「53 電子電路主管」的相似工作

1. 依客戶需求設計PCB電路(Load Board/BIB)，達成客戶測試條件。 2. 統籌PCB Layout及透過Simulation優化電路及Layout部分。 3. 協助客戶解決電路疑慮。 4. 需具備良好團隊合作、溝通等能力。(需與客戶開會討論電路問題)

This vacancy is open for talent pool collection. We will contact you if we have proper vacancies that fit with your profile. Job Mission Represent manufacturing and act as gatekeeper from manufacturing to D&E function Add value in overall manufacturing processes such as forming, machining, joining, and assembling Job Description Contribute to the solution of faults and takes the necessary initiatives and practical decisions to ensure zero repeat Identify gaps and drive assigned process improvement projects and successful delivery Initiate and drive new procedure changes and projects Develop and maintain networks across several functional stakeholders Prioritize works and projects based on business situation Transfer knowledge and train colleagues on existing and newly introduced products Education Master degree in technical domain (e.g. electrical engineering, mechanical engineering, mechatronics) Experience 3-5 years working experience in design engineering Personal skills Show responsibility for the result of work Show proactive attitude and willing to take initiative Drive for continuous improvement Able to think outside of standard processes Able to work independently Able to co-work with different functional stakeholders Able to demonstrate leadership skills Able to work in a multi-disciplinary team within a high tech(proto) environment Able to think and act within general policies across department levels Diversity and inclusion ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company. Need to know more about applying for a job at ASML? Read our frequently asked questions.

1.電池管理系統（BMS）硬體設計及產品開發 2.硬體及產品驗証計劃制定並執行 3.產品規格及相關文件製作 4.硬體及產品問題分析與解決 5.新零件選用導入及測試驗証 6.主管交辦事項

1. 編碼器新產品新市場需求蒐集及規格訂定 2. 透過磁路模擬分析與研究，解決磁性編碼器問題與優化產品設計 3. 編碼器系統性能測試分析與研究 4. 編碼器位置計算演算法研究與優化 5. 編碼器精度提升演算法研究與優化 6. 編碼器問題異常排除與分析，包含規格設計、規格制定、製程問題、系統性整合問題 7. 主動接觸供應商並管理製程與QC規範，藉由國內外出差達成目的 8. 需至中國出差

職責： ＊根據計劃的需求設計出整體系統架構 ＊開發系統平台 ＊負責規劃及追蹤系統開發進度 工作內容： ＊規劃公司應用運行平台整體架構，包含硬體模組、APP及雲端等 ＊開發公司應用運行平台 ＊串接硬體平台、APP及雲端 ＊跟電子電路工程師討論所使用的硬體零組件 ＊協助演算法工程師將開發好的演算法部署到硬體 ＊開發公司系統的CI/CD工具 ＊根據專案內容分配工作任務

##Job Description: 1. 主導智慧感測與無人載具系統開發策略，整合感測演算法與先進載具研發方向。 2. 規劃並監督資料融合、AI 物件追蹤與模型優化等技術，確保關鍵感測演算法能準確支援偵蒐與防禦。 3. 領導無人機平台開發，涵蓋空對空／空對地行動應用，整合導航、控制演算法、飛行平台規格與軟硬體系統架構。 4. 整合公司既有產品技術，推動跨部門合作與技術整合，打造完整垂直應用解決方案。 5. 規劃與帶領團隊研發流程與專案研發時程、資源配置，並推動產品落地與系統化建置。 ##Skill: 1. 熟悉感測演算法（資料融合、AI Tracking、Object Detection）、AI 模型效能優化與應用開發。 2. 具備無人機系統（UAV）開發經驗，熟悉飛控、導航、通訊、平台整合等子系統。 3. 熟悉 ROS2 / PX4 / ArduPilot / MavLink 等開源框架及其應用整合經驗。 4. 具備團隊協作與技術領導經驗，能針對成員能力規劃任務並進行技術審查。

