「【半導體業】碳化矽產品設計工程師《近捷運站，交通便利》」的相似工作

1.新製程機台保養技術導入 2.設備規範建立與維護 3.設備異常處理,設備保養維修系統建立&執行 4.保養料件收送及維修 5.需配合輪班 ▎每週二下午13:30，自備履歷到談 ▎ 地點:新北市泰山區南林路98號 (南亞科技總部) ＊有意面試者，請於上述時間自備履歷到場洽談

• TCAD simulation and platform developing. • Plan and evaluate process experiments including statistical DOEs and ensure process window. • Implement improvement regarding cost, yield and stability with change management processes. • Partner with the foundry to resolve device level issues and suggest improvements • Debug device related issues and propose solutions •Device Layout drawing and PCM design. •Patent issue

1. LV/HV ESD/Latch-up device/rule development 2. Foundry in customer's ESD/EOS/Latch-up problem consult 3. Foundry out之MCU, Speech, Super I/O, Power IC等自有產品線之ESD/ EOS /Latch-up protection design

You will be responsible for manage and control shopfloor related to ensure quality / delivery / cost and safety meet company standard setting and meet government requirement. Coordinating related department to let production running smoothly. You will also join operation module team activity to ensure projects continue progress. 管理並掌握生產線相關事宜並確認可滿足品質/交期/成本及安全之相關需求可合乎公司標準規範或政府相關法規規定。協調支援單位提供必要支援以利產線運行。並加入營運處相關專案，以利專案推展順利。 What you will be doing: • To lead production line meet quality / delivery and cost standard 帶領生產線產出合乎品質交期成本的產品。 • To lead production line meet company policy and government requirement 帶領生產線符合公司政策及政府法規需求 • To coordinate related department let production line running smoothly. 協調其他相關部門提供必要支援以利產線順利生產。 • To support operation teams’ activity to ensure projects continue progress. 支援營運團隊相關活動並確認相關專案可順利推展。

Overview: This role is responsible for leading new product initiatives, crafting detailed datasheets, and fostering cross-departmental collaboration. The ideal candidate possesses a deep understanding of IC/MOSFET fabrication, semiconductor testing, and is adept at navigating Power industry nuances. Strong communication skills and self-motivation are paramount. Key Responsibilities: • Steer new product development processes, ensuring timely releases and meticulous schedule management. • Craft and disseminate product datasheets to maintain clarity and accuracy. • Provide steadfast support for Sales & Marketing teams in design-in activities, bridging technical knowledge with market needs. • Oversee product life cycles, encompassing EOL, ECR, and PCN in alignment with product roadmaps and BU strategies. • Ensure production-embedded changes through systematic controls and participate in SCS part creations. • Engage actively with multifunctional teams, crossing from Sales & Marketing, Design, and Quality, to address challenges in fabrication, packaging, testing, and application. • Accomplish additional tasks delegated by the supervisor. Qualifications: • Comprehensive knowledge of semiconductor testing, assembly, and IC/MOSFET wafer fabrication processes. • A strong foundation in electronic analysis. • Exceptional communication and negotiation skills. • A self-starter mindset with readiness for individual contributions. • Experience in the Power industry is a plus.

Overview: Join us as a Process Integration Engineer in MOSFET team! If you’re interested in foundry management, product initiatives, and platform migration, you might be the perfect fit to this position. Applicants should hold an advanced degree, possessing expertise in power devices, quality control acumen, and strong communication skills. Key Responsibilities: • Engage with foundry partners to ensure process stability and adhering to stringent product release criteria. • Direct new tape-outs, oversee mask evaluations, and establish efficient process flows in collaboration with R&D for device and platform advancements. • Conduct pivotal failure analyses, such as PFA and EFA, and make necessary adjustments to optimize process conditions. • Guide and manage the transition of platforms to new foundry sites, balancing process adaptation, risk management, and yield quality. • Response promptly to customer’s feedback, lead root cause investigations, and collaborate with the SQE team to implement corrective measures. • Accomplish additional tasks delegated by the supervisor. Qualifications: • A Master degree in EE, Physics, or a related field. • Solid experience in power devices, especially on UMOS, SGT, LDMOS, MLSJ, GaN, and SiC devices. • Proficiency in quality control methodologies, such as Six Sigma, 8D, control plans, and FMEA. • In-depth knowledge of foundry operations and semiconductor fabrication processes. • Strong communication skills, especially in English. • Familiarity with semiconductor simulation tools is a plus.

1.產品Datasheet了解及製作、驗證。 2.打線圖驗證(Bonding Diagram) 3.新產品驗證/測試以及撰寫應用技術文件。 4.對封裝廠文件溝通介面 5.對產品規格的驗證及確認。 6.產品良率分析、提升、製程及成本改善分析。 7.產品可靠性分析與改善。 8.產品失效分析及客訴問題協調解決。 9.外包商工程管理與問題解決，生產流程異常處理及資料分析。

Overview: Key Responsibilities: 1. Monitor new product and sustaining projects with PE, host PE weekly meeting 2. Change review board (CRB) meeting for new platform release and fab porting 3. Material review board (MRB) meeting for low yield and process issue disposition 4. Communicate the key projects priority with foundries and AT site to make projects smooth and on schedule 5. Support Marketing, FAE and Sales for customer inquiry and request. 6. BU PE monthly report, key project progress report Qualifications: 1. Familiar with new product release procedure 2. Reliability testing parameter e.g. JEDEC standard, AECQ-101 standard 3. Failure Analysis capability 4. Discrete product related developing experience 5. Good oral and written communication skills are required

