「產品工程師」的相似工作

1.新評估項目導入，稽核及品質相關會議安排與執行，有品質管理經驗佳。 2.具有客戶服務意識和了解客戶需求能力，能夠主動回應客戶並提供有效的解決方案。 3.廠商客戶品質問題的處理與回覆、後續的分析追蹤與執行。 4.撰寫與審核8D Report，具備英文撰寫能力及良好跨部門溝通能力，針對品質問題進行追蹤處理。 5.協同維護氣體鋼瓶及化學品更換，氣體及化學產品出貨與倉儲管理。 6.異常排除，緊急應變處理，需多元性發展以協助其他專案報告及設備相關維護活動。 7.主管交辦事務執行。

1.了解基礎電路設計。 2.測量RF電信。 3.有低良率分析經驗。 4. Characterize and analyze the performance of PA/LNA/Switch and RF Front-end Module. 有以上經驗者佳。

* OSAT (Assembly/Test) 良率異常分析 & 處理。 量產測試驗證，確保量測參數 & 規格符合設計要求。 * 測試結果資料分析，提供良率改善 & 測試流程優化建議。 * CP / FT / SLT 數據追蹤，擬定調整製程參數 or 條件。 測試開發、Debug & 參數優化，提升測試效率 & 良率穩定度。 * 與內部製程/設備/品保單位進行問題分析，釐清異常並提出改善方案。 * 支援測試需求 & 技術交流，確保產品測試時程 & 品質達成量產目標。 1. Co-work w/ functional engineering team member (TME/DE/TD/TE/RE) to make new product has good definition, Risk evaluation and Build comprehensive testing plan / Qual plan, etc. 2. Co-work w/ other Engineering team member to ensure all new product can be thoroughly Manufactured, Characterized and Qualified for reliabilities and qualities. 3. Organize assignments and independently schedules to complete assigned tasks timely and make project finished efficiently. 4. Have good Coordination and Data Analysis to solve difficult problems through application of various techniques and approaches to develop effective and practical solutions that result in improved products, processes with good quality. 5. Co-work with MediaTek - Taiwan Team, and HCLTech - India Team. 6. Annual salary: 800K NTD and above 7. Onsite MediaTek - Hsinchu Science Park Office This position is set for PE (Product Engineer) to coordinate new product development activities, ensure timely completion of all new products manufacturing, testing, characterization, qualification and releasing with good consistency, quality and efficiency. Ref. * CP (Wafer level - Chip Probing) * FT (Packaged chip level - Final Test) * SLT (Packaged chip level - System Level Test) * ATE (Automated Test Equipment)

1.製造流程建立與SOP撰寫、維護 2.產品導入及問題處置追蹤 3.良率提升及製程優化 4.客訴、不良分析與處置 5.工程變更導入及追蹤. 6.設備治工具開發驗證及維護管理與異常檢修 7.工廠與產品開發人員之間的溝通協調 8.其他主管交辦事項

1. Device characterization and test key design. 2. 元件量測並提供desinger相關規格數據 3. 記憶體陣列設計

1. New FAB & new process survey. 2. Design kit preparation. 3. New product tape-out / pilot run / yield enhancement .

【職務內容】 1. 新產品設計功能驗證/測試程式開發/量產導入 2. 電性分析EFA/產品參數規格特性分析 3. Dram test coverage enhancement 【其他條件】 1 Memory Product engineer/Testing engineer. 2 Good ability in using Advantest(T5503,T5593, T5583) to test.