##工作內容 - 電子元件評估與選用 - 無人機系統規劃、整合、測試、分析與除錯 - 與Layout工程師、結構工程師溝通、協調並完成電路、佈局設計及確認 - 電路板及系統層級效能測試、驗證、除錯並將產品導入量產 - 產品研發流程及技術文件產出 ##技能條件 - 熟悉手持裝置周邊USB, MIPI-CSI/DSI, Camera, EMMC, ISP, SPI, I2C電路設計與驗證 - 無線射頻產品開發經驗 - 具電路 Analog / Digital 電路三年以上設計經驗 - 熟悉量測儀器使用 - 具備基礎焊接能力 - (Optional) 具備MCU(STM32) 應用電路設計經驗 - (Optional) 熟悉MCU軟韌體開發 - (Optional) 具備Linux BSP開發經驗

1. 感應電機或永磁交流電機控制方法研究 2. 馬達控制的韌體撰寫 3. 協助排查客戶端的電機控制問題 4. 工具機、機器手臂或行業專用機等震動控制方法研究 5. 電機、床台系統建模與模擬分析 6. 控制理論、功能推廣等教育文件撰寫

1.熟悉硬體工程師的職責。 2.design philosophy, circuit entry , layout guidance ,performance analysis, prototype debugging。 3在ARM based 領域，Linux platform。 4.對FPGA 熟悉，或RFSOC 清楚。

1. 硬體電路設計及應用研發 2. 硬體系統整合測試，訊號量測與儀器操作 3. 功能驗證及除錯 4. BOM建立 5.帶領管理WiFi團隊，達成部門目標

中光電智能機器人是無人機國家隊核心成員，深耕無人機與機器人領域。於XPONENTIAL Europe 2025推出全球首發HVTOL長航程無人機，展現頂尖研發實力。 擔任台日無人機聯盟協同主席，攜手日本強強結盟，擴展防災、救災與自主飛行測試領域。更榮獲國防部軍用商規無人機標案，助力軍規機型量產，展現國家級戰略價值。加入我們，一起引領無人機與機器人產業革命！ 主要職責 設計和開發高效能的電子電路，確保無人機平台系統的穩定性和可靠性，並進行人員與專案管理。 主要任務 1. 新式平台架構評估與設計：參與無人機平台的架構設計，評估各種設計方案，確保最佳性能與可擴展性。 2. 系統電路除錯分析與改善：利用先進的測試工具和技術，進行系統電路的故障排除和性能優化，提升產品質量。 3. 系統整合設計與測試驗證：負責不同子系統的整合，進行全面測試和驗證，以確保系統的功能性和穩定性。 4. 無線通訊解決方案評估與設計：設計和評估創新的無線通訊方案，確保數據傳輸的效率與安全性。 5. 人員與專案管理及跨部門協作

1. 熟悉電子電路設計，具原理圖繪製與PCB Layout協同經驗 2.能獨立規劃與設計 Router、Layer3 Switch、FWA CPE 等網通產品主板 3.了解常見電源架構設計（DC/DC、PoE、LDO 等） 4.具備 EMI/EMC、ESD 設計與除錯經驗 5.能協助產品從 EVB → EVT → DVT → PVT → MP 轉換流程 6. 負責產品驗證及除錯改進及量產可製造性評估 7. 產品維修SOP製作或生產標準的改良方案，以達到在設備性能限制下的最佳品質。 8. 協助驗證電子零件及產品BOM審核 9. 工作態度正向主動積極

As the Electrical Engineering (EE) Ass. Manager/Supervisor, you will have the key responsibility for overseeing EE development from the initial concept incubation phase through to mass production (MP). Your role will involve close collaboration with a cross-functional team comprising members from Marketing, Firmware Engineering (FW), Project Management (PM), Mechanical Engineering (ME), and Quality Assurance (QA) to manage the complete design cycles for BMS-related products. Additionally, you will lead the development of new platforms and features to align with the long-term strategic business goals and enhance the competitiveness of the BMS product line.

