「【新鮮人專區】2026研發替代役/預聘-軟體工程師」的相似工作

此專區為符合2026年研發替代役及預聘者投遞，如非研替身分者，歡迎投遞創未來其他職缺！ ##職務類別 1. 硬體研發工程師-RF 2. 硬體研發工程師-Power 3. 系統驗證工程師 4. 元件工程師 ##工作內容 1. RF系統電路架構規劃及設計或系統電源電路(AC-DC/DC-DC/保護電路)、數位控制電路(MCU/FPGA)架構規劃及設計、元件電路板設計/繪製/量測/除錯 2. 電路板測試驗證及除錯檢討、環境測試(輻射測試/EMC測試/溫度測試) 3. 執行產品研發流程及技術文件產出 4. 協助系統規劃、整合、測試、分析與除錯 5. 與驗證部門合作進行環境測試 ##技能需求 1. 具電路 RF / Analog / Digital 電路設計經驗 2. 熟悉量測儀器使用，如SA / NA / SG等 3. 具備基礎焊接能力 ##應徵資格 - 2026年畢業之應屆畢業生 - 研究所以上電子/電機/電信相關科系畢業，專長於主動電路設計領域尤佳 - 欲應徵者請檢附成績單、論文摘要

▋ 關於德州儀器 德州儀器(TI)是位居類比晶片世界領導地位的半導體設計與製造公司，持續提供創新及頂尖的半導體技術與產品，協助客戶開發最先進的電子產品。除此之外，TI也針對在校學生及初入社會新鮮人設計完整的培訓制度與挑戰性的工作內容，並提供具競爭力的薪資與福利、完善的升遷管道、輪調培訓計畫以及活潑與國際化的工作環境。 ▋ 應用工程師職務說明 >>在TI做FAE，您可以… • 參與FAE完整培訓計畫，包含1對1 coach、豐富教育訓練資源 • 與全世界專家合作，參與跨國會議及海內外輪調計畫，在國際舞台成長 • 接觸TI多元產品線，包含熟悉的#消費性電子 、時下最夯的#車用電子 ，以及工業用等產品 • 透過專案及團隊合作，快速累積技術硬實力及溝通軟實力 • 享受開放扁平的組織氛圍，不論是專業領域或職涯發展，都能夠勇敢表達 • 走出多元職涯，不論是技術導向的技術專家(technical ladder program) 或是領導團隊的用人主管，TI提供暢通的升遷管道讓您有機會被全世界看見 >>FAE在做什麼 作為“Technical Expertise”，與Technical Sales Engineer併肩合作，了解客戶的技術需求、解決客戶的技術痛點，將TI產品特性與客戶系統需求聯結起來。運用產品選擇、系統、實現和調試方面的技術能力，從而實現業務目標。 • 積極與客戶建立關係，及時掌握客戶開案訊息，進而瞭解其需求與系統設計，推展TI的產品讓客戶的設計更有市場競爭力。 • 透過TI全球技術資源，提供專業技術服務，解決TI產品應用在客戶系統上的技術問題，協助客戶順利導入量產。 • 了解TI系統及產品，並研究同業競爭的狀況，反應客戶需求及市場資訊給研發團隊做為未來產品開發的參考。 ▋ 科技菁英計劃 - TI 應用工程師輪調培訓計畫 有思考過RD之外的另一種職涯可能嗎? 喜歡與人互動並充滿挑戰的工作卻又擔心新鮮人無法立即上手嗎? 別擔心! TI針對FAE新鮮人提供海內外全面且扎實的系列培訓課程， 透過課堂及工作日常的任務的學習，您將具備FAE應具備的各項知識與技能，在客戶面前成為專業與自信的FAE！ 另外，TI亦提供完整的輪調計劃，透過給予新人不同職務內容的學習， 使其能在公司有更多成長及發展的機會。 Business Summary: • New Hire Orientation & Field Sales Office Rotation • Gain basic understanding of TI, our products, the program itself, how to navigate corporate life, and your first taste of sales tools and skills. • Basic understanding of the FAE role, inclusive of relationship building, sales processes, tools and all things relevant to account growth, technical skills, and TI product knowledge • Understand the different roles in the sales office, the customer markets and end equipment, and expectations of a good FAE. Develop an understanding of what makes the various roles successful. • Learn the working models of successful partnerships, and understand the importance of each business process. • Systems Engineering & Marketing rotation • Understand key EE/subsystem design challenges and build collaboration with Sales & BU to support customer and win business • Utilize sales tools and TI.com systems content to become more efficient and effective during Sales process • Understand SEM’s role & responsibility, and how field, BU, and SEM work together to find more and win more 看更多徵才資訊與FAE工作介紹=>https://drive.google.com/file/d/14OG1-iePlNZ8wYJYcnFohLzfBShGg4Th/view?usp=sharing 歡迎至TI職涯官網 https://careers.ti.com/students/ 看更多內容 #R&D外的另一種選擇 #IC Design的另一種選擇 #結合技術及與人溝通 #探索不同產品之技術與應用 #走出多元彈性的職涯 #年薪(含紅利)百萬起跳!

