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Molex Taiwan Ltd._台灣莫仕股份有限公司
共500筆
09/30
桃園市龜山區2年以上碩士以上
This vacancy is open for talent pool collection. We will contact you if we have proper vacancies that fit with your profile. Job Mission Represent manufacturing and act as gatekeeper from manufacturing to D&E function Add value in overall manufacturing processes such as forming, machining, joining, and assembling Job Description Contribute to the solution of faults and takes the necessary initiatives and practical decisions to ensure zero repeat Identify gaps and drive assigned process improvement projects and successful delivery Initiate and drive new procedure changes and projects Develop and maintain networks across several functional stakeholders Prioritize works and projects based on business situation Transfer knowledge and train colleagues on existing and newly introduced products Education Master degree in technical domain (e.g. electrical engineering, mechanical engineering, mechatronics) Experience 3-5 years working experience in design engineering Personal skills Show responsibility for the result of work Show proactive attitude and willing to take initiative Drive for continuous improvement Able to think outside of standard processes Able to work independently Able to co-work with different functional stakeholders Able to demonstrate leadership skills Able to work in a multi-disciplinary team within a high tech(proto) environment Able to think and act within general policies across department levels Diversity and inclusion ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company. Need to know more about applying for a job at ASML? Read our frequently asked questions.
應徵
09/26
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新竹市8年以上大學以上
We are seeking a highly experienced Senior Manager to lead the development of advanced wafer-level packaging (WLP) technologies, including heterogeneous integration, 2.5D/3D packaging, chiplet integration, and high-density interconnect solutions. The candidate will play a critical role in driving technology roadmaps, cross-functional R&D programs, and partner engagements to accelerate the deployment of next-generation semiconductor packaging solution What You Will Do In Your Role Technology Development & Roadmap - Lead the research, development, and implementation of advanced wafer-level packaging technologies (e.g., TSV, RDL-first/last, hybrid bonding, 2.5D/3D integration, fan-out, Si interposers, CoWoS, InFO, etc.). - Define and execute packaging technology roadmaps aligned with corporate strategy and market trends. - Evaluate emerging technologies, materials, and processes for feasibility and scalability. Package platform development for new product roadmap - Cooperate with global cross-functional R&D teams and external partners on developing package platform with good sustainability, manufacturability, reliability and decent performance. - Oversee prototype development, process qualification, and technology transfer to high-volume manufacturing. - Ensure projects meet technical milestones, schedule, cost targets, and yield goals. Ecosystem Engagement - Collaborate with foundry, OSAT, substrate, EDA, and materials suppliers to strengthen ecosystem partnerships. Team & People Development - Build, mentor, and lead a high-performance wafer level packaging R&D team. - Foster innovation, collaboration, and continuous improvement within the organization. - Support talent development and succession planning in the advanced packaging domain. The Experience You Will Bring Requirements: EDUCATION: REQUIRED: Master’s or PhD in Materials Science, Electrical Engineering, Mechanical Engineering, Applied Physics, or related field. WORK EXPERIENCE: REQUIRED: 1. 8+ years of relevant experience in advanced semiconductor packaging R&D, with at least 3 ~5 years in leadership/management roles. 2. Proven track record in wafer-level packaging, 2.5D/3D integration, or heterogeneous integration technology development. What Will Put You Ahead: - Hands-on experience with hybrid bonding, TSV, micro-bumps, fan-out, or chiplet architectures. - Strong knowledge in materials, process integration, thermal/mechanical reliability, and yield optimization. - Experience working with foundry/OSATs and driving technology transfer to HVM. - Excellent leadership, program management, and cross-functional collaboration skills. - Strong communication skills in English (verbal and written); Mandarin proficiency is a plus. - Experience with EDA tools for package co-design (electrical/thermal/mechanical simulation) preferred. At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy. Who We Are At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company. Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results.