1. FPGA/EVB PCB設計 2. PCIe高速信號PCB設計與量測 3. 與HW/FW跨部門專案合作

我們正在尋找一位熱愛技術、勇於挑戰、樂於學習的你。 恆豐專注於開發紅外影像感測與熱影像產品，為產業帶來全新視野，如果你希望在紅外線與相機模組技術領域持續精進，並在一個充滿活力與創意的團隊中發揮影響力，歡迎加入我們！ 【你的工作任務】 1.主導相機模組開發流程： 從需求分析、規格擬定、設計驗證、樣機導入至量產技術轉移，確保品質與效能達標。 2.專案與技術管理： 規劃並推動研發專案進度，解決技術瓶頸與協作問題，確保如期完成。 3.跨部門協作： 與設計、製造、品保、業務、行銷等部門密切合作，整合需求並協調資源。 4.客戶技術支援： 協助業務處理客戶需求與規格溝通，進行技術評估，提升產品導入與客戶滿意度。 5.品質與異常管理： 處理開發過程異常與風險控管，持續改善設計品質與製程穩定性。 【你可能具備的加分條件】 1.具相機模組、光學模組、感測器、紅外線影像系統等相關產品開發經驗尤佳 2.熟悉影像處理、ISP、Sensor整合、光學模組、韌體開發等領域任一技術 3.有半導體、可見光、熱影像產業經驗者尤佳 4.電機／電子／光電／機電整合等相關科系背景

Job Responsibilities: 1. Following R&D product design process to implement the hardware design. Ability to communicate clearly with team members and teamwork skills. 2. Cooperate with a cross-functional team of Engineers (EE, software, Thermal, mechanical, CAD, DFX, Test, etc.) and others in the development and support of new product introductions. 3. Serve as the senior technical advisor for the product line for the end-to-end life cycle of the product. Ensure operations technical readiness for all phases of the introduction cycle. 4. Identify, prioritize and manage key technical changes and risks of a given product; ensure all technical risks associated with a product are identified and closed or mitigated to enable the quality ramp of a product. 5. Review and submit all equipment requirement plans, along with an assessment of the robustness of the solution to meet the requirements of the operation, and the implementation of any additional solutions to mitigate any risks to the plan. 6. Deriving the functional specification and architecture for a subsystem or circuit pack based on system requirement. 7. Component selection/qualification; interacting with electrical/optical component vendors. 8. Documenting all technical design files. 9. Logic thinking and communication with customers Qualification: 1. A university degree in EE/CS, or a master’s degree is preferred. 2. With 8+ years relevant experience, preferable in communication product design and applications, such as datacenter switch, router, carrier switch, etc. 3. Experience with key switch silicon, such as Broadcom, Marvell, Cavium, etc. Experience in communication interface, such as XAUL/GMII/SGMII /XFI/PCI/PCI-E/ buses required 4. Knowledge on high-speed design, 25G SERDES is preferred 5. Experience in product testing, certification. 6. Excellent understanding of digital hardware design, power design, and high speed interfaces, timing analysis and signal integrity issues. 7. Understanding of analog electronic concepts and EMC. Can supervision of layout design. 8. Working knowledge of Concept schematics capture, Signal Integrity simulation, Verilog HDL, familiarity with Allegro. 9. Experience with high volume run products, test and verification of circuit packs designed. 10. Supporting new product introduction/transition to EMS. 11. Be familiar with EDA tools such as OrCAD, Concept HDL, Allegro etc. 12. Good communication skills, English language proficiency

1.監督和協調鋰電池設計、製造過程中的各項活動，確保生產計劃的順利執行。 2.提供技術支持和指導，以確保樣品製作、生產的高效運作和生產質量的持續改善。 3.管理和培訓下屬員工，確保他們具備必要的技能和知識，以應對設計生產過程中的挑戰。 4.與其他部門合作，評估案規格確認、解決生產中的問題、客訴問題分析，並提出改進建 議，以提高產品品質和生產效率。 5.知識化管理，流程文件、設計準則並制訂SOP。

