「產品工程師」的相似工作

* 良率異常分析與處理。 * WAT / CP / FT 數據追蹤，擬定調整製程參數或條件。 * 跨部門溝通協調處理量產問題執行 & 製程監控。 * 晶圓製程開發、改善製程 & 元件優化、產品良率管理 & 改善 & 降低成本。 1. Co-work w/ functional engineering team member (TME/DE/TD/TE/RE) to make new product has good definition, Risk evaluation and Build comprehensive testing plan / Qual plan, etc. 2. Co-work w/ other Engineering team member to ensure all new product can be thoroughly Manufactured, Characterized and Qualified for reliabilities and qualities. 3. Organize assignments and independently schedules to complete assigned tasks timely and make project finished efficiently. 4. Have good Coordination and Data Analysis to solve difficult problems through application of various techniques and approaches to develop effective and practical solutions that result in improved products, processes with good quality. 6. Annual salary: 800K NTD and above 7. Onsite MediaTek - Hsinchu Science Park Office This position is set for PE (Product Engineer) to coordinate new product development activities, ensure timely completion of all new products manufacturing, testing, characterization, qualification and releasing with good consistency, quality and efficiency.

1. 電路圖繪製/閱讀、維修，硬體除錯，良率提升。 (Altium Designer/cadence spb allegro) 2. 熟悉烙鐵操作及示波器&電表等儀器操作。 3. 元器件倉儲控管/收發配件運送等。 4. 負責工廠測試環境架設。 5. 負責現場生產線不良品維修及故障排除。 6. 執行PCB焊接、檢修、維修及更換零組件或線路調整。 7. 負責測試配件問題之研究、改善與處理。 8. 具備文書處理技能。 9. 配合專案，國內封測廠出差。(需有汽車) 10. 完成主管交辦事項，配合加班。 11.需要自備汽車。

1. Foundry Tapeout Account 申請。 2. Foundry 製程能力評估和Tapeout 與良率提升。 負責評估Foundry製程能力，Tapeout 作業，持續推動製程優化，進而提升產品良率。 3. 跨單位工程問題協調 代表公司與客戶、Foundry、封裝廠及光罩公司協同解決各項工程相關問題。 4. 產品流程管理與分析 負責從Tape Out、Mask Job Review到產品量產的全流程管理，並進行與協力商處理ESD與Latch Up分析。 5. 封裝評估與導入,與測試數據分析. 6. HTOL QUAL 和 Package QUAL可靠度測試,與RMA分析. 7. 異常問題查證與製程改善 當產品異常發生時，運用EFA/PFA找出低良率原因，並與RD、Fab及Assembly部門協作解決，持續推動製程改善。 8. 熟悉Packaging(WLCSP、wire bond、Molding...)與Testing(CP、FT...)各階段等，知道如何與Test Engineer/外包討論ATE平台、測試coverage、bin split 等議題 9. PDK及相關文件管控 主導PDK及相關文件的申請作業，並與PM/RD團隊密切合作，嚴格控管文件版本，確保資料一致性與最新狀態。 10. 主管交辦事項.

* 良率異常分析與處理。 * WAT / CP / FT 數據追蹤，擬定調整製程參數或條件。 * 跨部門溝通協調處理量產問題執行 & 製程監控。 * 晶圓製程開發、改善製程 & 元件優化、產品良率管理 & 改善 & 降低成本。 1. Co-work w/ functional engineering team member (TME/DE/TD/TE/RE) to make new product has good definition, Risk evaluation and Build comprehensive testing plan / Qual plan, etc. 2. Co-work w/ other Engineering team member to ensure all new product can be thoroughly Manufactured, Characterized and Qualified for reliabilities and qualities. 3. Organize assignments and independently schedules to complete assigned tasks timely and make project finished efficiently. 4. Have good Coordination and Data Analysis to solve difficult problems through application of various techniques and approaches to develop effective and practical solutions that result in improved products, processes with good quality. 6. Annual salary: 800K NTD and above 7. Onsite MediaTek - Hsinchu Science Park Office This position is set for PE (Product Engineer) to coordinate new product development activities, ensure timely completion of all new products manufacturing, testing, characterization, qualification and releasing with good consistency, quality and efficiency.