此專區為符合2026年研發替代役及預聘者投遞，如非研替/預聘身分者，歡迎投遞創未來其他職缺！ ##職務類別 1. 數位IP設計工程師 2. 數位前端整合工程師 3. 數位電路FPGA整合設計工程師 4. 韌體工程師 5. 數位訊號處理演算法工程師 ##工作內容 1. 應用於雷達、數位感測、衛星通訊之訊號處理數位IP設計。 2. 數位IP架構設計與實作。 3. FPGA數位系統開發與整合合成優化。 4. 微波、類比電路控制、校準設計韌體實作 。 ##技能需求 1. 具數位訊號處理經驗。 2. 具備數位電路設計經驗。 3. 熟悉Verilog/VHDL、TCL等。 ##應徵資格 1. 2026年畢業之應屆碩/博畢業生。 2. 研究所以上電子/電機/電信/通訊相關科系畢業。 3. 欲應徵者請檢附成績單、論文摘要。

1.通訊系統軟體維護 2.通訊協議軟體設計

NVIDIA's invention of the GPU 1999 fueled the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI— the next era of computing — with the GPU acting as the brain of computers, robots, and self-driving cars that can perceive and understand the world. Today, we are increasingly known as “the AI computing company". We are looking to grow our company, and grow with the most talent in the world! We are looking for a Structural Test Engineer to be part of our Manufacturing Test Team. You will be building next-generation boards and systems, work closely with cross functional teams and suppliers to drive Functional Test HW solution. This position offers the opportunity to have real impact in a multifaceted, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence. The ideal candidate will drive the scope of structural test plan on baseboards/systems with cross functional teams, review design concept, define validation plan, develop/automate configurations of test infrastructure to test various product features, and optimize test cost/quality/manufacturability. The candidate will be responsible for the development and implementation of structural test plan since EVT build to find SMT, PCB, and component issues earlier to catch and fix rather than finding them later at following stations which will complicate and delay the debug time. You will work closely with PCB designers, tester vendors, fixture houses and CMs to enable the process. What you will be doing: - Define ICT capability, HW design requirements, and board debug capabilities from design review phase, NPI bring-up to mass production phase. - Optimize the structural test plan to find SMT, PCB, and component issues earlier. - Develop Data Science – machine learning of structural tests thru data feed forward and backward. - Work with board designers, layout engineers, tester vendors, and fixture houses by providing detailed DFM and guidance to meet ICT requirements. - Provide support for production bring-up and debugging. - Support new tester platform bring-up in Taiwan. (ICT, BSI, FCT universal tester, etc.). - Coordinate test fixtures/platform automation with suppliers, CMs, and global team. - Define and provide procedure/document and technical support if needed.

歡迎2026年畢業並正在找尋研發替代役的同學申請! Direction 1: System Design Power Validation Engineer Direction 2: PCB Layout Engineer Direction 3: System Application Engineer Direction 4: System Engineer, Enterprise What you'll be doing: • Collaborate with system design, hardware, and power engineering teams to participate in end-to-end design, validation, and optimization of hardware products (such as GPUs, AI accelerators, server platforms, etc.) • Responsible for circuit schematic design and PCB layout using EDA tools (such as Altium, Cadence, Mentor Graphics) for multilayer high-speed board design and optimization • Perform PCB design reviews, assist in resolving signal integrity, power integrity, EMI/EMC issues to improve design quality and manufacturability • Participate in board bring-up, debugging, power testing, and performance validation of hardware prototypes, helping to ensure optimal power efficiency under varying operating conditions • Write and maintain design, validation, and test documentation, including but not limited to design specifications, validation reports, and test plans • Work closely with cross-functional teams to continuously improve design processes and enhance product innovation and competitiveness What we need to see: • Hold a Master of Science/Ph.D in Electrical Engineering or related field • Familiar with circuit schematic design and PCB layout processes, and basic proficiency with EDA tools (such as Altium, Cadence Allegro/OrCAD, Mentor PADS, etc.) • Strong interest in power management, DC-DC converters, signal integrity, and high-speed digital design is a plus • Good debugging, analysis, and problem-solving skills; able to work independently or within a team to resolve design and validation challenges • Good command of English for reading technical documentation and communication • Proactive, eager to learn, and passionate about the latest electronics and AI hardware technologies 應徵方式: 請提供以下資料： • 英文個人履歷 • 學士+碩士成績單 (中英文皆可) 提交申請: 請將上述資料投遞至104，符合資格者將會收到進一步的聯繫通知。