應徵
10/01
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新北市新店區5年以上大學以上
Molex possesses a rich heritage in the optical industry. We provide the highest performing and field-proven wavelength management solutions from components, modules to integrated line-cards. Continuous innovation in passive component function integration, miniaturization, and manufacturing automation, cutting edge WSS and amplification technology and comprehensive optical, mechanical, electrical and software design capabilities enable us to serve the needs of high-density, high-bandwidth, and flexible optical networks of telecom, datacom, hyperscale datacenter and supercomputing. In New Taipei, Taiwan, we serve global clients in telecom and datacom industries in providing innovative optical modules to support our customer’s next generation networks. We are looking for an Electro-Optical System Engineer to join our team. This person will be responsible for Electro-optical system design and development of innovative fiber optical products, such as the optical frequency/Time domain reflectometry, optical performance monitor, weak optical coherent signal detection that are used in telecom and datacom. This person will work with multi-discipline teams, including sales and marketing, product line managers, electrical, mechanical, and optical R&D teams, and work with colleagues of different geographic sites. What You Will Do •Proposing new optical design concepts, conducting technology and platform evaluation for next generation optical communication products •Design new fiber optical products and manage product extensions, especially participate in the research, design and development of optical frequency domain reflector, optical time domain reflector, optical performance monitor as well as weak/coherent optical signal detection/monitoring solutions. •Work with chief/principal optical system engineers to design new products, build optical models and performance error and tolerance analysis. •Work with hardware, software/Firmware members in design team, and carry out product level system analysis, modeling and simulation. •Provide technical guidance to process engineers and technicians. Provide technical support to customers and suppliers. •Provide technical support on processes development. •Performs design verification activities to ensure that optical design meets the specifications of the customers and standard organizations. •Release drawings of optical components and sub-assemblies. •Understand, support, and contribute to current Molex Total Quality Management (TQM), Six Sigma, International Standards Organization (ISO) and Environmental, and/or Health and Safety (EH&S) Management Systems by following stated policies and procedures. Who You Are (Basic Qualifications) •Master’s degree in physics, applied physics, optics and optical engineering, electrical engineering with optical orientations. •6 plus years electro-optical system and/or fiber optical system design & development experience. •Solid fundamental knowledge and expertise in electro-optical system design and engineering. •Hands-on experience in laser diodes/LEDs/SLEDs/VCSELs, etc. light sources; in PIN PDs/APDs, etc. light detectors; in coherent/weak and fast optical signal detections and the relevant fields. •Hands-on experience in micro-optics and fiber optics components and assemblies with functions of switching, modulation, attenuation, branching, amplification, etc. •Familiar with Zemax, CODE-V, Matlab or other simulation tools to build models of optical products. •Familiar with optical system error & tolerance analysis •Demonstrated ability to analyse analyze information and solve problems. •Good verbal and written skills for exchange of information in a clear and concise manner in English and Mandarin. •Demonstrated ability to work effectively within a team environment.
應徵
09/26
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新竹市2年以上大學以上
Your Job As an Advanced Wafer Level Package (WLP) Engineer, you will lead the development of cutting-edge wafer-level packaging technologies. Your role encompasses pioneering heterogeneous integration, 2.5D/3D packaging, chiplet integration, and high-density interconnect solutions. You will develop and validate advanced packaging processes such as RDL, TSV, Hybrid Bonding, Micro-bump, and Fan-Out. Additionally, you will perform material characterization, analyze packaging structures, resolve reliability issues, and collaborate closely across functions to ensure successful technology implementation and prototype development. Our Team You will be part of the DSS Division, within the R&D Component Engineering department, working closely with the Advanced WLP Senior Manager and cross-functional teams including design, integration, testing, reliability, as well as external partners such as material, equipment, and substrate suppliers. Our team is dedicated to pushing the boundaries of semiconductor packaging technology through innovation and collaboration. What You Will Do - Develop and validate advanced wafer-level packaging processes including RDL, TSV, Hybrid Bonding, Micro-bump, and Fan-Out. - Execute the development of heterogenous integration, 2.5D/3D packaging, chiplet integration, and high-density interconnect (HDI) solutions. - Conduct comprehensive material characterization and analyze packaging structures to identify opportunities for process optimization. - Define process parameters and establish design specifications to ensure manufacturability and high yield. - Support the introduction of new technologies and prototype sample development. - Perform failure analysis (FA) and address reliability issues to enhance product performance. - Collaborate cross-functionally with design, integration, testing, and reliability teams to ensure seamless project execution. - Liaise with material, equipment, and substrate suppliers to evaluate the feasibility and integration of new technologies. Who You Are (Basic Qualifications) - Master's degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemical Engineering, Optoelectronics, or related fields. - Minimum of 2 years' experience in semiconductor packaging or process development. - Proficient in at least one of the following areas: RDL/Fan-Out process technology, TSV/Micro-bump/Hybrid bonding, Si interposer/CoWoS/InFO/3D IC, or material and structural reliability (thermal, mechanical, electrical). - Strong problem-solving skills and ability to collaborate effectively across functions. - Proficiency in reading and understanding English technical documents. What Will Put You Ahead (Preferred Qualifications) - Experience in wafer-level or advanced packaging technologies. - Hands-on experience in failure analysis (FA) and reliability testing. - Practical experience with wafer fabrication or back-end process operations. - Up-to-date knowledge of industry trends in advanced packaging technologies.
