「Application Engineer_ High Speed」的相似工作

Overview: Responsible for designing evaluation boards, performing product verification, and providing technical support to global customers. Key Responsibilities: • Design and develop evaluation boards (EVBs) for product validation. • Conduct product testing and verification using lab equipment. • Prepare application-related documentation. • Review customer schematics and PCB layouts. • Provide technical support to worldwide customers. Qualifications: • Strong debugging and problem-solving skills. • Experience in prototype board design and troubleshooting. • Proficient in lab equipment usage (oscilloscope, logic analyzer). • Skilled in schematic and PCB layout tools (Cadence OrCAD, Altium, PADS). • Familiarity with analog and digital IC applications. • Knowledge of high-speed interface applications and compliance standards is a plus. • Excellent verbal and written communication skills. • Team-oriented with strong cross-functional collaboration abilities.

Overview: MOSFET Design Team offers the innovative environment for talents to dive deep into the world of device design, platform development, and research. We offer working locations in both Xindian and Tainan. Come and join us to focus on the most cutting-edge semiconductor materials and applications! Key Responsibilities: • Develop and execute innovative device layouts in line with customer requirements, ensuring optimal functionality and efficiency. • Partner with PE and Quality teams to enhance device reliability and address any arising issues in time. • Establish and continuously optimize SPICE models to reflect the characteristics of both new and existing devices. • Work alongside the PIE team and collaborate with external foundries, paving the way for the next generation of advanced devices. • Drive the research and patenting efforts centered around novel designs, applications, and advanced materials, such as GaN and SiC. • Accomplish additional tasks delegated by the supervisor. Qualifications: • A Master’s degree in EE, Physics, or a related field. • Expertise in power devices, with a spotlight on UMOS, SGT, LDMOS, MLSJ, GaN and SiC. • Comprehensive understanding of device physics and semiconductor manufacturing processes. • Proficiency in semiconductor simulation tools. • Strong English communication skills, catering to both technical and non-technical stakeholders.

1. Support customer projects from design-in, design-through to mass-production. 2. Team work with AE, FAE, RD and QA to solve problems.

Overview: Key Responsibilities: 1. Monitor new product and sustaining projects with PE, host PE weekly meeting 2. Change review board (CRB) meeting for new platform release and fab porting 3. Material review board (MRB) meeting for low yield and process issue disposition 4. Communicate the key projects priority with foundries and AT site to make projects smooth and on schedule 5. Support Marketing, FAE and Sales for customer inquiry and request. 6. BU PE monthly report, key project progress report Qualifications: 1. Familiar with new product release procedure 2. Reliability testing parameter e.g. JEDEC standard, AECQ-101 standard 3. Failure Analysis capability 4. Discrete product related developing experience 5. Good oral and written communication skills are required

Job Responsibilities: 1. Following R&D product design process to implement the hardware design. Ability to communicate clearly with team members and teamwork skills. 2. Cooperate with a cross-functional team of Engineers (EE, software, Thermal, mechanical, CAD, DFX, Test, etc.) and others in the development and support of new product introductions. 3. Serve as the senior technical advisor for the product line for the end-to-end life cycle of the product. Ensure operations technical readiness for all phases of the introduction cycle. 4. Identify, prioritize and manage key technical changes and risks of a given product; ensure all technical risks associated with a product are identified and closed or mitigated to enable the quality ramp of a product. 5. Review and submit all equipment requirement plans, along with an assessment of the robustness of the solution to meet the requirements of the operation, and the implementation of any additional solutions to mitigate any risks to the plan. 6. Deriving the functional specification and architecture for a subsystem or circuit pack based on system requirement. 7. Component selection/qualification; interacting with electrical/optical component vendors. 8. Documenting all technical design files. 9. Logic thinking and communication with customers Qualification: 1. A university degree in EE/CS, or a master’s degree is preferred. 2. With 8+ years relevant experience, preferable in communication product design and applications, such as datacenter switch, router, carrier switch, etc. 3. Experience with key switch silicon, such as Broadcom, Marvell, Cavium, etc. Experience in communication interface, such as XAUL/GMII/SGMII /XFI/PCI/PCI-E/ buses required 4. Knowledge on high-speed design, 25G SERDES is preferred 5. Experience in product testing, certification. 6. Excellent understanding of digital hardware design, power design, and high speed interfaces, timing analysis and signal integrity issues. 7. Understanding of analog electronic concepts and EMC. Can supervision of layout design. 8. Working knowledge of Concept schematics capture, Signal Integrity simulation, Verilog HDL, familiarity with Allegro. 9. Experience with high volume run products, test and verification of circuit packs designed. 10. Supporting new product introduction/transition to EMS. 11. Be familiar with EDA tools such as OrCAD, Concept HDL, Allegro etc. 12. Good communication skills, English language proficiency