具備替代役男資格 對程式開發有高度熱忱

歡迎2026年畢業並正在找尋研發替代役的同學申請! We are seeking talented Firmware Engineers to join our team to work at the intersection of hardware and software, contributing to the core firmware that powers NVIDIA’s industry-leading GPUs and high-performance server products. In this role, you will design, develop, and optimize low-level software that enables reliable operation, high performance, and advanced features for both GPU and server platforms. These directions are: Direction 1: GPU Firmware Engineer Direction 2: Server Firmware Developer You’ll be doing: • Design, implement, and test embedded firmware for NVIDIA GPUs and server systems, enabling seamless hardware-software interaction. • Develop, maintain, and enhance bootloaders, device initialization code, and system management features. • Work closely with hardware, software, and systems teams to ensure robust bring-up and integration of new silicon and server platforms. • Diagnose, debug, and solve complex firmware and hardware-related issues across various development and production environments. • Drive innovation and optimization in areas such as power management, error handling, security, and performance monitoring for GPU and server hardware. • Contribute to documentation, compliance, and support for new product features and industry standards. Qualifications: • Master’s degree in Computer Engineering, Electrical Engineering, Computer Science, or related field. • Proficiency in C/C++ and embedded firmware development principles. • Understanding of computer architecture, hardware interfaces (I2C, SPI, PCIe), and real-time operating systems. • Experience with hardware bring-up, debugging tools, and low-level programming. • Strong analytical, troubleshooting, and communication skills. • Experience with server, GPU, or large-scale data center hardware is a plus. 應徵方式: 請提供以下資料： • 英文個人履歷 • 學士+碩士成績單 (中英文皆可) 提交申請: 請將上述資料投遞至104，符合資格者將會收到進一步的聯繫通知。

▋ 關於德州儀器 德州儀器(TI)是位居類比晶片世界領導地位的半導體設計與製造公司，持續提供創新及頂尖的半導體技術與產品，協助客戶開發最先進的電子產品。除此之外，TI也針對在校學生及初入社會新鮮人設計完整的培訓制度與挑戰性的工作內容，並提供具競爭力的薪資與福利、完善的升遷管、輪調培訓計畫以及活潑與國際化的工作環境。 ▋科技菁英計劃 - TI 應用工程師輪調培訓計畫 有思考過RD、IC設計之外的另一種職涯可能嗎? 喜歡與人互動並充滿挑戰的工作卻又擔心新鮮人無法立即上手嗎? 別擔心! TI針對FAE新鮮人提供海內外全面且扎實的系列培訓課程， 透過課堂及工作日常的任務的學習，您將具備FAE應具備的各項知識與技能，在客戶面前成為專業與自信的FAE！ 另外，TI亦提供完整的輪調計劃，透過給予新人不同職務內容的學習， 使其能在公司有更多成長及發展的機會。 ▋ 應用工程師職務說明 >>在TI做FAE，您可以… • 參與FAE完整培訓計畫，包含1對1 coach、豐富教育訓練資源 • 與全世界技術專家合作，參與跨國會議及海內外輪調計畫，在國際舞台成長 • 接觸TI多元產品線，包含熟悉的#消費性電子、時下最夯的#車用電子 ，以及工業用等產品，共超過8萬顆產品，學無止境！ • 透過專案及團隊合作，快速累積技術硬實力及溝通軟實力 • 享受開放扁平的組織氛圍，不論是專業領域或職涯發展，都能夠勇敢表達 • 走出多元職涯，不論是技術導向的技術專家(technical ladder program) 或是領導團隊的用人主管，TI提供暢通的升遷管道讓您有機會被全世界看見 >>FAE在做什麼 作為“Technical Expert”，與Technical Sales Engineer併肩合作，了解客戶的技術需求、解決客戶的技術痛點，將TI產品特性與客戶系統需求聯結起來。運用產品選擇、系統、實現和調試方面的技術能力，從而實現業務目標。 • 積極與客戶建立關係，及時掌握客戶開案訊息，進而瞭解其需求與系統設計，推展TI的產品讓客戶的設計更有市場競爭力。 • 透過TI全球技術資源，提供專業技術服務，解決TI產品應用在客戶系統上的技術問題，協助客戶順利導入量產。 • 了解TI系統及產品，並研究同業競爭的狀況，反應客戶需求及市場資訊給研發團隊做為未來產品開發的參考。 看更多徵才資訊與FAE工作介紹=> https://www.facebook.com/texasinstrumentsTW/videos/1382188632429211 歡迎至https://www.cakeresume.com/resources/texas-instruments?locale=zh-TW 看更多內容 #R&D外的另一種選擇 #IC Design的另一種選擇 #結合技術及與人溝通 #探索不同產品之技術與應用 #走出多元彈性的職涯 #年薪(含紅利)百萬起跳 ▋ 面試準備: • Phone interview: 1. 對德州儀器及此職務的了解: o 針對德州儀器的業務範圍或是德州儀器在台灣的業務發展 2. 投遞動機 o 針對此職務為什麼想要投遞 o 對職務的了解程度 o 未來工作發展方向 • 第一關面試準備: 1. 英文自我介紹 2. 簡報(碩論題目或是DC/Amplifier介紹) • 第二關面試準備: 1. 針對工作內容了解 2. 職涯發展方向 3. 情境考題