應徵
10/01
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新北市淡水區10年以上大學
Technical Project Manager (Taiwan Design Center) Are you looking to make a connection to your career? Come to Molex where we create connections for life. We use innovation, engineering excellence, commitment to quality and reliability, and superior customer experience to improve communication, elevate experiences, and engage and inspire people everywhere. Molex’s Copper Solutions Business Unit (CSBU) is a global team that works together to deliver exceptional products to worldwide telecommunication and data center customers. CSBU is one of the most highly technically advanced business units within Molex. Our engineering teams are designing cutting edge solutions for high-speed, high-density products that maximize speed, signal integrity and efficiency. Technical Project Manager (TPM) will be leading a highly motivated, world-wide, cross functional team through the New Product Development Process from project initiation approval through production. This person will lead projects with global cross functional teams, working directly with customers, mentoring team members, solving problems, and making/being accountable for project-level decisions. You have strong project management experience in “technical” business environments. The Project Manager will thrive on moving the needle to achieve business objectives that will take Molex and our customers to the next level. What You Will Do In Your Role •Partner to Product Manager: Ensure Molex key technology projects seamlessly support our customer’s finished good project deliverables through close collaboration and effective communication with our customer. •Project Team Leader: Simultaneously lead multiple New Product Development projects for customer specific and general market projects. •Develop internal & external facing Project Charters that clearly articulate project strategy, scope, financials, and schedule. •Own Project Reporting communication to both Management and Customers. •Perform the Project Management function: Manage Project Change Control and Decision Documentation. •Lead Project Plan development, management, and closure (transfer to production owner). •Own and develop Macro Project Schedules and understand and hold accountable Functional Team Members supporting Micro Schedules. •Lead and mentor team members in project management principles, PDP processes, risk management, issue resolution, decision making, etc. •Proactively identify, document, and execute risk reduction activities to minimize Project Risks associated with Cost, Quality, and/or Timing that could negatively affect Project Plan achievement. •Work with Suppliers: Ensure that they meet Molex’s expectation for timing, cost and quality in support of the Project Plan The Experience You Will Bring •Bachelor’s degree in engineering, finance, business, supply management or related field •Experience leading projects with Product Development •At least 4 years of Project Management experience •Experience with customer facing roles or external executive facing experience •Experience leading multi-national teams •Experience in matrix environment •Willingness to travel domestically and internationally up to 15% of time •Ability to work mornings and evenings to accommodate global meetings •Ability to obtain PMP certification within 1 year (company paid) Qualities and Behaviors: •Natural leader with sense of ownership and accountability •Strong presentation and communication skills •Self-driven with ability to thrive in a remote working environment •Contribution Minded •Can-Do Attitude •Natural Leader with sense of ownership and accountability •Organizational, interpersonal, & decision-making skills What Will Put You Ahead •PMP Certified •Master of Business Administration (MBA) •Bi-Lingual in English, Mandarin or Chinese •SAP Experience
應徵
09/30
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新北市新店區3年以上大學以上
Job description: 1. Job Description: a. Design and develop innovative optical modules for AI / optical network applications. b. Optical design (ZEMAX) and tolerance analysis. c. RD Sample build on optical table d. New technology/ component study. e. Support on production issues, business travel to USA and China is needed. f. Cowork with Molex international teams: Wavelength management, Connectivity/CPO, Opto-E/Photonic IC team 2. REQUIREMENT: a. >3 yrs working experience in optical industry. b. Familiar with ZEMAX software and tolerance analysis c. Hands on ability with accurate optical alignment experience. d. Cowork experience with Mechanical and production team. e. English communication ability and Mandarin communication ability. 3. PREFERRED: a. Laser design experience: laser beam modeling experience, POP experience. b. Accurate laser adjustment on optical table experience. c. Optical communication related product experience. d. Familiar with optoelectronics 4. NOTE: Training opportunity in USA
應徵
10/01
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
台北市信義區8年以上大學
PRIMARY PURPOSE: We are seeking individuals who are proactive, humble, unafraid of learning new things, and have the potential for growth. The R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. You are responsible for designing and optimizing a product or create valuable or quality of product that will scale with Molex continued growth. As a Product Design Engineer, you will design and evaluate product, identify product requirements and contribute to research and project planning. DUTIES AND RESPONSIBILITIES: 1. Apply design, engineering, and technical expertise to influence cross-functionally and deliver reliable mass production components and solve time-sensitive problems. 2. Make significant contributions to design, development, and validation of different solutions (Specifically focused on the cooling solution for the cage and the design of the connectors.) 3. Manage the product design, provide guidance to team members, and communicate progress, and request feedback to prevent/remove roadblocks. 4. Anticipate and address product design issues or risks, analyze data, and validate product design to suggest or implement design improvements. 5. Conducts feasibility studies for new projects leveraging existing designs while also generating new designs and IP, drives consistency and thoroughness across portfolio. EDUCATION Required: Bachelor’s degree in mechanical engineering, Process Engineering, Manufacturing Engineering or equivalent practical experience. Required Experience and Skills:  8~10+ of work experience as a hands-on engineer.  Possesses thorough understanding of the product development process (Design Concept, EVT, DVT, PVT).  Demonstrated experience working with cross functional teams in English.  Engineering Design Software: NX (preferred), Creo, Pro/E, etc.  Knowledge in molding of different kind of materials, stamping, assembly process, product development process.  Ability to independently complete design and manage projects.  Understand thermal and mechanical of liquid cooling system.  Good problem-solving skill and able to deeply analyze testing failure mode.  Tolerance stack-up Analysis, review thermal, and reliability testing report. Desirable Requirements:  Experience in server or switch liquid cooling systems.  Experience in the high-speed connector industry.  Relevant knowledge of seal product design.  Experience with simulation or performance analysis of liquid cooling thermal solutions, precision machining, brazing (furnace, vacuum), molding (plastic & metal), soldering, stamping/assy, welding or sintering processes.  Passionate about design work and innovation, creating new products to address gaps in the industry.