台達於近年開始導入碳化矽SiC相關技術，運用在電動車電源與充電技術方案上，打造最佳電源解方，我們積極招募相關領域專業人才加入台達! 工作說明： 1.電源模塊模擬設計、模型技術文件編寫 2.電路模擬與寄生參數分析 3.電源模塊系統應用評估 4.產品設計與應用之相關技術文件編寫 工作技能： 1.汽車電子用開關模組設計 2.電源系統應用評估 3.新技術/新資訊引進、規劃與執行 4.工程樣品問題分析追蹤與設計變更評估 5.專案執行與進度管理

1.產品開發 2.開發設計 3.製程改善 4.成本優化 Job Description 1.Design new product to maintain technology competitive advantage 2.Improve and Review manufacturing process to get maximum profit

1.支援產品開發過程，協助設計和驗證產品的功能和性能，確保產品滿足設計規範和客戶需求。 2.分析並解決產品製造過程中的技術問題，提供技術支援以確保生產流程的順暢。 3.與RD和品保合作，參與產品測試計劃的制定與實施，確保產品在市場上具有競爭力和高可靠性。 4.主管交辦事項。

1.液態材料類產品研發 2.配方開發與聚合物合成製程開發 3.其他主管交辦事項

1. 新產品導入與量產支援（NPI & Production Ramp-up） - 協助晶片從研發設計（Design）轉入量產（Mass Production）的流程 - 建立測試規格（Test Spec）、驗證產品良率（Yield）、確保試產可順利導入 2. 良率分析與問題改善（Yield Analysis & Debug） - 蒐集晶圓廠/封裝廠/測試廠的生產數據，進行良率監控 - 使用統計方法（如 SPC、DOE、FA）分析失效機制，提出改善方案 3. 測試程式與規格管理（Test Program & Spec Management） - 協同測試工程師開發與優化測試程式（ATE） -定義晶片產品規格（Spec），並追蹤其符合性 4. 跨部門與供應鏈協調（Cross-functional Communication） - 與研發、設計、製程、封裝、測試及客戶端協作，解決產品問題 - 支援客戶品質投訴（RMA/FA），確保產品滿足出貨標準 5. 成本與良率優化（Cost & Yield Optimization） - 分析生產良率與成本結構，提出測試或製程優化方案 - 協助公司提升產品競爭力與出貨良率，達成專案目標

Overview: Basic knowledge of power electronics, including DC/DC, AC/DC converter, power devices, and magnetic components. Participate in the product development discussion and communicate with PM/PE teams to define new product’s features. Responsible to design the evaluation boards, product verification and provide technical support for customers. Responsibilities: -Design EVB board, Layout check & Debug PCB board -Product testing and verification -General application related document -Review customer’s circuit and provide technical support for worldwide Qualifications: -Knowledge in oscilloscope operation -Familiarity with Altium

1. 熟悉FAB 8”wafer Driver、Power IC/MOS/CSP Module等產品製程相關經驗 2. 具備量產WAT/CP/FT driver與MOS產品良率分析與異常處置 3. 熟悉電性分析、FA失效分析工具、Yield Hub 等良率分析軟體操作經驗 4. 良率改進、供應商管理 5. 協助QA客訴異常分析/驗證與root cause問題查找分析處置經驗 6. 其他主管交辦事項 【工作待遇依工作經歷敘薪】

1. 熟悉無機有機高分子塑膠材料性質與檢測分析報告撰轉寫。 (如PEEK、PFA, 不鏽鋼以及鋁合金, 或有機材料如塑膠, 橡膠及矽膠) 2. 熟悉金屬材料, 陶瓷材料或有機材料之成份分析測試儀器與鑑定方法 3. 新材料評估與承認(材料失效問題分析與規劃執行) 4. 與無機或有機材料相關測試與檢驗技術導入 5. 不良問題成因解析與改善(含現場品管作業執行) 6. 塑膠製品元件VOC偵測及環境檢測(含無塵室異常排除) 7. 技術文件撰寫(SOP、UMR..) 8. 其他為主管交辦事項

1.半導體設備SECS GEM 通訊連線技術開發，依據客戶需求制訂SPEC規格書。 2.生產資料收集，程式開發與維護。 3.必需會C＃Csharp，工業通訊(MX Component)為佳。 4.需配合國內外出差(謝絕無法配合國內外出差者)。 5.需看懂英文SPEC。 6.資訊工程系，工程相關科系尤佳。 7.有自動化設備經驗尤佳。

● 矽光波導主被動元件模擬設計與佈局 ● 矽光波導相關技術專利佈局 ● Silica光波導材料與製程開發 ● 矽光波導元件材料與光電量測分析

1.協助客戶進行列印電子製程開發，主要客戶半導體廠、面板廠、EMS廠。 2.墨水材料列印實驗。 3.此為公司半導體設備部門職缺，設備試車時派駐半導體先進廠(竹科為主)，駐廠期間有差旅補貼及優渥獎金 4.偶爾需要配合加班，趕其他同事早上未做完的實驗與測試。(機會不大，但會發生，若無法接受加班，請勿應徵) 備註: 公司上班地點-新莊廠 "新莊化成路11巷96號"，距捷運頭前庄站步行10分鐘

1.Communicate with customer/partner and subcontractor to define the package design requirements, or specifications. 2.Propose the package size, structure according to requirements and specifications from customer. 3.Design the package and optimize to meet product specifications, coworking with related layout, electrical and thermal engineering teams. 4.Prototyping document preparation 5.Link with suppliers and follow up the development trend.

【意者請至公司網站登錄履歷】 網站登錄之履歷將優先處理，此職缺履歷登錄網址：https://recruit.tascsemi.com 1.微型化模組製程的技術開發。 2.模組之功能性測試與驗證。 3.新技術材料的評估與驗證。 4.建立新產品標準生產流程。 5.可靠度分析報告撰寫及彙整。