歡迎2026年畢業並正在找尋研發替代役的同學申請! We have multiple directions to develop your career in NVIDIA as a software engineer, from core infrastructure development to processor architecture design, from graphics to compute, from GPU to Terga mobile system, from GPU kernel to system applications, android platform solutions, and AI algorithm. These directions are: Direction 1: Security System Software Engineer Direction 2: System Software Engineer – USB/Silicon/Embedded Power/Jetson/Automotive/Base OS Direction 3: Android Software Engineer Direction 4: Software Engineer, CAD DFT Direction 5: Tegra Software Engineer Direction 6: BaseOS Foundry Engineer Direction 7: Software Engineering, Autonomous Vehicles Direction 8: Diag Software Engineer What you’ll be doing: Join NVIDIA and become an integral part of our mission to shape the future of AI and advanced computing platforms. We are looking for passionate engineers to contribute across multiple core areas including system software, security, embedded and automotive platforms, Tegra, Base OS development, and more. As part of our diverse engineering teams, you will develop, optimize, and maintain foundational and cutting-edge software solutions that power NVIDIA’s world-class products. You will have the opportunity to focus on one or more of these key directions: • Security System Software Engineering: Design, implement, and validate security features for NVIDIA platforms across automotive, embedded, and data center products—including OS security modules, trusted firmware, and security certifications. • System Software Engineering (USB, Silicon, Embedded Power, Jetson, Automotive, Base OS): Develop and optimize software stacks and drivers at the hardware-software interface for platforms such as Jetson, automotive systems, and embedded devices, ensuring robust, reliable, and high-performing solutions from bring-up to mass production. • Android Software Engineering: Maintain and enhance Android OS on NVIDIA products, solve platform compatibility and integration challenges, and deliver advanced features and best-in-class user experience for mobile and embedded applications. • Software Engineer, CAD DFT: Develop softwares for inhouse DFT use. Connect with users to spec out software behavior. Collaborate with programming experts to design algorithms, program architecture, and implementation. Improve infrastructure to verify the correctness of the software. • Tegra Software Engineering: Design, develop, and debug core drivers and diagnostic tools for NVIDIA’s Tegra SoCs and related GPU platforms, covering product lifecycle from initial bring-up through manufacturing and deployment. • Base OS Foundry Engineering: Interface platform operating systems with advanced silicon foundry processes, standardizing operational flows to ensure quality, yield, and product performance for high-volume manufacturing. • Software Engineering for Autonomous Vehicles: Design and integrate core modules for perception, planning, sensor integration, and simulation for NVIDIA’s autonomous driving stack, delivering reliable and scalable solutions for the future of mobility. • Diag (diagnostics) software engineer at NVIDIA develops and maintains software tools used to validate and test next-generation GPUs and systems at both the hardware and software levels. What We Are Looking For: • MS or above in EE/CS • Experience for system software and embedded platform development and optimization. • Strong programming skills (such as C/C++ or Python) and demonstrated ability to analyze and solve complex problems. • Experience with relevant tools, OS stacks, or frameworks. • Collaborative, communicative, and able to thrive in a fast-paced technology environment. • Enthusiasm for AI, embedded systems, automotive electronics, or autonomous driving is a strong plus. • Fluent English communication ability 應徵方式: 請提供以下資料： • 英文個人履歷 • 學士+碩士成績單 (中英文皆可) 提交申請: 請將上述資料投遞至104，符合資格者將會收到進一步的聯繫通知。

