1. To improve device yield &CIP in order to meet customer request and customer service.
2. Identify and solve process and device problems.
3. Support for customer visit and audit.
I. Ink process optimization and mass production monitoring :
1. Material synthesis process
2. Particle dispersion process
3. Compounding process
4. Search and summarize relevant papers and optimize proposals
II. Optical data tracking of finished materials :
1. Adjust material QC item based on optical data
2. Find new / key QC indicators
執行晶圓級封裝AOI製程專案開發、製程整合、良率改善及缺陷分析
詳細職責如下:
1. Maintaining process flow and recipes on MES, and tools and recipes on RMS.
2. Handling abnormal cases on MES and conducting daily yield analysis.
3. Supporting New Product Introduction (NPI) and Design of Experiments (DOE), and preparing summary reports.
4. Developing and implementing process improvements to enhance yield and productivity.
5. Conducting root cause analysis for defects and collaborating with cross-functional teams to resolve process-related issues.
此職務需日夜輪班 (做二休二,約每三個月日夜輪調一次)
日班上班時間:07:20~19:30 (中間休息2小時10分,實際工時10小時)
夜班上班時間:19:20~07:30 (中間休息2小時10分,實際工時10小時)
* 熟悉半導體晶圓級製程或具備跨部門溝通經驗尤佳。
*實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。
*資深人員薪資另議。