泰詠電子提供EMS電子產品組裝加工服務，主要從事專業電路板代工服務(PCBA)。 DFX(Design For X)是我們期盼達成的目標， 希望帶給客戶的不僅是【代工生產】，更能夠進一步【提供設計精良的製造過程】， 創造出更多、更快、更好的製程、品質與交期。 【職務角色】 作為產品工程師，您將主導DFX服務，為客戶的產品提出更有效且優化的生產設計，規劃產品導入至生產的全過程，串連並善用各相關部門與資源，將製程化繁為簡，達成高品質與高效能的服務。 【主要職務】 1. 產品導入及生產規劃：產品的導入及生產製程的規劃，確保製造過程的順利進行。 2. 生產問題解決與製程優化：釐清、解決生產問題，優化生產製程並進行相關教育訓練。 3. 標準作業程序（SOP）管理：撰寫及審核標準作業程序（SOP）和作業規範，確保操作的一致性與效率。 4. 零件、設備與製程問題分析與處理：分析處理零件不良問題，改進及解決製程問題，並開發及委外設計治具；設定設備機台參數、撰寫程式，進行相關人員的教育訓練。 5. DFX報告與新客戶支持：提交並解釋DFX報告，協助業務部門推展新客戶、諮詢新機種並提供報價。 無論是在電子、PCBA領域長久深耕的資深從業者， 或是尚無經驗但頗具興趣的新鮮人， 只要您對此職務有意願且樂於挑戰，我們都歡迎您的加入！ 【對於新鮮人...】 若您期望踏入科技產業尋找不同的可能性，泰詠將能夠帶給您很大的機會與空間切入產業，透過工作中的挑戰與學習，從生產流程安排到能夠整合跨領域問題與優化製程，更有機會獨立負責產品導入，發展個人的不可替代性。 【對於資深從業者...】 在當今的 VUCA 時代（波動性、不確定性、複雜性和模糊性），市場趨勢和需求變得更加不可預測和多變。泰詠正持續調整和提升我們的服務，迎向這樣的機會，期待您帶著豐富的經驗與專業加入團隊，在這裡充分發揮自己的潛力，與泰詠一起成長，共同爭取與迎接更多挑戰。 【The main responsibilities of the Product Engineer】 1. Product Introduction and Production Planning: Planning the introduction of new products and their production processes to ensure smooth manufacturing operations. 2. Production Issue Resolution and Process Optimization: Identifying and resolving production issues, optimizing production processes, and providing related training. 3. SOP Management: Writing and reviewing SOP and operational guidelines to ensure consistency and efficiency in operations. 4. Conponent, Equipment, and Process Issue Analysis and Handling: Analyzing and addressing issues with defective parts, improving and resolving process-related problems, developing and outsourcing the design of jigs; setting equipment parameters, writing programs, and providing training to relevant personnel. 5. DFX Reports and New Customer Support: Submitting and explaining DFX reports, assisting the sales department in acquiring new customers, consulting on new models, and providing quotations.

1.客訴分析處理與協助廠內改善跟催 2.處理客戶生產加工上所遭遇的問題, 解決並提供協助與對策 3.協助集團公司處理產品可靠度驗證與客訴問題 4.產品可靠度驗證暨產品可靠度監控 5.協助改善可靠度作業流程 6.HTOL/bHAST/PTC burn-in board規劃 7.ISO文件/表單制定及修改 8.其它主管交辦事項

1.擔任產品負責人 2.DFM技轉 3.生產文件製作 4.召開改機會議、新產品產前產後會議 5.撰寫技術文件、生產流程文件 6.首件核對、製程優化

1. 負責功率元件或IC產品導入量產，包含封裝與測試的導入、試產驗證、量產測試規格、 生產可行性確認、可靠度測試資料確認…等。 2. 負責功率元件或IC產品生產測試資料統整及定期產出報告, 包含Yield and key items trend chart, wafer map, test spec. check, Cp & Cpk…等。 3. 負責功率元件或IC產品測試turnkey/outsourcing導入的資料分析與確認 4. 負責功率元件或IC產品良率與品質分析及提升 5. 負責功率元件或IC產品生產流程異常處理及資料分析 6. 協助功率元件或IC產品失效分析及解決 7. 和晶圓廠與封裝廠能溝通合作解決生產上的異常或產品品質問題，並定義改善計劃 與執行 8. 功率元件或IC產品量產階段工程變更管理

1.CP/FT測試可行性分析 2.專案測試開發 3.量產產品維護

1. To improve device yield &CIP in order to meet customer request and customer service. 2. Identify and solve process and device problems. 3. Support for customer visit and audit.