1. 建立封裝圖 2. 建立測試規格及測試程式 3. 測試低良率分析與處理 4. 新封裝製程評估 5. 新外包封裝廠評估 6. 設備及材料變更評估

1.PCB測試板工程變更/Debug/Maintain(需要焊接) 2.PCB測試板上機驗証(需PCB維修相關經驗，維修過LB、PC、BIB尤佳) 3.面對客戶、與客戶溝通工程內容

1. 產品技術支援與應用支援(客戶新產品導入維護(CP,FT)) 2. 技術支援與教育訓練 3. 喜愛與人溝通,具備耐心與細心特質

1.客訴分析處理與協助廠內改善跟催 2.處理客戶生產加工上所遭遇的問題, 解決並提供協助與對策 3.協助集團公司處理產品可靠度驗證與客訴問題 4.產品可靠度驗證暨產品可靠度監控 5.協助改善可靠度作業流程 6.HTOL/bHAST/PTC burn-in board規劃 7.ISO文件/表單制定及修改 8.其它主管交辦事項

【工作內容】 1.產品可行性評估，協助新產品試產規劃、製作及導入。 2.製程工序規劃，提升製程能力、制定最適化製造流程。 3.以成本為導向之優化生產製程、產品良率分析、監控及改善。 4.因應相關生產製程的異常狀況，分析原因並設立糾正、預防措施。 5.產品量產可行性評。 6.產品量化設計。 7.其他主管交辦事項。 若您具備下列條件者，我們更加歡迎您 1.熟悉機械加工製程，有製程經驗者佳。 2.具備繪圖能力者。 3.具高度抗壓性。 4.溝通協調能力佳。 5.具分析問題的判斷力、解決問題的執行力及邏輯思考的能力。

1. BS or MS degree in Electrical Engineering, Computer Science, Physics, Material Science, or equivalent experience. 2. Able to work in Hsinchu and communicate effectively in Chinese and English. 3. Knowledgeable in IC design, semiconductor manufacture, and IC test flow (CP/FT/SLT) details. Good understanding of IC test pattern setup is a plus. 4. Strong data analysis skills and problem-solving ability, with proven records from prior working experience or school projects. 5. Familiar with statistical methods and tools for data analysis. Experience with post-silicon IC measurement data handling is preferred. 6. Excellent writing and verbal communication skills. 7. Your ways to stand out from the crowd: - Able to work with global team members from diverse cultural backgrounds. - Strong collaborative skills, specifically a demonstrated ability to effectively guide and influence within a dynamic environment. - Passionate about the IC yield data analysis along with the advanced semiconductor technology progression.

1.Power MOSFET new technology / device structure study and development 2.Power MOSFET new product evaluation and development 3.Device electrical characteristic analysis 4.Patent study and application

1. 規劃公司產品ESD可靠度驗證計畫 2. 應對客戶及公司內ESD可靠度相關問題 3. 可靠度計算,ESD 產品可靠度風險評估

工作概覽： 參與CMOS平台製程開發、元件設計與電性優化，支持新產品導入、製程整合與技術創新，為特殊應用產品提供完整的製程與元件解決方案。 主要職責： • 負責0.35um CMOS製程模組與整合開發。 • 參與元件(如MOS、HVLDMOS、電容、電阻等)之設計與TCAD模擬驗證。 • 建立元件模型(SPICE/LPE) 與電性分析，協助PDK開發。 • 協同設計團隊進行元件規格定義與效能驗證。 • 支援新產品導入、製程異常分析與良率改善。 資格條件: • 熟悉0.35um CMOS製程平台。 • 具元件設計、TCAD模擬或SPICE建模經驗者尤佳。 • 具備製程整合、電性量測與數據分析能力。

通嘉致力打造工作/生活/健康兼具的職場環境，歡迎加入展開「通嘉就是你家」旅程! 本職務負責工作如下： 1.測試工程開發驗證 (PD、Mixed Signal產品) 2.工程轉量產及轉廠驗證 3.量產異常分析及排除 4. RMA測試分析與資料彙整 5.測試工程最佳化專案規劃與導入

1.提供客戶技術服務，必要時須至現場協助客戶 2.產品技術資料準備 3.協助業務推廣產品與技術支援 4.具備專案管理能力 5.熟悉電力單線圖 6.主管交辦任務執行

