「電子材料訊號設計中心 經/副理」的相似工作

This vacancy is open for talent pool collection. We will contact you if we have proper vacancies that fit with your profile. Job Mission Represent manufacturing and act as gatekeeper from manufacturing to D&E function Add value in overall manufacturing processes such as forming, machining, joining, and assembling Job Description Contribute to the solution of faults and takes the necessary initiatives and practical decisions to ensure zero repeat Identify gaps and drive assigned process improvement projects and successful delivery Initiate and drive new procedure changes and projects Develop and maintain networks across several functional stakeholders Prioritize works and projects based on business situation Transfer knowledge and train colleagues on existing and newly introduced products Education Master degree in technical domain (e.g. electrical engineering, mechanical engineering, mechatronics) Experience 3-5 years working experience in design engineering Personal skills Show responsibility for the result of work Show proactive attitude and willing to take initiative Drive for continuous improvement Able to think outside of standard processes Able to work independently Able to co-work with different functional stakeholders Able to demonstrate leadership skills Able to work in a multi-disciplinary team within a high tech(proto) environment Able to think and act within general policies across department levels Diversity and inclusion ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company. Need to know more about applying for a job at ASML? Read our frequently asked questions.

1.新材料開發 2.進行配方研發、檢測、樣品製作 3.管理專案開發進度，跨部門溝通 4.樣品及新材料配發之檢測材料 5.搜尋相關研發材料資訊

1. 建構分散技術知識、跨領域產品開發、納米產品知識、納米材料專利地圖、分散技術地圖、產品地圖及論文地圖 2. 資料收集、整合、分析、報告 3. 實驗設計與執行(DOE, Design of Experiments、田口設計法、Minitab、中央合成設計法 擇一) 4. 統計與分析能力(OriginLab、JMP、SPC、MatLab 擇一 ) 5. 界面科學材料合成與應用、流體力學材料與應用、加成聚合高分子化學反應相關工作 6. 解讀國際期刊論文、原文專利及應用 7. 其他主管交辦事項

1.廠級相關Project, Lead導入與執行 2.配合公司相關品質政策活動之稽核 3.品質異常或客戶回饋問題之改善成效確認 4.執行製程稽核與品管檢驗工作 5.各種品質報表之填寫及稽核 6.ISO相關品質系統維護與執行 7.品質相關活動推展與品質改善活動專案執行 8.品管作業規範執行與稽核

1.依照風險評估擬定及執行年度稽核計畫，並對稽核結果提出報告及建議，與追蹤改善事項，以確保內部控制制度之有效執行； 2.指導並監督稽核團隊的工作，確保稽核報告的質量及可靠性； 3.可獨立進行內稽相關作業； 4.主管交辦專案等事項。

1、各循環之各項作業查核 2、主管交代事項處理 (此職務工作需出差，出差時間可議)

- Job Description - We are looking for a highly motivated SI/PI Engineer to join our technical team. You will play a key role in simulating and analyzing high-speed signal and power integrity in next-generation probe card systems. Using advanced 3D modeling and full-wave simulation tools, you will help push the boundaries of traditional limitations and enable breakthrough designs supported by our proprietary processes. - Responsibilities - • Develop and optimize 3D SI/PI models for high-speed test interfaces • Perform system-level simulations using tools such as Ansys HFSS, SIwave, ADS • Explore new layout and structural ideas enabled by our in-house fabrication capabilities • Evaluate the impact of materials and design configurations on SI/PI performance • Collaborate with R&D and manufacturing teams to improve PDN and signal routing reliability - Qualifications - • Master’s degree or above in Electrical Engineering, Electronics, Telecommunications, Physics, Materials Science, Mechanical Engineering, or related fields • 1+ years of experience in SI/PI simulation and modeling; background in probe card, PCB, or advanced packaging is a plus • Proficient in 3D modeling and simulation tools (e.g., HFSS, CST, COMSOL) • Strong analytical thinking and self-driven problem-solving capabilities • Good command of technical English (reading and documentation) - What We Offer - • Opportunity to develop next-generation probe card platforms that lead the industry • Collaborative and innovation-driven work environment with Taiwan & U.S. teams • Fast learning curve, strong technical exposure, and room for individual impact