應徵
08/27
新竹縣竹北市3年以上碩士以上
UltraSense Systems, headquartered in Silicon Valley, is revolutionizing human-machine interfaces (HMI) through its cutting-edge SmartSurface technology. Our InPlane Sensing platform seamlessly integrates touch, lighting, and haptic feedback into everyday surfaces, delivering intuitive, responsive, and premium user experiences across automotive, consumer electronics, and other industries. Join our mission to create the next generation of smart, touch-sensitive surfaces that are both functional and aesthetically superior. Summary UltraSense Systems is seeking a creative Senior Engineer, Ultrasound Algorithm Development to help develop the prototype of a groundbreaking new product. In this role, you'll collaborate with a high-caliber team to design and build devices that break new ground in the industry. This role involves hands-on algorithm development, acoustic signal processing, and system development. Key Responsibilities .Lead design, development, and prototyping of ultrasound sensor systems—from concept through testing and iteration (inspired by Xwave Innovations roles) .Develop, implement, and optimize acoustic signal processing algorithms, including beamforming (phased array/delayandsum), synthetic aperture techniques, and advanced array processing .Write clean, efficient, well-documented Python code for simulation, modeling, and real-time signal acquisition/processing .Build and integrate prototype hardware and firmware components (e.g., piezoelectric transducer interfacing, digitizers, array electronics) .Conduct simulations, modeling (e.g., FEA or acoustic propagation), and validation testing; iterate to improve system performance .Analyze sensor data, benchmark performance metrics, debug acoustics chain (from raw signals to processed outputs), and refine algorithms and hardware accordingly .Collaborate with cross-functional teams—mechanical, electrical, software—to define system requirements and drive integrative design (common across R&D roles) Minimum Requirements .Degree: M.S. or Ph.D. in Electrical Engineering, Acoustics, Computer Science, Applied Physics, or a related field .Hands-on experience (3–5+ years) in acoustic/ultrasound signal processing or sensor systems, including beamforming and array processing (phased arrays, delay-and-sum, synthetic aperture, etc.) .Strong proficiency in Python for algorithm development, data analysis, and simulation (e.g., with NumPy, SciPy, MATLAB not essential but a plus) .Practical experience with prototyping hardware—working with transducers, pulser/receiver logic, data acquisition systems, or similar instrument interfacing .Solid understanding of acoustic wave propagation, ultrasound physics, signal-to-noise enhancement techniques, and array signal processing principles .Excellent communication, writing, and documentation skills; ability to draft technical reports, collaborate with teams, and present findings clearly (noted across industry postings) Desired Requirements .Ph.D. in relevant field, with a proven R&D track record, including publications, patents, or conference papers .Experience with FEA modeling or acoustic simulation tools, especially for transducer design or wave propagation analysis .Background in device fabrication, CAD design, or microelectronic processing (e.g., GDS patterning) is a plus .Familiarity with synthetic aperture ultrasound techniques or advanced imaging methods .Experience developing adaptive or data-driven beamforming (e.g., deep learningenabled approaches for ultrasound) .Proficiency in embedded platforms or real-time firmware, including porting signal processing algorithms into C/C++ or FPGA/ASIC environments .Proven ability in small R&D environments—self-motivated, resourceful, and highly collaborative .Comfortable working in a fast-paced, cross-functional environment .Creative thinker with a passion for tackling unfamiliar challenges .Eagerness to contribute to early-stage product innovation and development
應徵
09/29
賽輪思股份有限公司電腦軟體服務業
台北市內湖區10年以上碩士
CerenceAI China RD is seeking a Research Engineer to design and implement the next-generation text-to-speech systems and applications. In this role, with members in globe, you will work both frontend (Grapheme-to-phoneme, Text Normalization, phrasing and prosodic control, etc) and backend (acoustic modeling, neural vocoding) components of engine pipelines and end-2-end system for major languages and dialects. Your work will directly impact CerenceAI products ranging from voice assistants to accessibility tools, delivering natural, expressive, and multilingual speech synthesis. Job Description Representative responsibilities/duties will include but not limited to: • Design and optimize text/NLP preprocessing pipelines with Deep Learning or Machine Learning methods, including Grapheme-to-phoneme (G2P) conversion for multilingual support; Text normalization; polyphone disambiguation; Prosody prediction and control • Integrate language models (e.g., BERT, GPT variants) to improve contextual and semantic understanding for natural intonation • Develop rule-based and neural solutions for emotion/style control in synthesized