【工作內容】 1. 熟悉2.5D/3D架構，如CoWoS、WoW等技術家族。 2. 具備WoW hybrid bonding技術，能支援開發與量產。 3. 執行電性失效分析（EFA）與產品參數規格特性分析，協助問題釐清與品質提升。 【職務需求】 1. 3年以上製程整合相關經驗，熟悉2.5D, 3DIC, Hybrid Bonding優先。 2. 熟悉半導體DRAM製程技術，包括光罩設計、蝕刻、CMP、鍵合。 3. 具備製程良率分析、故障排除與問題解決能力。 4. 熟悉跨部門溝通與專案管理，能有效協調多方資源。

1. Power module/PMIC/MOS/GaN package design. 2. Substrate and leadframe and Cu clip design 3. Customized package design 4. Electrical & thermal simulation through Q3D & IcePAK 5. Co-work with process engineer to solve process and reliability 6. Define thermal resistance through T3Ster measurement or simulation

1. 電路圖繪製/閱讀、維修，硬體除錯，良率提升。 (Altium Designer/cadence spb allegro) 2. 熟悉烙鐵操作及示波器&電表等儀器操作。 3. 元器件倉儲控管/收發配件運送等。 4. 負責工廠測試環境架設。 5. 負責現場生產線不良品維修及故障排除。 6. 執行PCB焊接、檢修、維修及更換零組件或線路調整。 7. 負責測試配件問題之研究、改善與處理。 8. 具備文書處理技能。 9. 配合專案，國內封測廠出差。(需有汽車) 10. 完成主管交辦事項，配合加班。 11.需要自備汽車。

Reporting to MOSFET Development Manager, you will work as Sr. MOS Development Engineer to be responsible for process integration, development and optimization. About the job: Work with product designer to create new device structure ideas and develop the necessary Mosfet/ IGBT /Diode technologies Closely work with internal process experts and external foundry partners to set up the required technologies and processes to produce the prototypes and with test labs to assess results vs. simulations / expected behavior. Responsible for experimental matrix design to evaluate and optimize design vs. specification. Co-work with fab engineering teams to generate the final design rule menu and electrical parametric specifications. Participation in fab selection and evaluation for future foundry locations. Participate and help the Design Engineers and Product Engineers on reverse engineering analysis when necessary. Act as the internal expert of semiconductor devices and processes to provide the necessary information and advices to designers on new technologies. Short term travels for business trips and trainings. About you: Knowledge of semiconductor device physics, such as Diode, BJT, MOSFET, and IGBT…etc and understanding of complex interactions between different fabrication processes. Experiences in semiconductor process development, and basic knowledge in semiconductor device characterization. Ability of arranging tests with 3rd party labs and comfortable with working in Lab for device characterization. Good writing/reading/communication in English is a MUST. The ability to operate independently in a cross-cultural working environment. Experiences in both conventional Bipolar, CMOS, DMOS processe Understanding or experiences in power semiconductor devices assembly and applications would be preferred. Knowledge and experiences of material analysis or Failure analysis tools, such as SRP, SIMS, SEM…etc. Familiar with mask generation, wafer fab process flow and in-line/PCM specifications. Knowledge and experience in one or more of the following areas would be a plus, but not must: o Test pattern generation o Semiconductor process/device modeling o Basic assembly & test processes.

1. 小批量試產實作 2. 新產品製造流程制定 3. 治工具設計、優化 3. 試製參數、DATA收集、分析 4. 試產問題發掘、回饋、追蹤 5. 量產前初版SOP撰寫

1. Foundry co-work and contact window. 2. To handle process design-in, development & yield ramp-up of display driver ICs . 3. It's better with FAB process integration or product experience > 2years.

1. 新產品開發驗證以及量產條件的決定 (Corner skew, implant fine tune) 2. 量產品管理及良率(CP/FT)改善 1) Single/Sysematic Low Yield : WAT Correlation, inline tool correlation)分析比對 2) Device fine tune for Yield maintain 3) WAT parameters layout, measurement condition 3. 量產品產品特性分析，客退品分析報告 4. 新技術開發平台開發 (New device development)