Engineer to join our server development team in Taipei. 2. The ideal candidate will be responsible for high-speed hardware design, schematic capture, debugging, and working cross-functionally with layout, validation, firmware, and manufacturing teams to deliver high-quality server products and add-on cards. Key Responsibilities: 1. Responsible for schematic capture, layout review, BOM generation, and debugging/testing of server motherboards and add-on cards. 2. Collaborate with layout engineers, BIOS and firmware engineers, validation and test engineers, and cross-functional teams to identify and resolve engineering issues early in the development cycle. 3. Participate in and contribute to design reviews, architecture discussions, and project planning. 4. Prepare and maintain technical documentation, including product specifications, layout guidelines, test procedures, and design review reports. 5. Ensure product compliance with engineering specifications, safety, and energy regulations if any (e.g., ErP), and customer performance expectations. 6. Provide clear documentation and technical support to contract manufacturers and production teams during prototype and mass production stages. 7. Lead root cause analysis and provide corrective actions for hardware-related production or field issues. Required Qualifications: 1. Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. 2. Minimum 5 years of experience in hardware design for server, PC, or embedded systems. 3. Proficient in schematic capture tools (e.g., OrCAD). 4. Solid understanding of high-speed signal integrity, power delivery design, and board-level debugging. 5. Hands-on experience with lab equipment such as scopes, logic analyzers, and multimeters. 6. Strong problem-solving and analytical skills. 7. Good communication and documentation skills in both English and Mandarin.

我們是 EGNAS，專注於打造嵌入式數位儀錶的技術型公司，結合 Linux 系統、高效能硬體與車規設計，為商用車與特殊車輛提供可靠的解決方案。前代產品已成功導入多款車型並投入實際量產，現正邁入新一代數位儀錶的開發關鍵期。 如果你熱愛智慧移動工具，對電動車、自行車、重機或工業車輛的技術充滿熱情，並擁有電子電路設計與量產導入經驗，歡迎加入我們的核心研發團隊，共同打造從零開始、實際落地的產品！ 【主要工作內容】 負責嵌入式數位儀錶的電路設計、驗證與量產導入，工作範圍涵蓋從產品研發初期的設計到後期生產落地，包括： 【嵌入式硬體架構設計與整合】 ・具備 MCU / MPU 系統架構理解，熟悉嵌入式應用電路設計・熟悉車用電子設計規範（如：安規認證、EMC／EMI 解決方案）尤佳 【電路設計與 PCB 佈局整合】 ・使用 Altium Designer、OrCAD、Allegro 等工具進行電路圖設計 ・進行 layout review、多層板設計、高速訊號線佈局 ・建立並管理 BOM 表，配合產品結構整合需求 【硬體電路驗證與測試】 ・執行 Power / Signal Integrity / 功能驗證等測試 ・能進行手焊件作業，熟悉基本儀器操作（如三用電錶、示波器、函數產生器） ・具備設計基礎測試設備（如測試治具、測試台）能力尤佳 【跨部門與對外協作】 ・與軟體、PM、工業設計、機構設計與外部協力廠合作，整合電子零件規格、廠牌型號與成本考量 【產品維護與量產支援】 ・協助工廠樣品打樣與量產導入，處理產測問題 ・維護與優化既有產品電路設計，處理生產端突發狀況並提升良率 【文件撰寫與技術傳承】 ・撰寫設計與測試相關技術文件、維修手冊、操作說明等 本職務將直接參與公司核心產品的硬體設計與落地過程，橫跨嵌入式電路設計、測試驗證、量產整合與跨部門協作等多個環節。你將不只是做設計，而是能全程參與一個產品從無到有、從樣品到量產的技術實現之旅。這份工作非常適合希望技術能力持續深化、對最終產品品質與完整研發過程有責任感的工程師。 我們提供 保障年薪制度、彈性信任的工作環境，以及與核心技術團隊共事的成長機會。期待有志之士與我們一同推動智慧移動領域的創新與實現。

1. RFI /RFP/RFQ 規格確認與可行性評估. 2. IP Camera 及AIOT產品硬體平台評估 / 設計 / 驗證與優化. 3. 專案試產跟進DFM/DFC、良率改善與量產協助. 4. Technology Support Customer. 5. 能獨立工作及跨部門協調整合.

1. 主動式電子掃描陣列 (相控陣列) 雷達系統之硬體電路設計。 2. 熟悉RF PCB Layout Guideline與PCBA廠商管理。 3. 理解SI/PI的觀念。

1. Motherboard schematics design/debug ,at least 5 years experience 2. Familiar with X86 experience is better 3. RISC design experience is better 4. Need to co-work with BIOS and Mechanical RD 5. Prepare related design documents 6. Have experience in Motherboard /Server board /Notebook 7. Making BOM 8. Layout review

SSD Hardware Design and Verification: Job responsibilities: SSD HW SI/PI/EMC design and verification quality assurance. 1.SSD HW circuit and PCBA board level design and assembly. 2.Component-level selection and verification. 3. Driver-level SI/PI/EMC design and verification. 4. System-level compliance verification.