1. Ensure PKG design is optimized with SI/PI/Thermal requirements. 2. Create the PKG/RDL/Subtract SI 3D modeling and perform extraction of S-Parameters and RLGC model. 3. Full-wave modeling of VIAs, Connectors, Package and PCB channels, components using 3D full-wave EM tools. 4. Provide the CM(Construction rules) and Design Rules(guidelines) for the PKG/RDL/Subtract design. 5. Provide the Substrate manufacturing process and material property. 6. SI(Signal integrity) simulation and optimization on package stack-up, power/ ground plane assignment and optimization, decoupling cap locations to minimize power ground noise. 7. PI(Power integrity) analysis for state of art package/system designs, which include but not limited to package layout model extraction, transient noise analysis to meet the silicon noise spec, decoupling strategy and analysis. 8. CTK(Crosstalk) analysis and reduction on-package considering mutual-effect by on-die, on-silicon interposer and on-PCB. 9. SSN(Simultaneous Switching Noise)/SSO analysis for I/O (DDR5/4/3, LPDDR5/4/3, etc.) power domain. 10. Eye diagram(ZRZ/PAM4) and jitter analysis for CPS(Die Chip-PKG-System PCB) co-simulations. 11. Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements. 12. Familiar with assembly and substrate manufacturing process is a plus. 13. Familiar with programming/scripting in Java, VBScript, PERL, TCL, MatLab and/or equivalent. 14. Experienced in SI PI automation tool development with Python or PyAEDT is a plus. 15. Working with ASIC/HW/Production team.

【工作內容】 1.測試電路繪製與設計 2.案件排程掌握/協調 3.對客戶及對內的工程窗口 4.PCB layout 確認比對 5.電路除錯修改 6.特殊零件選購

1. 月休十天，視情況配合早晚輪調，新人訓練期需到台中受訓(含宿舍)。 2. 機台維修及定期檢查及保養，如客戶設備安裝、維護、維修、網路問題排除。 3. 回報產品功能異常狀況，並建立問題資料表單。 4. 後端管理系統問題排除。 5. 具備汽車駕照(上班值勤需開公務車)。

我們的宗旨：打破科技的冰冷印象，傳遞溫暖給每個人❤️ 在開放、靈活的環境中，我們鼓勵團隊成員主動創造工作產出，養成自行找出解決方案且取得成果的習慣，並引以為傲。 當然，我們也會提供所需的培訓，搭配公開透明的薪資與升遷管道，協助每個夥伴成長，甚至開放內部創業的機會！ 【職務內容】 1. 蘋果手機維修。 2. 外配模組零件更換、功能測試、故障排除。 3. 料件管理(手機零件叫貨、進貨、盤點)。 4. 烙鐵風槍使用。 5. 各門市維修件收件及配送 6. 基本門市銷售 【具備條件】 1. 工作態度積極、主動、有責任心、個性細心 有耐心 2. 個性活潑外向，對手機通訊業有興趣尤佳 3. 臨場應變能力佳，喜愛與人互動 4. 具積極的學習態度與學習能力 =================================================== 正職員工福利 : 員工聚餐、員工旅遊、員工優惠、排休彈性、工作氛圍愉快同事好相處 【晉升管道】 完善的升遷管道： 門市專員-> 儲備幹部 -> 店長 -> 區經理 -> 協理 ->執行長 ➽ 區經理：年薪破百萬。 ►人生有三分之一的時間在工作，讓我們一起，為這三分之一的人生，創造出你理想中的意義與價值吧！ 門市擴大徵才，我們正在找優秀人才，歡迎加入我們的團隊一同共創屬於你的未來！ 歡迎活潑、外向、有企圖心，想挑戰高薪的你!

探針卡電性模擬/量測及高頻/高速產品專案開發研究

1.負責設計前之研究分析，擬定新產品開發策略。 2.運用人因工程、市場需求、造型趨向、產品分析等設計技術，建立設計之準則。 3.以草圖繪製、精密描寫、色彩計畫、造型研究、模型試作等方式，進行設計展開。 4.提出與產品外觀有關之機構問題的解決方案，並繪製圖畫，製作模型。 5.提供產品包裝工程及商業設計方面的諮詢。

<工作內容> ・與客戶、總公司R&D協調客製化規格並協助產品開發進度掌控與追蹤 ・客製化規格報價 ・Trouble Shooting(協助解決客戶端發生之問題) ・公司組織文化活動 ・其他主管交辦事務 <希望條件> ・ 具備專案執行、整合及跨部門溝通協調能力 ・了解產品應用技術與分析 ・可配合海內外出差 ・日檢N1以上

RF探針卡開發與製作 1.使用繪圖軟體-機械結構設計、分析、出圖、詢價、發包、驗收 2.設計組裝工治具-設計架構確認，功能性、可靠度、再現性 3.製作原因分析與改善對策執行報告

1.執行長/總經理交辦事項 2.協助安排執行長內/外會議行程 3.協助行銷策略推廣企劃 4.專案管理,經營管理分析 5.協助IRO主管維護投資人關係/公共關係 6.股務作業.I.E.協助股東會及董事行政作業