By submitting your resume, you’re expressing interest in our 2026 RDSS (Research and Development Substitute Services) program. Please confirm your eligibility with the local district office before applying the role. What you’ll be doing: Communicate between Master planner and factories to meet loading demands. Communicate between internal departments and factories to clarify issues related with spec / rule / definition. Experience in optimizing loading combination for merging and to define rules of implementation in system, work orders releasing and inventory control. Ensure all released WIPs are well executed at the factories and all build plans are meeting the committed SODs and cycle time. Work/communicate with biz planning & Engr on DOE and urgent engineering demands. Continue to drive factory improvement; KPI includes SOD hit rate, cycle time, and efficiency. Drive factories on fixing real world operational problems to make sure execution happens, roadblock removal. What we need to see:  MS of Industrial Engineering or Planning or Business related Skills: Good communication, problem-solving, teamwork, detailed oriented, organizational, quantitative skills, proficiency with business software applications Professional IT skills, Include MS office, excel VBA, excel macro Familiar with ERP function ( especially SAP ) Language: Fluent English on reading, writing, speaking, listening Personality : Organized, self-starter with a strong sense of ownership is a must. Ways to stand out from the crowd: Drive factories on fixing real world operational problems to make sure execution happens, roadblock removal. Excellent communication skills between PE/BP/FP/subcon 

1.研究LED、IC等量測系統開發 2.量測系統演算法開發，工具BCB、C# 3.光電量測系統的研究/設計/製作/測試/改善 4.LED客戶產品開發與問題處理 5.影像處理

【硬體及設計類】 1.協助產品開發及量產導入 2.材料評估、光學模擬、支架設計 3.成本優化 4.包含紅外線、背光、消費性、車用、照明等產品應用 【軟體類】 1.軟體設計工程師 (前後端開發) 2. AI工程師

1.機台運動控制程序設計及撰寫 2.基本電路異常排除 3.機台操作及調適

1.電路圖識圖 2.基本電路異常排除 3.運動控制程式撰寫 4.機台操作及調適

玩美移動（Perfect Corp.）是全球領先的 AI＋AR 美妝與時尚 SaaS 科技公司，服務已觸及超過 10 億名全球用戶。我們結合人工智慧與擴增實境，重新定義數位美妝與時尚體驗。加入我們，你將有機會直接與海外品牌端合作，推動專案落地，打造下一代數位解決方案。 工作內容 在這個角色中，你不只是「專案管理者」，更是推動專案成功的關鍵推手： 1.全程管理國際軟體專案，涵蓋規劃、分析、設計、開發、驗證到使用者測試。 2.與研發團隊密切合作，將創意與技術轉化為具體成果。 3.協調專案進度，確保每個里程碑如期完成。 4.面對需求變更與專案風險，提出解決方案並追蹤跨部門問題。 5.與業務團隊一同對接客戶，確保專案需求精準落實。 我們希望你具備以下特質與能力： 1.具備 1–3 年以上專案管理或相關經驗，資訊相關背景尤佳。 2.具備良好的英文溝通能力，能與 海外品牌端進行需求對接與簡報。 3.能同時管理多個專案，並在時程內完成交付，具備獨立解決問題的能力。 4.喜歡團隊合作，能協調內部研發並與品牌端保持良好溝通。 5.若你熟悉敏捷開發，或對美妝與流行產業有高度興趣，將是加分！ 為什麼加入我們? 這不僅是一份工作，而是一段國際化的職涯旅程！ 1.直接參與國際專案，站在第一線累積跨國合作經驗。 2.深入 AI 與 AR 技術應用，探索美妝與時尚數位化的未來。 3.在多元團隊中合作，快速拓展專案管理與跨領域能力。 4.加速職涯成長，成為能駕馭國際專案的專業人才。

##Job Description - Digital signal and data processing algorithm design for phased array radars and anti-drone systems. - Algorithm performance evaluation, testing, and implementation. - Computer simulator establishment, including the modeling of wireless channels, no-ideal hardware effects, target and clutter characteristics. - Participation in field trials with algorithm module parameter tuning. - Study of technical specification and theoretical analysis of related products in anti-drone systems. ##Skills - Master of digital signal processing and communications principles. - Being familiar with array and adaptive signal processing, beamforming, spectral analysis, and matrix decomposition. - Skills in the programming languages of MATLAB, Python, and C++, and the tools of Git, LaTeX, and CVX. - Preferable experience in the programming languages of Go, Scala, and FPGA implementation. - Abilities to qualitative description and quantitative analysis.