speech • Build state-of-the-art acoustic models (e.g., Tacotron, FastSpeech, VITS) to map linguistic features to spectrograms or waveform parameters. • Optimize neural vocoders (e.g., WaveNet, HiFi-GAN, MelGAN, LPCNet) for high-fidelity, real-time speech synthesis • Optimize inference latencies for both edge devices and cloud platforms • Enhance robustness through noise suppression, speaker adaptation, and multilingual/cross-language/cross -gender voice cloning Knowledge, skills, and qualifications Education: Master in CS, AI, EE, Math, or related field. Required/preferred skills: • hands-on experience in speech generative system development with deep expertise in both frontend and backend components • Proficiency in C/C++ and Python, with mastery of ML frameworks (PyTorch, TensorFlow, etc) • Some background in NLP techniques and/or speech signal processing is welcome • Knowledge on transformer-based language models for prosody prediction • Basic understanding of autoregressive / non-autoregressive acoustic models and neural vocoders • Experience in optimizing models via quantization, pruning, or knowledge distillation • Experience with ONNX Runtime, TensorRT, or TorchScript, etc • Experience with zero-shot/one-shot/few-shot voice cloning or emotional TTS systems • Skilled GPU/TPU cluster and grid user • Fluent English is a must-have
應徵
10/01
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新北市三重區8年以上大學
Your Job Molex is seeking a Senior Mechanical Engineer to join our RF segment. In this role the successful candidate will be part of a world-class engineering team, contributing to the development of the RF connector and RF cable assembly. The successful candidate will be responsible for designing, implementing, and validating RF products that ensure the functionality, performance, and reliability of our RF product. The Senior Mechanical Engineer will use the lab. equipment, and hardware/software integration while collaborating closely with global, cross-functional teams to develop high-performance product solutions. Our Team - RF Product design What You Will Do - Create new products and modify old product based on customer request. - Work with QA and manufacturing engineers to solve quality issues - Perform EWR because of manufacturing improvement, functioning improvement, design change, and so on . - Work with manufacturing engineers to proceed cost reduction actions - Provides technical support to customers, suppliers, and inside product marketing personnel. - Support product test by coordinating with reliability lab (write test request, gather test sample, board etc. Who You Are (Basic Qualifications) - Bachelor’s degree in Mechanical engineering, or related field - 5+ years of experience in RF connector or general connector – components and assemblies. - Good verbal and written communication skills that demonstrate the ability to express complex technical concepts clearly and concisely –Mandarin and English. - Good interpersonal skills to work effectively with others and in a team. - Travel will be required as necessary. - Proficiency in solid modeling experience to generate 3D models & 2D drawings as well as Microsoft Word, Excel, and power point .
應徵
09/18
新竹縣竹北市3年以上大學
UltraSense Systems is looking for strong Mechanical & Simulation Engineer. Main responsibilities include integrating UltraSense HMI products across multiple applications from mobile to automotive to IoT and involved in the entire development process from initial concept through manufacturing. Major Responsibilities 1. In charge of product designs of consumer electronics, automotive, and appliances and involved in the entire development process from initial concept through manufacturing 2. Assess/analyze the mechanical structure and new piezoelectrical sensor with commercial finite element software and optimize sensor performance by the simulation result. 3. Provide detail design recommendations to the Product Design teams based on Finite Element Analysis (FEA) results, contributing to the product design and sensor performance assessment. 4. Aim at improving user experience through well-executed design with our sensor interface and build Mockup in practices 5. Cooperate with cross-functional teams for innovative solutions, inclusive of Mechanical Engineering, Optimizing Sensor Design and Issue-resolving Design Minimum Qualifications Master's degree or above in science or technical discipline with a minimum of 3 years of mechanical design/simulation experience 1. Proficient with commercial finite element software, mainly ABAQUS; can build meshes for thermal and structural simulations. Other fields are pluses. 2. Computing expertise in one or more of the following areas: FEM tools, programming language (python, MATLAB, C, Fortran, etc.), PDE solving methodology and technics. 3. Familiar with system/product level characterization and material testing 4. Strong conceptualization and creative problem-solving skills, strong mechanical aptitude, and basic understanding of stress-strain 5. Must be effectively bilingual in Mandarin and English; excellent written and spoken communication skills are required.
