「R0169 - Hardware Engineer (Multimedia)」的相似工作

【工作職責】 1. 協助整合空間音效演算法與藍牙音訊Codec（ LHDC）。 2. 協助硬體平台（如Qualcomm、MTK等）應用調教與效能測試。 3. 解決客戶端之音訊相關技術問題。 4. 撰寫技術文件、整合指南、測試報告與客戶問答（FAQ）文件。 5. 協助收集需求與市場趨勢，提供產品優化建議。 6. 定期參與與客戶的技術簡報與教育訓練會議。 【需求技能】 *熟悉藍牙音訊協定（A2DP, HFP, LE Audio）以及音訊Codec（SBC / AAC / LC3 / aptX / LDAC / LHDC）。 *熟悉音訊測試與分析流程(熟悉 oscilloscope、logic analyzer 等工具尤佳) *有初步firmware除錯能力。 【加分技能】 * 具備藍牙模組調音與射頻基本知識。 * 有調教音訊演算法（如回音消除、波束成形、空間混音）經驗。 * 具備Python或MATLAB音訊自動化測試能力。 * 熟悉USB Audio / Windows / macOS Driver 設定與測試流程。 * 處理跨國客戶經驗。

宜鼎國際致力於服務我們的顧客與合作夥伴，鼓勵面對面的互動和團隊合作。因應全球AI應用的發展，公司業務持續成長中，如果您擁有5年相關經驗，並對科技產業充滿熱情，誠摯地邀請您加入我們優秀的團隊，親身體驗我們充滿活力的公司文化。 【工作地點】 －此職位的辦公室設在交通便利的新北市汐止，距離捷運南港站、汐止火車站或交流道僅3-10分鐘車程，大樓就有停車位、Youbike及豐富的公車選擇，讓您的通勤更加便捷。 －辦公大樓過個馬路就到好市多Costco，中午或下班採買日用品超方便，使您的工作和生活更加平衡。 【主要職責】 1. 硬體線路設計開發及系統整合含相關測試及驗證。 2. Regular測試及相關驗證(專案進行及替代料驗證：PWM power、LDO、crystal、Eye diagram、thermal、OCP...)。 3. Compatibility Test：ATTO、HD_tune、IOPS、EVEREST、ATACT...。 4. 協助專案驗證進行：料號申請、BOM、電氣驗證、故障及客訴分析。 5. 安規測試。 【我們提供什麼】 －在全球AI解決方案與工業級儲存領導品牌的公司中實現自我。 －在「一群夥伴、一同經營」核心精神中，積極經營自有品牌，與公司一同成長，共享豐厚的發展機會和福利！ 加入宜鼎國際，一起寫下值得回憶的故事！

1. 硬體設計開發產品及對應車廠需求 2. 進行實車安裝/測試、樣品製作、零件承認流程 3. 製作開發件之量產圖出圖和相關資料 4. 分析產件之不良點及提出改善對策 5. 展示車輛電子部品安裝及拆卸 6. 專案相關技術之支援 7 .主管交辦事項 必備專長: 1. 電子電路量測設備(三用電表、示波器)使用 2. 電路板焊接、零件更換能力

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to the next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons, all while shaping the future of connectivity. Responsibilities - Lead and execute server, storage, data center, and networking motherboard design projects. - Develop schematic diagrams, perform layout reviews, and maintain BOMs to ensure design quality. - Conduct comprehensive power supply validation spreadsheet (Intel/AMD platforms), including efficiency, thermal, stress, dynamic load, ripple noise, stability, and regulation testing. - Utilize VRTT / AMD validation tools and other industry-standard test platforms. - Debug and resolve critical system issues, including burnout, EMI, acoustic noise, ESD, surge, and thermal challenges. - Continuously optimize system performance across efficiency, thermal design, space utilization, noise, and cost dimensions. Requirement - BS or MS in Electrical Engineering (or related field). - 6+ years of hands-on design experience in VRM Core power, DDR power, and POL power on Intel/AMD platforms. - Solid knowledge of power topologies (Buck, Boost, Hot-swap, etc.) and component-level tradeoffs. - Strong expertise in power component specification, selection, and PCB layout best practices. - Proficiency with industry tools such as OrCAD, PADS, Allegro, etc. - Proven ability to diagnose and resolve complex hardware issues with a strong design problem-solving mindset. - Effective communication and collaboration skills, with the ability to influence cross-functional teams. - Demonstrated project leadership experience and accountability for technical deliverables. - Self-driven, proactive, and able to execute quickly under challenging project timelines.

