「良率 / (Sr. / Staff) Yield Engineer」的相似工作

1.製程改善專案執行、追蹤 2.提升產品製程能力及問題處理 3.製程/設備異常排除、分析改善 4.其他主管交辦事項

Introduction to the job Do you like challenges and do you want to work in a fast pacing supply chain environment to support some of the biggest semiconductor companies worldwide? Are you familiar with Logistics Operations and like to managing urgent demands on a daily basis?  If this sounds like you and if you have a strong customer oriented mindset, here is your mission. Role and responsibilities For our Global Operations Center in Taiwan we are searching for Supply Chain Professionals. You fulfill the demand of our customers for spare parts and tools for their maintenance activities on some of the most complex machines in the right quantity and at the right time & cost. Time is of the essence to ensure a seamless production of our customers without interruptions on our machines. -Handling of urgent material requests from worldwide customers in a rolling 24/7 shift system with the right customer focus, while meeting all milestones related to communication and execution -Monitoring of worldwide shipments  -Ability to resolve complex issues and drive improvements to further optimize processes -Ability to support escalations and provide communication proposals for review -Constructive and reliable communication with worldwide stakeholders from all departments within ASML -This position requires shift work. Education and Experience Bachelor's Degree in related subject i.e. Supply Chain Management, Information Science, Engineering etc. preferred -Minimum 1 year of relevant experience in an international company, semiconductor industry is preferred -A tactical thinker with strong interpersonal and communication skills -Analytical thinking and ability to organize and prioritize workload Skills Working at the cutting edge of tech, you’ll always have new challenges and new problems to solve – and working together is the only way to do that. You won’t work in a silo. Instead, you’ll be part of a creative, dynamic work environment where you’ll collaborate with supportive colleagues.  There is always space for creative and unique points of view. You’ll have the flexibility and trust to choose how best to tackle tasks and solve problems. To thrive in this job, you’ll need the following skills: -Stress-resistant; act under high pressure -Flexible; willing to go the extra mile for the customer -Excellent professional communication in English, written and oral -Drive for results; does not stop until solution has been found, even when obstacles arise -Team player -Change management competencies -Convincing, pro-active and “can do” mentality -Cultural awareness -Experience with ERP system(s), SAP R/3 knowledge preferred -Ability to prioritize Diversity and inclusion ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company. Need to know more about applying for a job at ASML? Read our frequently asked questions.

1.新評估項目導入，稽核及品質相關會議安排與執行，有品質管理經驗佳。 2.具有客戶服務意識和了解客戶需求能力，能夠主動回應客戶並提供有效的解決方案。 3.廠商客戶品質問題的處理與回覆、後續的分析追蹤與執行。 4.撰寫與審核8D Report，具備英文撰寫能力及良好跨部門溝通能力，針對品質問題進行追蹤處理。 5.協同維護氣體鋼瓶及化學品更換，氣體及化學產品出貨與倉儲管理。 6.異常排除，緊急應變處理，需多元性發展以協助其他專案報告及設備相關維護活動。 7.主管交辦事務執行。

1. 規劃公司產品ESD可靠度驗證計畫 2. 應對客戶及公司內ESD可靠度相關問題 3. 可靠度計算,ESD 產品可靠度風險評估

1. 產品電性量測分析與測試報告產出 (MOSFET、DC-DC IC、AC-DC IC) 2. 產品規格書製作 3. 新產品單體與系統驗證 4. 協助客戶問題回覆(需跨部門合作以及客戶溝通)

1.製造流程建立與SOP撰寫、維護 2.產品導入及問題處置追蹤 3.良率提升及製程優化 4.客訴、不良分析與處置 5.工程變更導入及追蹤. 6.設備治工具開發驗證及維護管理與異常檢修 7.工廠與產品開發人員之間的溝通協調 8.其他主管交辦事項

1. Device characterization and test key design. 2. 元件量測並提供desinger相關規格數據 3. 記憶體陣列設計

【工作內容】 1. 熟悉2.5D/3D架構，如CoWoS、WoW等技術家族。 2. 具備WoW hybrid bonding技術，能支援開發與量產。 3. 執行電性失效分析（EFA）與產品參數規格特性分析，協助問題釐清與品質提升。 【職務需求】 1. 3年以上製程整合相關經驗，熟悉2.5D, 3DIC, Hybrid Bonding優先。 2. 熟悉半導體DRAM製程技術，包括光罩設計、蝕刻、CMP、鍵合。 3. 具備製程良率分析、故障排除與問題解決能力。 4. 熟悉跨部門溝通與專案管理，能有效協調多方資源。

1.客訴分析處理與協助廠內改善跟催 2.處理客戶生產加工上所遭遇的問題, 解決並提供協助與對策 3.協助集團公司處理產品可靠度驗證與客訴問題 4.產品可靠度驗證暨產品可靠度監控 5.協助改善可靠度作業流程 6.HTOL/bHAST/PTC burn-in board規劃 7.ISO文件/表單制定及修改 8.其它主管交辦事項

1. 小批量試產實作 2. 新產品製造流程制定 3. 治工具設計、優化 3. 試製參數、DATA收集、分析 4. 試產問題發掘、回饋、追蹤 5. 量產前初版SOP撰寫

● 光學模組機構設計 ● 光學系統架設與檢測分析 ● 光學系統相關技術專利佈局 ● RF射頻電路設計與分析 ●矽光子產品DC/RF量測與分析

1. New FAB & new process survey. 2. Design kit preparation. 3. New product tape-out / pilot run / yield enhancement .

1. 專案開發前期: 協同SA訂定規格/設計環境建構/競品特性分析/協同PM訂定開發時程表 2. 專案開發期間: 支援電路設計及整合/定期招開設計檢查會議/定期追蹤開發進度/確保專案各站點完成時程/準備各站點檢查資料及文件/測試相關資料的準備 3. 專案開發後期: 分析CP驗證數據/確保良率達標/協同SA,RD,TE進行除錯分析/確保達送樣標準

1. Foundry co-work and contact window. 2. To handle process design-in, development & yield ramp-up of display driver ICs . 3. It's better with FAB process integration or product experience > 2years.