我們正在尋找熱衷技術挑戰並希望在創新環境中成長的夥伴。加入我們的團隊，您將參與尖端技術的開發，並在多元化的專案中發揮影響力。我們提供學習和成長的機會，期待與您共同推動技術進步！ 【職務內容】 1. 專案管理 - 可行性評估 - 開發成本考量 - 流程進度規劃 - 生命周期管理 - 風險管理 2. 產品開發 - 機構硬體設計 - 軟體功能開發 - 列印材料應用 - 產品整合測試驗證 3. 跨部門協作與溝通 - 協調跨部門資源與溝通 （如研發、設計、業務、行銷、客服、採購、製造等） 4. 其他主管交辦之專案或行政事項 【加分條件】 -熟悉列印材料特性及應用，具備相關材料學背景。 -具備硬體設計經驗，了解3D列印機結構及機械運作原理。 -具備軟體開發與控制系統整合的經驗，熟悉相關開發工具與語言。 -具有跨領域溝通協調能力，能管理多部門合作。 -有3D列印領域經驗者優先，具備產品管理或專案管理經驗者佳。 -具備高度問題解決能力與自我驅動力。 為什麼加入我們？ 成長機會：您將有機會參與前沿技術的開發，並持續學習和挑戰自己。 創新環境：我們致力於創新技術，鼓勵創意思維和技術突破。 團隊文化：我們重視合作與共享，並為員工提供開放包容的工作氛圍。

1. Foundry co-work and contact window. 2. Handle co-development of power, MCU related applications , mass production & yield ramp up . 3. It's better with Foundry process integration or product experience.

1.IC/MOSFET新產品之可靠度測試規劃、執行、監控及系統維護(HTOL/ HAST/ ESD/ LU.... ) 2.負責量測儀器之操作（如：示波器、電表、電子負載等）以執行可靠度與分析相關作業 3.產品可靠度測試報告 4.產品可靠度驗證失效分析 5.受理各單位有關於可靠度測試的需求、研究資料及跨部門溝通

【Position Overview】 We are seeking a highly motivated and experienced Foundry Engineer to join our team. In this critical role, you will be responsible for driving product yield, performance, and reliability by collaborating closely with internal teams and external silicon foundries. You will identify the root cause of process, device, and defect-related issues, propose and execute improvement plans, and ensure to meet our yield KPIs and product timelines. This position requires a strong technical background in semiconductor manufacturing, excellent problem-solving skills, and the ability to work effectively in a collaborative environment. 【Responsibilities】 1. Lead foundry engineering activities to drive product yield, performance, and reliability/quality to fulfill product needs. 2. Collaborate with cross-functional teams to ensure timely new product introduction and proactively address potential issues. 3. Develop and execute yield improvement plans by collaborating with internal teams or external foundries. 4. Ensure high production quality control through in-depth analysis, inline and WAT monitoring, and investigation of customer returns. 5. Manage projects effectively to meet deadlines and achieve objectives. 6.Other tasks assigned by supervisors.

Key Responsibilities: ．Responsible for the design and optimization of Silicon and/or Silicon Carbide (SiC) Power MOSFET devices for applications across a wide voltage range. ．Utilize TCAD, SPICE, finite element analysis (FEA) software, and layout design tools for device simulation, performance evaluation, and layout verification. ．Collaborate closely with process integration, layout, product, and QRA teams to drive new product development and mass production. ．Prepare technical documentation and deliver design presentations in project meetings. ．Support customer inquiries. Qualifications: ．Master's degree or above in Electrical Engineering, Electronics, Materials Science, Physics, or related fields. ．Over 5 years of experience in Power MOSFET or discrete device design. ．Proficient in TCAD simulation tools such as Synopsys Sentaurus, and Silvaco. Preferred Qualifications: ．Experience in designing Trench, Planar, or Shielded Gate Trench (SGT) structures, and ESD protection devices. ．Experience in mass production ramp-up or supporting wafer foundry projects. ．Prior involvement in automotive or industrial applications is a plus. ．Familiar with SPICE modeling and finite element analysis tools (e.g., COMSOL, Ansys).