應徵
09/30
台北市南港區3年以上大學
Immersive Optics System Engineer / AR VR Engineer ⭐有機會達到百萬年薪!歡迎對外商感興趣的你,保障年薪13.5個月⭐ Responsibilities: Provides expert knowledge regarding the selection, evaluation, qualification and procurement of visual system in different varieties of display size applications. Collaborates and communicates with internal and outsourced development partners about design requirements, regulatory requirements, and user needs. Participates as a member of project team of other engineers, Program Managers, and internal and outsourced development partners to develop reliable, cost effective and high-quality solutions for the immersive visual system products. Experience on NPI and manufacture process. Familiar with display industry production. EE experience to bring up the display system (including MIPI / Vx1 / eDP etc…). To review the EE design with supplier and system designer. Knowledge of HDMI and DP. Education and Experience Required: MS in Display Engineering, Materials Science, Optical Engineering, Physics or related field and/or equivalent experience. Typically 5+ years experience, with 3+ years at related field. Knowledge and Skills: Solid knowledge in different form factor product. Such as VR/AR, Monitor, TV, AIO etc. Display design (Array / FEOL / BEOL) and quality control Display system hardware design. Basic knowledge of Geometrical optics and Optical imagery. Camera ALS / Proximity Sensor Depth sensing (Structure light/TOF) Good communication skills in English and Mandarin with ability to work under pressure. Proven track of record on development and implementation of innovative LCD, AMOLED, or other display solutions for consumer electronics. Experience with at least one of the focus areas of visual system technology below: -VR display system (Panel + Lens) -Video passthrough system (Dual camera + ISP) -AIO touch monitor system -IWB system -SLAM system (camera + sensor fusion)
應徵
10/01
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新竹市5年以上大學以上
Your Job Molex is seeking an experienced semiconductor test equipment engineering guy. Prior experience with PIC testing hardware equipment is preferred. Upon acceptance, the candidate will undergo at least one month of training at a machine manufacturer in Suzhou, China. Then, work closely with the machine manufacturer to ship the equipment to our key OSAT site in Taiwan and smoothly implement it into mass production. Our Team Our team: The PIC device CM Management team in Taiwan focuses on external suppliers and subcontractors’ production tasks management. It must work closely with other operation teams at multiple-locations, such as: Zhu-Hai What You Will Do (Job Description) 1. This candidate will be stationed at Molex’s key OSAT site for supporting the mass production and engineering run. 2. At least 5 years of experience in operating and maintaining for wafer bumping testing hardware equipment. Such as prober, testing measurement equipment, ATE, handler…, with the AOI experience is a plus. 3. Experience with cantilever and vertical prober card setup is absolutely necessary! 4. Understand the principles and methods of PIC electrical and optical testing. 5. Collaborate with OSAT site engineering departments to resolve any abnormal issues for smooth, qualified, and high-volume production. 6. Product engineering tasks online support: Participate in new product introduction (NPI), machine setup and fixture replacement, and work closely with the Molex internal RD team to complete key preparations. 7. Abnormal recording and improvement tracking. Assist in recording production abnormalities and participate in subsequent tracking and improvement to achieve continuous optimization. 8. Low yield and error log analysis (overkill/underkill or other issues…): Preliminary analysis of test data and abnormal records to help identify the root cause of the problem and report abnormal conditions to Molex Hsin-Chu site. Who You Are (Basic Qualifications) 1. Experience in testing houses is preferred. 2. Bachelor’s degree above and 5+ years of experience in operating and maintaining for wafer bumping testing hardware equipment. Such as prober, testing measurement equipment, ATE, handler…, with the AOI experience is a plus. What Will Put You Ahead • Ability to learn quickly and prioritize appropriately to meet company needs. • Detail-oriented, self-motivated and able to respond quickly to a fast moving and changing environment. • Strong skills in bugs analysis and troubleshooting • The candidate must support the holiday on-call, not often! • Sometimes you must be under pressure to meet urgent shipment demands or complete important tasks. At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate’s knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy. Who We Are As a Koch company, Molex is a leading supplier of connectors and interconnect components, driving innovation in electronics and supporting industries from automotive to health care and consumer to data communications. The thousands of innovators who work for Molex have made us a global electronics leader. Our experienced people, groundbreaking products and leading-edge technologies help us deliver a wider array of solutions to more markets than ever before. At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company.