1. 新產品開發驗證以及量產條件的決定 (Corner skew, implant fine tune) 2. 量產品管理及良率(CP/FT)改善 1) Single/Sysematic Low Yield : WAT Correlation, inline tool correlation)分析比對 2) Device fine tune for Yield maintain 3) WAT parameters layout, measurement condition 3. 量產品產品特性分析，客退品分析報告 4. 新技術開發平台開發 (New device development)

1. 晶圓廠製程評估及其導入驗證與量產 2. IC 產品開發之產品工程(Tapeout flow/實驗/特性分析) 3. 良率改善, Low yield 分析, 客訴分析, 故障分析 4. 產品開發相關配合晶圓廠Library/IP之準備 5. 產品封裝相關工程

About the job We are looking for a new key member of the Process Engineering team that is responsible for all programs related to the improvement of yield and manufacturing robustness as well as constituting the company's center of excellence with regards to semiconductor manufacturing technology. This position will be responsible for tape-out handling, qualification-build coordination, and driving the respective processes. You will also be working in close interaction with subcontractors and internal departments (R&D/Project Manager/Test engineering) to achieve a smooth and robust path to first silicon success, while ensuring continuous development by adding your personal expertise and experience. Key Responsibilities • Liaise among subcons, R&D and PM to provide technical support for the new product introduction (NPI) process • Facilitate tape-out handling and training for R&D and Product Engineering • Interface between foundry and R&D for new technology adoption including optional process step evaluation to meet NPI performance requirement • Lead design rule check (DRC) related discussions and drive DRC issue closure for NPI • Track NPI process through tape out to final test and ensure 1st Si success • Support the analysis of bench test yield or automatic test equipment yield issue of pilot run wrt manufacturing, c/o R&D, TE • Work with R&D and define corner split condition and summarize NPI corner lot report • Coordinate product qualification builds and work with the reliability team on qualification issues encountered • Coordinate process parameter fine-tuning within a defined range to meet the performance requirement • Assess new process technologies in terms of cost/performance/reliability • Drive corrective actions and continuous improvement programs related to qualification builds Qualifications and Skills • Bachelor's or Master’s degree within a relevant field • At least 8 years of experience in semiconductor manufacturing, IC design, or product engineering • The ability to navigate in a global matrix organization • Good written and verbal communication skills in English Working for Nordic Working for Nordic Semiconductor, you will be inspired and supported to develop yourself. Our teams enjoy a professional and informal working environment. We value and encourage the continuous development of skills and expertise to the highest levels. We are proud of our Norwegian heritage, our highly skilled international workforce, our world-leading innovation, and our professional brilliance. We offer a variety of tasks and projects and the possibility to work alongside some of the world’s industry experts within their field. We encourage our employees to question the established and innovate while expecting professionalism, commitment, and the will to learn. Benefits • Competitive salary with short- and long-term incentive plan • Flexible working hours • Group insurance • Family-friendly policies, insurance, and benefits

1. 封裝固晶(Die-Bond)製程作業。 2. 固晶(Die-Bond)相關設備保養維護、異常排除、效能改善、改機調機。 3. 封裝固晶(Die-Bond)製程改善與開發。 【本職缺可透過104應徵，也歡迎直接至穩懋官方網站投遞，增加履歷曝光度】請至穩懋官方網站投遞個人履歷表，此職缺履歷登錄網址：https://www.winfoundry.com/WinTalentPool/JobRequirement/Edit/1047

1. Ensure PKG design is optimized with SI/PI/Thermal requirements. 2. Create the PKG/RDL/Subtract SI 3D modeling and perform extraction of S-Parameters and RLGC model. 3. Full-wave modeling of VIAs, Connectors, Package and PCB channels, components using 3D full-wave EM tools. 4. Provide the CM(Construction rules) and Design Rules(guidelines) for the PKG/RDL/Subtract design. 5. Provide the Substrate manufacturing process and material property. 6. SI(Signal integrity) simulation and optimization on package stack-up, power/ ground plane assignment and optimization, decoupling cap locations to minimize power ground noise. 7. PI(Power integrity) analysis for state of art package/system designs, which include but not limited to package layout model extraction, transient noise analysis to meet the silicon noise spec, decoupling strategy and analysis. 8. CTK(Crosstalk) analysis and reduction on-package considering mutual-effect by on-die, on-silicon interposer and on-PCB. 9. SSN(Simultaneous Switching Noise)/SSO analysis for I/O (DDR5/4/3, LPDDR5/4/3, etc.) power domain. 10. Eye diagram(ZRZ/PAM4) and jitter analysis for CPS(Die Chip-PKG-System PCB) co-simulations. 11. Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements. 12. Familiar with assembly and substrate manufacturing process is a plus. 13. Familiar with programming/scripting in Java, VBScript, PERL, TCL, MatLab and/or equivalent. 14. Experienced in SI PI automation tool development with Python or PyAEDT is a plus. 15. Working with ASIC/HW/Production team.

Tcad模擬、元件量測與分析

1、IC測試程式開發與除錯 2、IC測試異常支援 3、IC測試、應用線路測試&測試板製作 4、協助產品可靠度驗證&低良率分析