Overview:
The Senior TCAD Engineer will be a key member of our technology development team, responsible for advanced modeling and simulation of semiconductor devices and fabrication processes. This role involves defining and executing TCAD projects for novel device architectures, optimizing performance, and analyzing results to guide process integration and design teams.
Key Responsibilities:
• Develop and validate TCAD models for advanced technology nodes.
• Run simulations to assess device performance (IV, CV, breakdown, reliability).
• Interpret results to guide design and process improvements.
• Collaborate with engineering teams to align on technology roadmap.
• Act as TCAD expert and provide technical support.
• Automate simulation tasks using scripting (Python, Perl, TCL).
• Compare simulations with silicon data and resolve discrepancies.
• Prepare technical reports and present to cross-functional teams.
• Stay updated on TCAD trends and enhance modeling capabilities.
• Mentor junior engineers and contribute to IP development.
Qualifications:
• 5+ years of hands-on experience in TCAD process and device simulation within
the semiconductor industry.
• Deep understanding of semiconductor device physics and fabrication processes.
• Expertise with commercial TCAD simulation tools such as Synopsys Sentaurus or
Silvaco Atlas.
• Proficiency in scripting languages (e.g., Python, Perl, TCL) for tool automation.
• Experience with analog focused process technologies, particularly high voltage
transistors such as drain extended CMOS or LDMOS devices.
【職位描述】
RVI公司新創的光通訊引擎(Optical Engine)封裝製程開發。負責設計、開發、製程整合、測試先進封裝光模組,涵蓋矽中介層、玻璃中介層、光學器件製程整合、與高階基板。負責從概念到生產的封裝製程設計,製程整合、光源系統封裝、與光引擎品質和性能研究。
【主要職責】
1.負責矽光子產品的光引擎光學結構設計、熱管理、光電轉換、封裝製程整合。
2.協作電路模擬、光學模擬、設計,以及晶片與光學元件的選擇與驗證。
3.與上游廠商討論光引擎電子元件規格、光學元件規格,並提供封裝技術建議。
4.協助完成矽光子光引擎樣品的製作,確保產品符合設計要求並達到高品質標準。
Position Description:
Join RVI's innovative Optical Engine development team, focusing on advanced packaging processes for next-generation optical communication engines. This role involves the design, development, process integration, and testing of advanced optical modules, including silicon interposers, glass interposers, optical component integration, and high-end substrates. The engineer will lead packaging process design from concept to production, ensuring system-level performance, thermal and optical optimization, and overall product quality.
Key Responsibilities:
1.Lead the design and integration of optical engine packaging for silicon photonics products, including optical structure design, thermal management, optoelectronic conversion, and process integration.
2.Collaborate on electrical and optical simulation, design validation, and component selection for chips and optical elements.
3.Communicate with upstream vendors to define specifications for electronic and optical components, and provide packaging technology recommendations.
4.Assist in the prototyping and fabrication of silicon photonic optical engines, ensuring compliance with design specifications and achieving high product quality standards.
* In charge of customer account
* To implement problem-solving processes in the Taiwan organization, and work with the Sales and Service organization on the improvement of product reliability at customer sites, and reduce Cost Of Ownership to our customers
* Deliver technical presentation to customers, particularly on details of product design, technology, applications and safety
* Regional authority for product selection
* Promote new product and coordinate the local resources to manage Loan & Evaluation programmes
* Resolve technical and applications issues
1. To improve device yield &CIP in order to meet customer request and customer service.
2. Identify and solve process and device problems.
3. Support for customer visit and audit.