工作內容 1. 負責Ansys SIwave/HFSS/Q3D 等高頻軟體技術支援，包含售前/售後支援、教育訓練 2. 拜訪客戶介紹、推廣軟體以及解決方案 3. 與原廠技術團隊對接，協助溝通/解決客戶問題、學習軟體新功能 4. 高頻相關工程專案規劃與執行 5. 支援公司市場行銷活動 ---------------------------------------------------- 本公司具備Ansys產品專業技術人員，擁有廣大的技術資源供學習， 市場遍及台灣、中國及東協等地。 我們不斷地開拓新技術及市場，誠摯希望有志一同的你加入~ 歡迎光學、電磁學、電子電路、電磁干擾、光波導、矽光子各領域專家加入我們的團隊!! 思渤科技培養的不只只針對工作需求的專業工程技術人才， 更是培養技術人才自身技術品牌的職涯延伸， 讓你不單只是單一技術在此發展， 而是廣闊長遠的打造出個人技術品牌知名度， 讓你在專業領域中與更多佼佼者一起發光發亮!! ｜遠距辦公。節省通勤成本。溝通不斷線｜ ☆業務試用期三個月通過後，即可申請遠距辦公方式！ ☆每週只需進公司辦公一天，剩下四天靈活運用外勤出差或在家辦公，節省塞車通勤時間，線上溝通快速不斷線。 ｜舒適好開公務車。公務拜訪便利又安全｜ ☆提供三年內新車預約公務拜訪使用，安全又舒適。 ☆不需自己養車，找車位，公司定期保養管理，外勤無負擔。 ｜薪獎優渥。輕鬆get百萬年薪！｜ ☆業績獎金 ☆盈餘獎金 ☆年終獎金 ☆中秋、端午獎金 ☆配發公務機 ☆結婚禮金/生育津貼 ☆推薦人才獎金 ☆近3年平均調薪幅度3~5%

【Position Goals】 1.Achieve panel qualification at target panel vendors in Taiwan 2.Grow Parade’s market share for notebook in-cell products through excellent technical execution and proactive risk mitigation 3.Establish in-depth technical relationships with key panel engineers and establish Parade notebook solutions as vendor of choice. 【Main Responsibilities】 1.Cooperate closely with Parade Sales/FAE/Marketing to achieve notebook in-cell technical qualification 2.Manage project-level detail to achieve program success on production customer projects 3.Technical execution of customer design wins from prototype to production 4.Establish yourself as touch domain expert and become trusted advisor and resource for customer panel engineers

Key Responsibilities: ．Responsible for the design and optimization of Silicon and/or Silicon Carbide (SiC) Power MOSFET devices for applications across a wide voltage range. ．Utilize TCAD, SPICE, finite element analysis (FEA) software, and layout design tools for device simulation, performance evaluation, and layout verification. ．Collaborate closely with process integration, layout, product, and QRA teams to drive new product development and mass production. ．Prepare technical documentation and deliver design presentations in project meetings. ．Support customer inquiries. Qualifications: ．Master's degree or above in Electrical Engineering, Electronics, Materials Science, Physics, or related fields. ．Over 5 years of experience in Power MOSFET or discrete device design. ．Proficient in TCAD simulation tools such as Synopsys Sentaurus, and Silvaco. Preferred Qualifications: ．Experience in designing Trench, Planar, or Shielded Gate Trench (SGT) structures, and ESD protection devices. ．Experience in mass production ramp-up or supporting wafer foundry projects. ．Prior involvement in automotive or industrial applications is a plus. ．Familiar with SPICE modeling and finite element analysis tools (e.g., COMSOL, Ansys).

-Working with IC design team on IC bring up and electrical verifications. -Develop evaluation hardware platforms, reference schematic and PCB board verification. -BOM cost and competition analysis. -Technical support for customer projects along with AE/DE/SW/FW/QC engineers.

