1.Switch 產品熱傳設計
2.與團隊(HW and ME)合作完成系統熱傳模擬及流場設計
3.風扇及導熱材料(heatsink and TIM)選用
4.與供應商合作完成散熱模組設計(氣冷及水冷架構)
5.Review 相關測試結果及優化 (thermal, air flow and acoustic test)
6.與客戶討論產品熱傳設計方向與solution
工作內容:
1. Develop and design new thermal technology for portable/wearable devices and
server, including novel material vapor chamber.
2. Plan and setup a new production line for novel thermal solution.
3. Collaborate with RD team to execute engineering builds from EVT to PVT, report
thermal/mechanical/reliability features to JDM or clients.
Job Description :
• Responsible for mechanical design on high precision and high dynamic mechanisms for semiconductor packaging equipment which covers for material handling and tooling design
• Responsible for continues design improvement activities such as Design for Manufacturing Equipment
• Involve in cost reduction programs
Requirements :
• At least a degree in Mechanical /Mechatronics /Material Science Engineering
• No relevant experience is required for this position
• Proficiency in solid edge ,Pro-E and AutoCAD
• Able to use Computerized Engineering Tools for structural ,design synthesis , computational fluid dynamics(CFD) , thermal fluid and modal analysis on mechanical system
• Strong knowledge in the following areas :
o Electromagnetic device and actuator selection
o Kinematics and kinetics as well as strength of materials in design
o Vibration mechanism ,vibration suspension ,vibration isolation and vibration control
o High precision manufacturing process
Cooler Master 為世界頂尖的散熱技術領導企業,提供全球電競、雲端、通訊、電動車等大廠散熱解決方案。公司正持續拓展全球市場,並誠摯邀請優秀人才加入我們的頂尖團隊。
What you'll be doing
1. 設計、模擬散熱模組/系統
2. 與客戶討論並確認設計規格
3. 協作製程單位做新產品導入(NPI)及效能優化
What we need to see
1. 熟悉熱力學、流體力學
2. 熟悉繪圖或散熱模擬工具
3. 創新思維及良好溝通能力
What we'll offer you
1. 世界級舞台,提供您與全球頂尖團隊合作機會
2. 完善培訓制度,提供您掌握全球領先散熱技術的學習環境
3. 人性企業文化,提供您工作/生活平衡職場環境