#R&D外的另一種選擇 #IC Design的另一種選擇 #結合技術及與人溝通 #探索不同產品之技術與應用 #走出多元彈性的職涯 ▋ 2026暑期實習計畫介紹 在德州儀器Texas Instruments實習的期間，將有專屬學長姐帶領您，體驗快速變動的跨國際工作環境，獲得充足的專業訓練、貼近實務工作的專案實務經驗，並能享用公司各式線上資源，享受與正職員工同等的優渥的福利待遇，並能優先獲得畢業轉正職的預聘機會，畢業立刻就業！ 您可以說「在TI，你所做的不只是一份工作，而是在參與改寫人類科技及生活方式的發展史」；加入TI，你有機會與全世界的菁英互動，TI更是你展現獨特智慧與潛能的最佳平台。 ▋ 實習期間及實習地點 • 實習期間：2026年07月至2025年08月 • 實習地點：台北松山業務辦公室 ▋ 應用工程師實習職務說明 作為“Technical Expert”，與Technical Sales Engineer併肩合作，了解客戶的技術需求、解決客戶的技術痛點，將TI產品特性與客戶系統需求聯結起來。運用產品選擇、系統、實現和調試方面的技術能力，從而實現業務目標。 • 積極與客戶建立關係，及時掌握客戶開案訊息，進而瞭解其需求與系統設計，推展TI的產品讓客戶的設計更有市場競爭力。 • 透過TI全球技術資源，提供專業技術服務，解決TI產品應用在客戶系統上的技術問題，協助客戶順利導入量產。 • 了解TI系統及產品，並研究同業競爭的狀況，反應客戶需求及市場資訊給研發團隊做為未來產品開發的參考。 ▋ 從應用工程師實習可獲得甚麼 In this role, you will promote TI products and provide technical solutions to customers that will ultimately go into consumer products like Industrial, Automotive devices, Smartphones, PC peripherals, personal medical devices, electric cars, e-bikes and much more. You’ll also provide technical support and engage with customers to help define new products and opportunities for future product development.

「台達研究院」成立於2013年，由各領域專家組成，專注於研發台達下下世代 (next-next-generation) 產品之前瞻技術，開發新一代的創新產品，在台北、台南等地設有研發實驗室，加速了解產業需求、驗證技術與解決方案的多面向整合。 我們致力於協助建構企業級的軟體與韌體開發輔助工具 (Coding Copilot)，研發、設計並實作各式 AI Agents 來提升軟、韌體的品質與開發效率。工作將橫跨 LLM 微調、Agent 架構設計、最新技術的調研與實作，以及服務架構的建置與維運，打造真正落地的 AI 工具鏈。 工作內容包含但不限於: • 設計與實作 AI Agentic Workflow：將需求轉化為可部署、可擴展的 AI Agent 流程 • 微調 LLM 模型：針對特定任務進行模型微調，提升模型在特定領域的表現 • AgentOps 與 LLMOps：負責 AI Agent 的部署、監控與維護，確保穩定與高效運作 補充說明: 在這裡，不只是做研究，而是能將想法轉化為真正落地的 AI 工具。 • 全棧歷練：從設計、開發到部署，參與 AI Agent 的完整生命週期，累積難得的端到端經驗 • 實際影響力：成果將直接應用於台達場景，解決真實產業痛點 • 方法不設限：用各種創新方法解決真實痛點，挑戰沒有標準答案的問題 • 自由創造：親手打造理想中的 coding 工具，讓更多開發者一同使用，體驗創造的成就感

1. 用於多軸CNC與機器人之運動控制演算法開發 2. 路徑規劃、平滑、擬合演算法開發與模擬 3. 軸運動控制之精度、速度與穩定度之分析、模擬、改善 4. 自動控制理論應用於軸運動控制 5. 伺服性能整合