Overview: This role is responsible for leading new product initiatives, crafting detailed datasheets, and fostering cross-departmental collaboration. The ideal candidate possesses a deep understanding of IC/MOSFET fabrication, semiconductor testing, and is adept at navigating Power industry nuances. Strong communication skills and self-motivation are paramount. Key Responsibilities: • Steer new product development processes, ensuring timely releases and meticulous schedule management. • Craft and disseminate product datasheets to maintain clarity and accuracy. • Provide steadfast support for Sales & Marketing teams in design-in activities, bridging technical knowledge with market needs. • Oversee product life cycles, encompassing EOL, ECR, and PCN in alignment with product roadmaps and BU strategies. • Ensure production-embedded changes through systematic controls and participate in SCS part creations. • Engage actively with multifunctional teams, crossing from Sales & Marketing, Design, and Quality, to address challenges in fabrication, packaging, testing, and application. • Accomplish additional tasks delegated by the supervisor. Qualifications: • Comprehensive knowledge of semiconductor testing, assembly, and IC/MOSFET wafer fabrication processes. • A strong foundation in electronic analysis. • Exceptional communication and negotiation skills. • A self-starter mindset with readiness for individual contributions. • Experience in the Power industry is a plus.

1.Develop validation plans, execute system-level qualification tasks, and conduct stress tests to evaluate product reliability. 2.Support compatibility testing for PD, HUB, and related products. 3.Analyze root causes and provide relevant debugging information to assist R&D in resolving issues. 4.Summarize qualification results and compile the final QA report. 5.Support the marketing and FAE team in analyzing field failures and provide feasible solutions based on findings.

Job Description: As a team member of analog product business group, this role will support Analog IC circuit design of mixed-signal ICs, such as sensors, motor drivers, data converters. Key Responsibilities: 1. Co-work with talented design teams to develop high performance sensor related integrated circuits and products, such as Hall effect sensor, temperature sensor. 2. Contribute to chip architecture and circuit design decisions 3. Collaborate with validation, product engineering and test engineering teams to enable successful transfer to production 4. Also, will be responsible for circuit requirements definition, design, simulation and analysis, layout/test support, documentation and customer support for sensor applications. Qualifications: 1. Demonstrate strong analytical and problem-solving skills 2. Strong time management skills that enable on-time project delivery 3. In depth working experience with Cadence composer and Virtuoso, Spectre, HSpice and mixed-signal design flow. 4. Experience in lab measurement and equipment. 5. Self-starter. Passionate about creative work. Good communication skills and team player. Able to take the initiative and drive for results.

Job responsibilities: 1. 設計連接器的測試治具或簡單小卡線路並與板廠接洽疊構。 2. 負責設計電子電路的原理圖並進行PCB佈局和佈線，確保電路符合設計要求。 3. 根據電路設計需求，選擇合適電子元件，並針對新元件和供應商進行評估。 4. 網路分析儀操作使用。

1. 協助解決國內外客戶反映之技術端問題 。 2. 國內外客戶端技術問題諮詢 。 3. 外部與內部教育訓練 。 4. 技術文件製作與介紹。 5. Debug support。 6. 跨部門協調合作。 7. 整體管理規劃人力,資源,工作,職掌及專案進度。

1. Assist in resolving PCIe SI (Signal Integrity) related issues 2. Support PCIe compliance test certification 技能需求(至少一項): 1. Experience participating in PCIe compliance test workshops 2. Familiarity with PCIe protocol 3. Knowledge and experience in signal integrity (SI) 上班地點: 1. 內湖科技園區(內湖路一段120巷19號6樓) 2. 新竹市東區公道五路二段120號7樓之1