1.與客戶溝通設計規格 2.協調內部各工程單位時程 3.繪製OrCAD電路圖 4. Allegro進行Layout 5.零件立for Allegro

【徵求 】 大學以上化學相關科系畢業，認真、上進、肯學習的人才加入我們的團隊。 【工作內容】 1.發泡生產線製程監控。 2.原料耗用上傳系統。 3.產品物性檢測與異常分析報告。 4.產品開發與優化。 5.每月原料使用的估算。 6.原料進、出管理。

[General Summary] As a forward-thinking technology company, Augentix advances the limits of innovation in "Industrial and Embedded IoT" to deliver next-generation experiences and accelerate digital transformation toward a smarter, more seamlessly connected world. We are seeking a PCB Design Engineer with strong theoretical foundation and simulation driven design methodology to lead high speed board level development. You will be responsible for defining and verifying board level electrical design, ensuring optimal signal integrity across multiple high speed interfaces. You will be supported by experienced layout engineers capable of implementing your design guidance and constraints, allowing you to focus on PCB circuit design and system validation. This position offers the opportunity to build structured PCB design practices, improve team capability, and drive electrical excellence through direct ownership of simulation and cross team collaboration. [Responsibilities] ★ Lead system level PCB electrical design for interfaces such as LPDDR4/5, USB 3.x, SDIO 3.x, MIPI and Ethernet. ★ Define PCB stack up and routing strategy to meet signal integrity objectives. ★ Perform circuit level simulations using tools such as PSpice. ★ Own schematic level electrical planning and define layout constraints for critical signal groups. ★ Provide guidance to supporting layout engineers to ensure adherence to electrical rules and best practices. ★ Correlate simulation results with lab measurements and assist in electrical issue root cause analysis. ★ Document simulation methodology constraint guidelines and validation reports. ★ Occasional business travel across APAC and other regions may be required. [Minimum Qualifications] ★ Familiarity with differential and single ended routing across LPDDR4/5, USB 3.x, SDIO 3.x, MIPI and Ethernet. ★ Proficiency with layout tools such as Allegro. ★ Exposure to EMI mitigation techniques and hands on experience in EMI pre compliance testing. ★ Demonstrated ability to lead layout teams or mentor junior engineers in constraint based PCB design. ★ Ability to create structured documentation and design guidelines to scale internal processes. ★ Strong debugging and problem solving skills with working knowledge of firmware and software to support system level root cause analysis. ★ Comfortable working in a globally distributed, cross-disciplinary engineering team.

THE ROLE The Lead Signal Integrity Engineer is a technical leader responsible for advancing Isola’s laminate materials to meet and exceed high-speed electrical and signal integrity (SI) performance requirements. This role provides mentorship and direction to the Signal Integrity team in Taiwan, drives innovation in SI test methodologies, and ensures strong technical engagement with global OEMs. The Lead serves as a recognized authority in SI, bridging customer needs with material performance and representing Isola in the high-performance electronics community. KEY RESPONSIBILITIES: Customer-Facing Technical Support: • Lead technical engagement with OEMs and direct customers on high-speed laminate characterization. • Act as primary technical contact for SI-related design validation and adoption cycles. • Oversee the creation of technical reports, white papers, and collateral for internal and external use. Strategic & Technical Leadership: • Define and develop advanced SI measurement, modeling, and simulation methodologies. • Collaborate with Product Management, R&D, and Sales to ensure alignment of SI capabilities with product strategy. • Represent Isola as a thought leader through publications, conferences, and industry forums. Organizational Management: • Mentor, guide, and grow the Taiwan-based Signal Integrity Engineering team. • Establish scalable, cost-effective SI test methods that accelerate R&D and customer response. • Drive alignment with global Application Engineering teams to ensure best-in-class technical service. Technology & Standards Thought Leadership: • Maintain expertise in SI methods, PCB processing effects, and high-speed digital design requirements. • Contribute to industry standards development and support customer forums on SI requirements. QUALIFICATIONS & EXPERIENCE • 8+ years of experience in signal integrity engineering, PCB laminates, or high-speed design. • Expertise in VNA measurements, probing techniques, and advanced SI methodologies. • Experience with PCB manufacturing and processing effects on SI performance. • Demonstrated leadership and mentoring experience. • Proven record of technical publications, white papers, or conference presentations. EDUCATION • PhD or Master’s in Electrical Engineering or related field required. OTHER CONSIDERATIONS • Fluent in English – required for global communication and technical documentation. • Proficiency in Mandarin Chinese – strongly preferred for engagement with Taiwan/China teams and customers. • Ability to travel regionally and globally as needed.