應徵
09/30
新竹縣竹北市10年以上大學
1. 負責自動化部門整體運作,管理研發團隊完成專案開發及交付。 2. 負責定期review各專案進度,分配適當研發資源滿足客戶交付時程。 3. 負責梳理各項核心技術與新技術調研,定期輸出技術開發road map。 4. 負責各項研發專利研擬與輸出。
應徵
10/01
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新北市三重區5年以上大學以上
Molex is seeking a motivated and self-driven Technical Project Manager (TPM) to lead and manage projects serving clients in the medical and/or automotive industry. This TPM will interface directly with clients to provide overall project updates. TPM is responsible for leading high profile, customer-driven, regulated industry new product introduction projects to successful commercialization. Using the Molex Product Development Process methodology, the TPM facilitates the global cross functional project teams throughout the project life cycle. The project life cycle encompasses the Project Preparation, Proposal Development, Product Development Plan, Preliminary Design Completion, Final Design Completion, Production Process Development, Product and Process Qualification, Issue Tracking, Production Safe Launch. What You Will Do In Your Role · Lead cross-functional teams to deploy the related activities and deliver new products launched on time and on budget. Ensure that these teams achieve all customer and company requirements including quality, cost, delivery, product performance and customer satisfaction · Perform the Project Management function: Manage project change control and decision documentation. Efficiently track and manage engineering changes and validation status. · Continuously conduct risk assessments of strategic, technical, finance and business factors impacting the plan and drive corrective actions to mitigate deviations to the project plan. · Perform Risk Management to protect the Project Plan. Work with the product development team to identify potential risks to planning execution and appropriate Mitigation or Contingency Plans. Get management support for proactive activities or escalating project issues to meet the Project Plan · Demonstrating proactive problem-solving by identifying potential issues early and delegating them to appropriate team members for swift resolution · Provide oversight into assigned projects including scheduling, assignment of work, and reviews of project efforts to ensure that the project meets the technical and process specifications. · Proactively identify, document, and execute risk reduction activities to minimize Project Risks associated with Cost, Quality, and/or Timing that could negatively affect Project Plan achievement. · Development of the detailed cross functional project coordination plans, including the use of RACI charts or similar tool · Compile project status reports regularly and present to leadership to track critical project KPIs and identify internal and external factors jeopardizing the project. · Escalate issues and recommended solutions using the escalation process. · Lead and mentor team members in project management principles, PDP processes, risk management, issue resolution, decision making, etc. · Co-leading the Request for Quotation (RFQ) process and spearheading RFQ package preparation
應徵
09/12
台灣德聯高科股份有限公司印刷電路板製造業(PCB)
桃園市觀音區經歷不拘碩士以上
THE ROLE The Lead Signal Integrity Engineer is a technical leader responsible for advancing Isola’s laminate materials to meet and exceed high-speed electrical and signal integrity (SI) performance requirements. This role provides mentorship and direction to the Signal Integrity team in Taiwan, drives innovation in SI test methodologies, and ensures strong technical engagement with global OEMs. The Lead serves as a recognized authority in SI, bridging customer needs with material performance and representing Isola in the high-performance electronics community. KEY RESPONSIBILITIES: Customer-Facing Technical Support: • Lead technical engagement with OEMs and direct customers on high-speed laminate characterization. • Act as primary technical contact for SI-related design validation and adoption cycles. • Oversee the creation of technical reports, white papers, and collateral for internal and external use. Strategic & Technical Leadership: • Define and develop advanced SI measurement, modeling, and simulation methodologies. • Collaborate with Product Management, R&D, and Sales to ensure alignment of SI capabilities with product strategy. • Represent Isola as a thought leader through publications, conferences, and industry forums. Organizational Management: • Mentor, guide, and grow the Taiwan-based Signal Integrity Engineering team. • Establish scalable, cost-effective SI test methods that accelerate R&D and customer response. • Drive alignment with global Application Engineering teams to ensure best-in-class technical service. Technology & Standards Thought Leadership: • Maintain expertise in SI methods, PCB processing effects, and high-speed digital design requirements. • Contribute to industry standards development and support customer forums on SI requirements. QUALIFICATIONS & EXPERIENCE • 8+ years of experience in signal integrity engineering, PCB laminates, or high-speed design. • Expertise in VNA measurements, probing techniques, and advanced SI methodologies. • Experience with PCB manufacturing and processing effects on SI performance. • Demonstrated leadership and mentoring experience. • Proven record of technical publications, white papers, or conference presentations. EDUCATION • PhD or Master’s in Electrical Engineering or related field required. OTHER CONSIDERATIONS • Fluent in English – required for global communication and technical documentation. • Proficiency in Mandarin Chinese – strongly preferred for engagement with Taiwan/China teams and customers. • Ability to travel regionally and globally as needed.