1. RF天線最佳化模擬。 2. 電磁元件設計模擬。 3. 相關量測(RF天線)。 4. 能獨立工作及專案執行。

Responsibilities: ★ Compatibility Testing: Conduct compatibility testing of hardware components across different systems and configurations. Ensure interoperability with software/firmware components. ★Performance and Reliability Testing: Evaluate hardware performance and reliability under various conditions. Conduct stress testing to identify potential failures and weaknesses. ★Integration with Software/Firmware: Collaborate with software/firmware teams to ensure seamless integration of hardware components. Test hardware functionality in conjunction with software/firmware systems. ★ User Interface (UI) Testing (if pplicable): Verify user interface elements associated with hardware components for functionality and user-friendliness. ★Adaptability and Regression Testing: Adapt to evolving project requirements and technologies. Implement and maintain regression test suites for hardware components. ★ Documentation: Create comprehensive test documentation including plans, cases, and reports. Document hardware integration processes, configurations, and test results. Qualifications and Skills ★Educational Background: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field. ★Knowledge and Experiences: Previous experience in hardware integration or related technical field. Solid understanding of hardware integration concepts to ensure seamless operation of components. ★Technical Skills: Hardware Testing: Proficiency in testing methodologies for hardware components. Experience with hardware testing tools and equipment. Understanding of hardware development life cycle (HDLC) processes. ★Collaboration and Communication Skills: Collaborate effectively with cross-functional teams and provide technical insights. Communicate technical issues and solutions clearly and concisely. Foster a collaborative and supportive team environment. ★Customer Focus and Problem-Solving Skills: Maintain a customer-oriented mindset, striving to deliver hardware solutions that meet or exceed expectations. Utilize analytical skills to troubleshoot integration issues and propose effective solutions. Demonstrate the ability to work under pressure and meet project deadlines.

BU Overview Consumer, network and datacenter applications change at an exponential pace and the Data & Devices (D&D) business unit at TE Connectivity is at the heart of a continuously expanding connected life. Accordingly, we provide responsive, iterative and fundamentally agile capabilities and conceive, design and manufacture to support today's demands. Our customers are building the devices and the infrastructure that is redefining what information technology means. Our products push markets and meet the ever-changing need of the evolving, more connected, data-driven world. We are enhancing the way we do business, focusing on the most important things and staying agile and responsive to the needs of a faster, more connected world. Job Overview As a Sr. Product Dvl Engineer in the Signal Integrity team you will focus on the electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industry—targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Responsibilities: •Subject matter expert in signal integrity design, simulation and validation activities through product development cycles •Establishing signal integrity design performance/functional requirements for new products •Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. •Performing PCB design schematic and layout reviews •Creating actionable recommendations based upon design reviews and simulation results •Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: •Bachelor’s degree in Electrical Engineering, Master’s degree preferred •Minimum of 5 years of work experience in a signal integrity engineering role •Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables), &/or RF antenna, RF sub-system •Signal integrity analysis tools (Agilent ADS, Ansys HFSS) •A solid understanding of electromagnetic theory and electrical circuit behavior •Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. SixSigma methodologies or other strong data analytics background a PLUS. •Familiarity with printed circuit board design, fabrication and assembly. Proficient in Altium a PLUS •Experience in project leadership, especially as it applies across design, development & manufacturing teams •Excellent verbal and written communication skills •Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies •Individual must be highly motivated, a quick learner, and able to work independently

1、高速連接器電磁模擬分析 2、使用模擬軟體分析數據並提供建議修改方向 3、可配合到中壢或外廠進行不良分析及改善對策提供 4、可配合至客戶端進行FAE相關工作 ※ 工作需求須能夠配合不定期出差桃園總部 ※

Job Summary: 1. We are looking for a highly skilled and experienced Senior Hardware Design Engineer to join our server development team in Taipei. 2. The ideal candidate will be responsible for high-speed hardware design, schematic capture, debugging, and working cross-functionally with layout, validation, firmware, and manufacturing teams to deliver high-quality server products and add-on cards. Key Responsibilities: 1. Responsible for schematic capture, layout review, BOM generation, and debugging/testing of server motherboards and add-on cards. 2. Collaborate with layout engineers, BIOS and firmware engineers, validation and test engineers, and cross-functional teams to identify and resolve engineering issues early in the development cycle. 3. Participate in and contribute to design reviews, architecture discussions, and project planning. 4. Prepare and maintain technical documentation, including product specifications, layout guidelines, test procedures, and design review reports. 5. Ensure product compliance with engineering specifications, safety, and energy regulations if any (e.g., ErP), and customer performance expectations. 6. Provide clear documentation and technical support to contract manufacturers and production teams during prototype and mass production stages. 7. Lead root cause analysis and provide corrective actions for hardware-related production or field issues. Required Qualifications: 1. Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. 2. Minimum 5 years of experience in hardware design for server, PC, or embedded systems. 3. Proficient in schematic capture tools (e.g., OrCAD). 4. Solid understanding of high-speed signal integrity, power delivery design, and board-level debugging. 5. Hands-on experience with lab equipment such as scopes, logic analyzers, and multimeters. 6. Strong problem-solving and analytical skills. 7. Good communication and documentation skills in both English and Mandarin.