[Responsibilities] Basic Debugging by Operator: - Upon new package release, execute diagnostic scripts and review failure logs to identify whether issues are related to hardware, software, or the test environment. - Hardware Issues: Provide relevant logs and update the failure status in the test unit sheet. The responsible owner will further analyze the root cause. - Software Issues: Attempt initial debugging. If the package contains errors, resolve them independently or consult the owner. Ensure the script runs error-free and upload any necessary modifications. - Environment Issues: Most environment-related issues can be resolved by rerunning the test or resetting the system. Log Management and Reporting: - Save all relevant logs and report results promptly to the designated owner. Script Modification: - Modify scripts as needed based on system type and testing requirements. Firmware Validation: - Manually execute commands to verify that firmware flashing and upgrades complete successfully. Check and confirm device status. On-Site Customer Support (Hsinchu): - Occasionally travel with the customer to Hsinchu for on-site support, as needed. [Requirement] - BS Degree in EE, with 3 to 4 years of Experience - Knowledge of Servers/PCs - Basic HW troubleshooting skills, first level of triage - Familiar with Hardware board bring and Test development on PCIe Interface - Scripting: Familiarity with scripting language like: Python and Linux Shell - Protocols: Like PCIE, USB and I2C/SPI - Operating Systems: Windows, Linux - Familiarity with Test Equipment (CRO, Power supply etc.) - Practical experience in high-tech environment, especially in NPI environment - Good Communication Skills, basic knowledge of common office software (Outlook, Excel, Word) - Ability to read schematics - Experience with installing FW/OS #Electrical or Electronics or computer #HW architecture and testing #Python programming and debugging

[General Summary] As a forward-thinking technology company, Augentix advances the limits of innovation in "Industrial and Embedded IoT" to deliver next-generation experiences and accelerate digital transformation toward a smarter, more seamlessly connected world. We are seeking a PCB Design Engineer with strong theoretical foundation and simulation driven design methodology to lead high speed board level development. You will be responsible for defining and verifying board level electrical design, ensuring optimal signal integrity across multiple high speed interfaces. You will be supported by experienced layout engineers capable of implementing your design guidance and constraints, allowing you to focus on PCB circuit design and system validation. This position offers the opportunity to build structured PCB design practices, improve team capability, and drive electrical excellence through direct ownership of simulation and cross team collaboration. [Responsibilities] ★ Lead system level PCB electrical design for interfaces such as LPDDR4/5, USB 3.x, SDIO 3.x, MIPI and Ethernet. ★ Define PCB stack up and routing strategy to meet signal integrity objectives. ★ Perform circuit level simulations using tools such as PSpice. ★ Own schematic level electrical planning and define layout constraints for critical signal groups. ★ Provide guidance to supporting layout engineers to ensure adherence to electrical rules and best practices. ★ Correlate simulation results with lab measurements and assist in electrical issue root cause analysis. ★ Document simulation methodology constraint guidelines and validation reports. ★ Occasional business travel across APAC and other regions may be required. [Minimum Qualifications] ★ Familiarity with differential and single ended routing across LPDDR4/5, USB 3.x, SDIO 3.x, MIPI and Ethernet. ★ Proficiency with layout tools such as Allegro. ★ Exposure to EMI mitigation techniques and hands on experience in EMI pre compliance testing. ★ Demonstrated ability to lead layout teams or mentor junior engineers in constraint based PCB design. ★ Ability to create structured documentation and design guidelines to scale internal processes. ★ Strong debugging and problem solving skills with working knowledge of firmware and software to support system level root cause analysis. ★ Comfortable working in a globally distributed, cross-disciplinary engineering team.

1. 負責產品電性量測、數據分析，撰寫測試報告與技術文件。 2. 熟悉 Power Supplier、Power Meter、示波器等測試設備，能獨立架設量測電路。 3. 建立並優化 DFM 流程，支援專案開發及量產導入，確保產品可靠度與製程穩定。 4. 操作 ERP 系統，進行料號建立、BOM 表維護與相關資料管理。 5. 支援跨部門專案及主管交辦事項。