1. Ethernet Switch硬體研發 2. Bom建立 3. 硬體測試與除錯 4. EMI/Safety測試與問題排除

網通產品硬體數位電路設計

1. SSD及相關產品開發 2. 高速訊號完整性模擬 3. 驗證及量產測試設備開發 *熟悉並擅長運用ANSYS SIWAVE尤佳

1. 可獨立負責筆電線路設計 2. 熟悉Platform Guideline 3. 系統問題除錯 4. BOM release 5. 可配合出差，獨立排除生產問題

1. 熟悉Server Board、x86或ARM based (nVidia、Rockchip、TI、Qualcomm..等) 硬體設計。 2. 硬體線路設計、驗證及除錯，PCBA layout檢查及驗證。 3. 主導專案研發進度，管理硬體研發團隊，掌控設計品質與產品開發進度。 4. 研究產業新技術，導入創新產品設計。 5. 管理零件承認並執行CIS導入設計流程。 6. 跨部門溝通協調，軟韌體/機構/設計測試驗證/生產製造等系統整合相關問題。 7. ODM產品設計專案的技術管理，包括帶領團隊從RFQ到設計實現的全過程，與國際客戶直接溝通，理解並轉化其需求為具體設計方案，作為技術窗口參與客戶會議，提供技術解決方案。

1. 產品設計：電路設計、元件選取、線路圖規劃 2. 現有產品優化 3. 研究開發下一代技術 4.配合機構工程師開發硬體 5.執行新產品開發可行性評估、零件材料選用 6.熟風扇PCB Layout 設計者佳

1. 負責視訊產品的 聲學設計研發、測試、調適、分析與改善 2. 主導及規劃視訊產品的 聲學研發設計 3. RFI/RFQ 報價以及方案評估與建議 4. 產品的樣品製作及產線相關問題的分析與解決 5. 新產品導入，量產前的準備，技轉 6. 跨部門溝通協調,建立及改善產品製程技術的優化 7. 聲學相關零件之研究與應用

· Support presales activities and deliver compelling technical demonstrations · Drive technical marketing initiatives and collaborate with cross-functional teams to identify business opportunities · Manage projects from concept to completion, ensuring timely delivery and quality · Perform hands-on tuning and testing of software, algorithms, acoustic systems and products

1. Use C/C++ to do Displayport related firmware design 2. ASIC/FPGA validation (系統除錯) 3. 執行模擬驗證 (熟悉verdi ) 4. FPGA implementation (is a plus)

As the Electrical Engineering (EE) Ass. Manager/Supervisor, you will have the key responsibility for overseeing EE development from the initial concept incubation phase through to mass production (MP). Your role will involve close collaboration with a cross-functional team comprising members from Marketing, Firmware Engineering (FW), Project Management (PM), Mechanical Engineering (ME), and Quality Assurance (QA) to manage the complete design cycles for BMS-related products. Additionally, you will lead the development of new platforms and features to align with the long-term strategic business goals and enhance the competitiveness of the BMS product line.

熟悉 Qualcomm Audio DSP 架構 (如 Hexagon DSP, ADSP/MDSP/SDSP) 及相關開發流程 責任音訊子系統模塊設計、音訊路徑配置、演算法整合並據需據擴展設計/開發文件 進行音訊處理流程的問題分析與效能優化 (如 功耗、延遲、同步) 熟悉 Audio HAL / ALSA / AFE / Audio DSP firmware 開發與調校流程 熟悉 Android 音訊架構 (如 AudioFlinger, AudioPolicyManager) 與 AOSP Audio build system 熟悉 Qualcomm 音訊平台軟體堆疊如: AudioReach / QACT / Audio Calibration Tool / Tuning Tool 等優先 與產品經理討論需求，規劃音訊系統架構與功能路線 協助整合第三方音訊演算法 (如 ANC, VAD, Beamforming) 至 DSP platform 據需擴展 Android framework 模組或更改音訊會訊路徑配置功能 據需編寫單元測試、整合測試設計，確保軟體系統穩定性與品質 【加分條件】 (Preferred Qualifications): 具備 SmartPA 調校、語音觸發 (Voice Activation)、Voice UI 開發經驗 熟悉 Qualcomm SA8155P / SA8295P / Snapdragon Ride 系列平台開發經驗

⚫ Design server system and relative boards and review high-speed PCB layout. ⚫ Work with function team like Power, SI, mechanical and thermal engineers to ensure optimize hardware solutions. ⚫ Come out test plans to ensure base function of hardware. ⚫ Work with suppliers and vendors to select components and solutions. ⚫ Support 2nd source solutions and validation. ⚫ Work closely with firmware teams to integrate and troubleshoot management topology. ⚫ Support manufacturing teams during the production phase.

