⚫ Design server system and relative boards and review high-speed PCB layout.
⚫ Work with function team like Power, SI, mechanical and thermal engineers to ensure optimize hardware solutions.
⚫ Come out test plans to ensure base function of hardware.
⚫ Work with suppliers and vendors to select components and solutions.
⚫ Support 2nd source solutions and validation.
⚫ Work closely with firmware teams to integrate and troubleshoot management topology.
⚫ Support manufacturing teams during the production phase.
1. In-depth knowledge of PCB layout, OrCAD/Allegro tools, circuit design, and PCB structure.
2. Prepare technical documentation including product specifications, layout instructions, test procedures, etc.
3. Transfer products to manufacturing with clear documentation and help C.M. and technical support to solve problems.
4. Hardware engineer need co-working with PM, BIOS, IPMI, EMI, Thermal, ME RD friendly. Need have good team work. Need to have the concept of project ownership.
5. Need have power VR and component design knowledge
6. Resolve complicated issues and drive to root cause on critical engineering problems
- Camera module design
- ARM based SoC system design using nVidia, Ambarella, NXP, QUALCOMM platform.
- Edge AI camera design integrated with 2D/3D camera, Wifi, PoE, Display and battery.
- 硬體研發及測試技術:
1. 硬體線路設計驗證及除錯
2. 高速數位訊號量測及分析 (MIPI-CSI or DSI, Wi-Fi or BLE 4.0)
3. PCB Layout檢查及驗證
4. BOM表建立與檢察
5. 其他主管交辦事項
工作地點: 桃園市楊梅區中山北路一段199巷21號3F 或 桃園區幸福路202號8樓