應徵
10/01
瑞利光智能股份有限公司其他半導體相關業
新竹市經歷不拘大學以上
【職位描述】 RVI公司新創的光通訊引擎(Optical Engine)封裝製程開發。負責設計、開發、製程整合、測試先進封裝光模組,涵蓋矽中介層、玻璃中介層、光學器件製程整合、與高階基板。負責從概念到生產的封裝製程設計,製程整合、光源系統封裝、與光引擎品質和性能研究。 【主要職責】 1.負責矽光子產品的光引擎光學結構設計、熱管理、光電轉換、封裝製程整合。 2.協作電路模擬、光學模擬、設計,以及晶片與光學元件的選擇與驗證。 3.與上游廠商討論光引擎電子元件規格、光學元件規格,並提供封裝技術建議。 4.協助完成矽光子光引擎樣品的製作,確保產品符合設計要求並達到高品質標準。 Position Description: Join RVI's innovative Optical Engine development team, focusing on advanced packaging processes for next-generation optical communication engines. This role involves the design, development, process integration, and testing of advanced optical modules, including silicon interposers, glass interposers, optical component integration, and high-end substrates. The engineer will lead packaging process design from concept to production, ensuring system-level performance, thermal and optical optimization, and overall product quality. Key Responsibilities: 1.Lead the design and integration of optical engine packaging for silicon photonics products, including optical structure design, thermal management, optoelectronic conversion, and process integration. 2.Collaborate on electrical and optical simulation, design validation, and component selection for chips and optical elements. 3.Communicate with upstream vendors to define specifications for electronic and optical components, and provide packaging technology recommendations. 4.Assist in the prototyping and fabrication of silicon photonic optical engines, ensuring compliance with design specifications and achieving high product quality standards.
應徵
09/30
台北市信義區5年以上大學以上
1.負責WiFi, BT, NFC, LTE/5G及GPS無線通訊模組射頻部分原理圖、PCB佈局及設計. 2.負責射頻性能指標調試和測試,解決設計問題,具有足夠分析解決問題能力. 3.負責生產支援,能解決生產過程問題. 4.支援模組客戶, 對客戶問題能提出解決方案.
應徵
09/26
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新北市淡水區3年以上大學以上
Your Job Molex is seeking a motivated and self-driven Associate Engineer to help with our manufacturing team in the Taiwan Design Center located in Taipei, Taiwan. We are establishing a Proof of Concept (POC) Lab within our office to enhance our capacity for rapid sample making of high-speed cable products. We seek an Associate Engineer to assist in development activities and maintenance of the lab. Our Team Molex creates connections for life by enabling technologies that transform the future and improve lives. With a presence in more than 40 countries, Molex offers a complete range of connectivity products, services and solutions for the data communications, medical, industrial, automotive and consumer electronics industries. What You Will Do (Job Description) · Conduct raw material procurements for the prototype/sample build. · Build and manage an inventory of commonly used components and materials. · Execute sample builds for high-speed cable products. · Perform process verification to ensure quality and compliance with specifications. · Conduct failure analysis and troubleshooting to support continuous improvement. · Coordination and execution of assembly tooling and processes for build of cable connector products for the purpose of engineering validation. Who You Are (Basic Qualifications) · Bachelor’s degree in manufacturing, Mechanical or Industrial Engineering or equivalent, based on experience and training. · Experience with 2D and 3D CAD software What Will Put You Ahead · 1~2-year experience in a lab or manufacturing environment is a plus · Excellent problem-solving abilities and analytical skills. · Hands-on experience in tooling/fixture design, build and debug of assembly equipment.
應徵
09/30
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新北市淡水區2年以上專科
What You Will Do (Job Description) 1) Prepare shipping documents including bills of lading and shipping labels 2) Contact forwarder to book the flight and arrange shipment per requirement from stakeholders 3) Coordinate with Carriers and find the solution for trouble shooting 4) Monitor outgoing shipments and make sure shipment delivered per promised 5) Customer interaction: give the proposal to stakeholders and choose appropriate carrier to schedule and track shipments 6) Verify all shipping documents from carrier and make sure the charge per contract 7) Maintain all shipping related documents in system correctly and timely 8) Work in a team environment and contribute to a positive and productive workplace culture. Who You Are (Basic Qualifications) -Outbound experience 1 year -Familiar with export process -Been working in logistic service provider or custom broker is preferred -Understand trading term -Familiar with 3rd trading is preferred -Familiar with SAP is preferred -Fluent English is preferred At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate’s knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy. Who We Are As a Koch company, Molex is a leading supplier of connectors and interconnect components, driving innovation in electronics and supporting industries from automotive to health care and consumer to data communications. The thousands of innovators who work for Molex have made us a global electronics leader. Our experienced people, groundbreaking products and leading-edge technologies help us deliver a wider array of solutions to more markets than ever before. At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company.
應徵