我們正在尋找一位經驗豐富的硬體經理，加入我們的資深系統整合團隊，負責領導約5人規模的硬體開發小組。該職位將協助管理多項高壓電源相關項目，包括BBU、Automotive、ESS、Marine BMS (電池管理系統)、BBU PMC (電源管理控制器) 以及 BBU DCDC (DC-DC 轉換器) 等專案。工作電壓範圍涵蓋200V至1500V，團隊採用敏捷專案開發方法進行管理，需確保所有專案符合IEC 60730、ECE R10、ISO 26262 等相關國際法規與安全標準。 主要職責 (Key Responsibilities) • 團隊領導與管理：領導並指導約5人硬體工程師團隊，負責任務分配、進度追蹤與績效評估。採用敏捷 (Agile) 方法論，包括Scrum或Kanban框架，確保專案按時交付並優化團隊合作。 • 專案開發與執行：監督BBU、Automotive、ESS、Marine BMS、BBU PMC 及 BBU DCDC 等項目的硬體設計、原型開發、測試與驗證。處理高壓系統 (200V-1500V) 的電路設計、電源效率優化與故障診斷。 • 法規合規與品質控制：確保所有硬體設計符合IEC 60730 (家電安全標準)、ECE R10 (車輛電磁相容性)、ISO 26262 (汽車功能安全) 等相關法規。領導團隊進行風險評估、FMEA (故障模式與影響分析) 及認證流程。 • 技術創新與問題解決：評估新興硬體技術與元件，解決高壓系統中的挑戰，如熱管理、EMC (電磁相容性) 及電池壽命優化。與跨功能團隊 (軟體、系統整合) 合作，推動產品從概念到量產的完整生命周期。 • 資源規劃與報告：管理專案預算、資源分配，並定期向資深系統整合經理報告進度、風險與成果。參與供應商評選與合作，確保供應鏈穩定。 • 知識分享與培訓：指導團隊成員，提升硬體工程技能，並推動持續改善 (Continuous Improvement) 文化。

ᴘᴜʀᴘᴏsᴇ ᴏғ ᴛʜɪs ᴘᴏsɪᴛɪᴏɴ As the Sustain Hardware Technical Lead for the Industrial Ethernet Equipment product line, responsible for leading technical operations, design revisions, and customer technical support for mass-produced products. This role involves coordinating cross-functional collaboration to resolve issues and drive design improvements, with the goal of effectively extending the product lifecycle and mitigating supply chain risks. ᴍᴀᴊᴏʀ ᴀʀᴇᴀs ᴏғ ʀᴇsᴘᴏɴsɪʙɪʟɪᴛʏ 1. Hardware Sustaining & Design Optimization: Lead and execute hardware revisions and design updates in response to supply chain changes (e.g., component end-of-life) or to enhance product performance and reliability. - Project management of all hardware and validation related activities in schedule plan. - Evaluate replace solution and translation into designs. - Evaluate design change requests from customer need. 2. Cross-Functional Collaboration & Problem Solving: Coordinate with cross-functional teams, including R&D, Manufacturing, and Quality Assurance, to efficiently resolve complex hardware issues reported from the field or internal teams. You will be expected to drive root cause analysis and implement continuous improvements in both design and processes. 3. Supply chain Strategic Achievement: Ensure the long-term stability and reliability of the product portfolio. Your efforts will directly contribute to extending the product lifecycle and proactively mitigate supply chain risks to guarantee consistent product delivery. - Evaluate second source and test plan for alternative assessment procedure. - Risk management / Mitigation of Risks regarding component level in product.

該職務為LOTES嘉澤端子位於台北南港的Senior EERD職缺! Job responsibilities: 1. 設計連接器的測試治具或簡單小卡線路並與板廠接洽疊構。 2. 負責設計電子電路原理圖，進行PCB佈局和佈線以確保電路符合設計要求。 3. 根據電路設計需求，選擇合適電子元件，並針對新元件和供應商進行評估。 4. 網路分析儀操作使用。

1. X86 / ARM base 主板/周邊線路規劃、設計開發、測試驗證 2. Panel PC訊號量測、分析，方案評估與相關技術問題對策 3. OEM/ODM 專案評估與整合 4. 工廠生產異常問題分析與解決